• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.4
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• pp.67-72
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• 1989

Room Temperature Plasma Nitridation of silicon was investigated as a new LOCOS (local oxidation of silicon) process in order to reduce the bird's beak length. In $N_2$ plasma formed by 100kHz, 400W AC power, a thin silicon nitride film (<100${\AA}$) was uniformly grown on a silicon substrate. SEM studies showed that the nitride layer formed by this method can effectively protect the silicon from oxidation and reduce the bird's beak length to $0.2{mu}m$ when 4000${\AA}$ field oxide is grown. This is a considerable improvement comparing with 0.7${mu}m,$ the bird's beak, for the conventional LOCOS process using a thick LPCVD nitride. No appreciable crystalline defect could be found around the bird's beak with SEM cross-section afrer Secco etch. Leakage current tests were carried out on the $N^+/P^-$ well and $P^+/N^-$ well diodes formed by this new LOCOS process. The electrical tests indicate that this new process has electrical properties similar or superior to those of the conventional LOCOS process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.101-105
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• 2024

4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (R_on,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (D_it) at the SiO₂/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO₂/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N₂ diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N₂ gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO₂/4H-SiC interface, thereby reducing the D_it.

• Korean Journal of Materials Research
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• v.15 no.10
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• pp.662-666
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• 2005

Solid solutions of $(Zr/Ti)O_2$ were prepared in powder form by the coprecipitation technique. After mixing with carbon or exposing to nitrogen gas at elevated temperature, titanium cations selectively diffused out from the oxide compound to form titanium carbide (TiC) or titanium nitride (TiN), respectively. TiN formed strong interfacial contacts between the oxide grains. In contrast, TiC formed as small crystallites on oxide grains but did not bind the matrix grains together. TiN therefore played a role in strengthening the interparticle bonding, but TiC weakened the bonding between grains. Partial diffusion of titanium cations also led to nanolayered structure being formed between the oxide grains, which provided weak interfacial layers that fractured in a step-wise fashion.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1997.10a
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• pp.149-154
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• 1997

광소자 및 새로운 개념의 전력소자 응용을 위하여 Wide Bandgap 반도체에 대한 관심이 급증되고 있다. 특히 직접천이형인 GaN는 청색 발광소자 응용 및 고출력, 고주파용 전력소자 응용에 이상적인 전자물성을 갖고 있다. 따라서 본 연구에서는 GaCl$_3$와 NH$_3$를 source gas로 하는 CVPE법을 사용하여 (0001) sapphire와 비교하였다. 기판의 증착온도 104$0^{\circ}C$에서 source gas의 III/V flow rate를 2로 분석하여 45분간 성장시킨 경우 그 증착속도는 약 40 $\mu\textrm{m}$/hr 정도였으며, 이 때 XRD을 향상시키기 위하여 증착이전에 기판의 표면에 증착온도에서 NH$_3$를 이용한 nitridation 처리를 하였으며, 그 처리시간이 3분일 때 XRD의 FWHM 특성이 가하여 조사한 결과 363 nm에서 peak가 검출되었다. 본 연구에서는 양질의 GaN 박막성장을 위한 증착조건 인자중 source gas의 flow rate가 가장 중요한 변수임을 적정 온도 범위가 75$0^{\circ}C$ 근처로 조사되었다. 실험과 모사결과의 박막 증착 최적온도의 차이는 GaN 증착시의 반응 Kinetics가 느리기 때문인 것으로 해석된다.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.20-23
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• 2000

We have investigated a process for the preparation of high-quality tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$) via the N $H_3$ annealing of 7$_{a2}$ $O_{5}$, for use in gate dielectric applications. Compared with tantalum oxide (7$_{a2}$ $O_{5}$), a significant improvement in the dielectric constant was obtained by the N $H_3$ treatment. In addition, light reoxidation in a wet ambient at 45$0^{\circ}C$ resulted in a significantly reduced leakage current. We confirmed nitrogen incorporation in the tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$ by Auger Electron Spectroscopy. By optimizing the nitridation and reoxidation process, we obtained an equivalent oxide thickness as thin as 1.6nm and a leakage current of less than 10mA/$\textrm{cm}^2$ at 1.5V..5V..5V..5V..5V..5V.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.9
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• pp.1614-1618
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• 2007

