• 자원리싸이클링
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• 제16권1호
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• pp.59-67
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• 2007

실리콘 웨이퍼 제조공정 중 발생되는 초산, 질산 및 불산을 함유한 3성분계 폐혼산으로부터 개별산으로 분리하여 재활용할 목적으로 용매추출법을 적용하였다. 각 산의 분리를 위해 사용한 추출제로는 초산의 경우는 EHA(2-Ethylhexlalcohol)를 사용하였고, 질산과 불산의 경우에는 TBP(Tri-butylphosphate)를 사용하여 각 산의 분리과정에 대한 공정설계를 위한 기초 data를 얻고자 하였다. 3성분계 폐혼산에서 초산을 추출 분리하고 이후 추출여액 중 질산 및 불산을 순차적으로 추출 분리 할 수 있는 연속공정개발을 위하여 기초 실험 자료와 McCabe-Thiele해석을 통해 최적 투입유량비(O/A), 소요단수(Stage) 등을 결정하였다. 분석 결과 혼산으로부터 초산의 회수율은 90%이상 이었으며 초산 추출여액에서 질산의 회수율은 90%, 최종 추출잔류액에서 불산의 회수율은 67%이상 이었다.

• 자원리싸이클링
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• 제2권4호
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• pp.1-9
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• 1993

컬럼시기 연속추출장치에 의해 산세폐액으로부터 질산 및 불산을 정제산으로 회수하기 위한 연속실험을 행하였다. 먼저 컬럼식 연속추출장치에 의한 조업시 조업특성을 살펴보면 Pulse Velocity(AxF)가 증가함에 따라 추출율 및 탈거율이 증가하고 잇으나 AxF가 임계치 이상으로 증가하게 되면 수상과 유기상의 강력한 혼합에 의해 분리층이 형성되지 못하고 컬럼전체가 혼합형태가 되어, 효율이 낮아지고 HETS가 길어지게 된다. 또 총유량에 있어 너무 느리게 디면 Backmixing 효과가 나타나게 되고, 반대로 총유량이 매우 빠르게 되면 수상과 유기상의 접촉시간이 불충분하여 효율이 떨어지게 된다. 산세폐액을 컬럼식 연속추출장치로 처리할 경우 추출시에는 70% TBP를 사용하여 상비 A/O=1/2에서 추출하고, 증류수로 상비 1에서 탈거하면 질산 및 불산의 최종회수율은 각각 90.7% 및 75%정도이고 정제산 중 질산농도는 102g/$\ulcorner$ 그리고 불산은 8.8g/$\ulcorner$정도가 된다.

• 한국자원리싸이클링학회:학술대회논문집
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• 한국자원리싸이클링학회 2006년도 춘계임시총회 및 제27회 학술발표대회
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• pp.47-55
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• 2006

실리콘웨이퍼 제조공정에서 발생되는 초산, 불산 및 질산을 함유한 3성분계 폐혼산으로부터 각 산을 분리하여 무기산으로 재활용하기 위하여 용매추출법을 적용하였다. 이러한 산을 선택적으로 분리하기 위해 추출제로 초산의 경우는 EHA(2-Ethylhexlalcohol)를 사용 하였으며 질산과 불산의 경우에는 TBP(Tri -butlyphosphate)를 사용하여 추출과정과 탈거과정에 대한 공정설계를 위한 기초 실험을 실시하였다. 3성분계 페혼산에서 먼저 초산을 추출 분리하고, 추출여액중 질산 및 불산을 순차적으로 연속 분리 할 수 있는 공정개발을 위하여 McCabe-Thiele해석을 통해 최적 투입유량비(O/A), 소요단수(Stage) 등을 결정하였다. 분석 결과 혼산으로부터 초산의 회수율은 90%이상 이었으며 초산추출여액에서 질산의 회수율은 90%이상, 최종 추출잔류액에서 불산의 회수율은 67%이상 이었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.259-263
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• 2001