We have demonstrated the experimental results to obtain the immunity of FN (Fowler Nordheim) stress for S-RCAT (Spherical-Recess Cell Array Transistor) which has been employed to meet the requirements of data retention time and propagation delay time for sub-100-nm mobile DRAM (Dynamic Random Access Memory). Despite of the same S-RCAT structure, the immunity of FN stress of S-RCAT depends on the process condition of gate oxidation. The S-RCAT using DPN (decoupled plasma nitridation) process showed the different degradation of device properties after FN stress. This paper gives the mechanism of FN-stress degradation of S-RCAT and introduces the improved process to suppress the FN-stress degradation of mobile DRAM.

• Journal of the Korean Ceramic Society
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• v.29 no.7
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• pp.551-557
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• 1992

X-ray diffraction patterns, IR spectra and zeta-potentials of silicon nitride and $\beta$-Sialon powders were investigated before and after surface manipulations. $\beta$-Sialon powder was produced from Hadong Kaolin by the carbothermic reduction and simulataneous nitridation. Isoelectric points of as-prepared Si3N4 and $\beta$-Sialon powders were 8.4 and 7.4, respectively. After both silicon nitride and $\beta$-Sialon powders were oxidized at 80$0^{\circ}C$ for 24 h in air, the isoelectric points of these powders corresponded to that of silica (pH=3). I case of the addition of Darvan C as deflocculant, its isoelectric point was 3 and zeta-potential was nearly constant in the range of pH 5~12. When SN 7347 was used as deflocculant, its isoelectric point was 8.3 and zeta-potential over -156 mV was measured above pH 11.

• Journal of the Korean Ceramic Society
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• v.25 no.4
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• pp.415-423
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• 1988

Mixtures of carbon and silica (about 0.46${\mu}{\textrm}{m}$) which was synthesized by the hydrolysis of ethyl silicate, the molar ratio of silica/carbon was fixed as 1/10(weight ratio : 1/2), were nitrided in the temperature range 135$0^{\circ}C$~150$0^{\circ}C$. The phse of the product Si3N4 was $\alpha$ phase and the morphology was hexagnoal prism and the nitridation reaction was completed in 5 hrs at 150$0^{\circ}C$ or 7hrs at 145$0^{\circ}C$. The reaction rate above 150$0^{\circ}C$ was diffusion-controlled, following Jander equation. Activation energy Q was derived from the Arrhenius plot and the value was about 101kcal/mol. Axis ratio of Lattice constants(c/a) was 0.726 and unit volume was $\AA$3, the larger the molar ratio of carbon/Alkoxide was, the smaller the particle size of $\alpha$Si3N4 was.

• Journal of the Korean Ceramic Society
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• v.24 no.4
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• pp.349-356
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• 1987

${\beta}$-Sialon powder was synthesized by the simultaneous reduction and nitridation of Hadong kaolin at 1350$^{\circ}C$ in N2-H2 atmosphere, using graphite as a reducing agent. The synthesized ${\beta}$-Sialon powder was pressurelessly sintered over 1450-1850$^{\circ}C$ in nitrogen atmosphere. The average particle size of ${\beta}$-Sialon powder was about 4.5$\mu\textrm{m}$. The relative density, M.O.R., fracture toughness and micro-hardness of ${\beta}$-Sialon ceramics sintered at 1800$^{\circ}C$ for 1 hour were 92%, 36 kpsi, 2.8MN/㎥/2 and 13.3 GN/㎡, respectively. The critical temperature difference (ΔT) in water quench thermal shock behavior showed about 375$^{\circ}C$ for the synthesized ${\beta}$-Sialon ceramics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.48-51
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• 1995

We have developed the three dimensional mesh generator for three dimensional process simulation using the FEM(Finite Element Method). Tetrahedron element construct the presented three dimensional mesh, which is suitable for the simulation of three dimensional behavior of the LOCOS. The simulation of thermal oxidation is one of the problem in scale downed semiconductor processes. As three dimensional simulators use the huge size of the memory, we use the efficient method that generates the new nodes inside the growing oxide and removes the nodes nearby the SiO2/Si interface in silicon. The resented three dimensional mesh generator was designed to be used in various process simulations, for instance thermal oxidation, silicidation, nitridation, ion implantation, diffusion, and so on.