There are several steps such as slicing, lapping, chemical etching and mechanical polishing in the silicon wafer production process. The chemical etching step is necessary to remove damaged layer caused In the slicing and lapping steps. The typical etching liquor is the acid mixture comprising nitric acid, acetic acid and hydrofluoric acid. At present, the waste acid is treated by a neutralization method with a high alkali cost and balky solid residue. A solvent extraction method is applicable to separate and recover each acid. Acetic acid is first separated from the waste liquor using 2-ethlyhexyl alcohols as an extractant. Then, nitric acid is recovered using TBP(Tri-butyl phosphate) as an extractant. Finally hydrofluoric acid is separated with the TBP solvent extraction. The expected recovered acids in this process are 2㏖/l acetic acid, 6㏖/1 nitric acid and 6㏖/l hydrofluoric acid. The yields of this process are almost 100% for acetic acid and nitric acid. On the other hand, it is important to recover and reuse the metal values contained in various industrial wastes in a viewpoint of environmental preservation. Most of industrial products are made through the processes to separate impurities in raw materials, solid and liquid wastes being necessarily discharged as industrial wastes. Chemical methods such as solvent extraction, ion exchange and membrane, and physical methods such as heavy media separation, magnetic separation and electrostatic separation are considered as the methods for separation and recovery of the metal values from the wastes. Some examples of the application of solvent extraction to the treatment of wastes such as Ni-Co alloy scrap, Sm-Co alloy scrap, fly ash and flue dust, and liquid wastes such as plating solution, the rinse solution, etching solution and pickling solution are introduced.

• 한국지하수토양환경학회지:지하수토양환경
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• 제19권6호
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• pp.6-12
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• 2014

We reviewed literature focusing on the amounts of domestic production, distribution, and consumption of strong acids and their spill cases. In particular, we investigated the chemistry and toxicity of four strong acids classified as "accident preparedness substances," including hydrochloric, nitric, sulfuric, and hydrofluoric acid. We recommend sulfuric and hydrofluoric acid as the chemicals of priority control based on the amounts used and toxicity. An advanced prevention/response system needs to be established along with an improved human and social infrastructure to prevent and efficiently respond to chemical accidents. Understanding the behavior and transport of spilled strong acids in the soil and groundwater environments requires a multi-disciplinary approach since they go through a variety of chemical and biogeochemical reactions with complex geomedia. However, no such research has been done in this area in Korea to the best of our knowledge. We expect the results of this study to contribute as basic data to future research.

• 자원리싸이클링
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• 제20권1호
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• pp.61-68
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• 2011

산세척을 통해 금속급 실리콘을 정련하기 위해 황산, 질산, 염산과 불산의 혼산 용액을 사용하여 $50^{\circ}C$에서 불순물의 제거 거동을 조사하였다. 금속급 실리콘에 함유된 불순물중 붕소는 산세척으로 제거되지 않았고, 농축효과로 인해 처리 후 농도가 종가하였다. 본 실험범위에서 인은 약 60% 정도 제거되었다. 황산과 질산용액으로 처리시 주요 불순 금속의 제거율은 50% 미만으로 정련 효과가 크지 않았다. 염산과 불산의 혼산으로 산세척하면 주요 불순 금속이 90% 정도 제거되었다. 각 산세척조건에서 얻은 실리콘의 순도와 주요 불순 금속들의 제거율에 대한 자료를 제시하였다.

• 자원리싸이클링
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• 제1권1호
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• pp.23-28
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• 1992

용매추출법을 이용하여 스텐레스 산세폐액으로부터 산과 니켈 및 크롬 등의 유가금속을 효과적으로 회수하기 위한 처리공정을 개발하고자 하였다. 현재까지 일본, 스웨덴 및 캐나다 등에서 이와같은 폐산을 처리하기 위한 몇가지 기술이 개발된 바 있으나 이들 방법은 대부분 산의 회수만을 주목적으로 한 것이기 때문에 폐산에 함유된 금속성분이 수산화물 스러지로 그대로 폐기되는 결점을 지니고 있다. 본 실험은 질산 및 불산과 함께 금속성분인 니켈과 크롬을 회수하여 정제산을 산세공정에 재상용하는 한편 처리과정에서 발생하는 스러지양을 최소한으로 줄이고자 하는 목적에서 시도되었다. 질산과 불산의 혼산은 TBP를 추출재로 사용한 용매추출에 의해 효과적으로 회수할 수 있었으며 여기에서 나온 폐액은 중화침전에 의해 철분을 제거한 다음 최종적으로 D2EHPA를 추출제로 사용하여 니켈과 크롬을 분리회수 할수 있었다.

• 한국태양에너지학회 논문집
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• 제33권5호
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• pp.24-33
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• 2013

Renewable energy industries, including sola cell plants, has been ever increasing ones for reducing fossil fuel consumption and strengthening national energy policy. In this paper we tried to identify occupational health hazards in solar cell-related industries operated in Korea. Poly silicon, silicon ingot and wafer, solar cell and module are major processes for producing solar cells. Poly silicon operations may cause hazards to workers from metal silicon, silanes, silicon, hydro fluoric acid and nitric acid. Solar cells could not be constructed without using metals such as aluminum and silver, acids such as hydrofluoric acid and nitric acid, bases such as sodium hydroxide and potassium hydroxide, and solvent and phosphorus chloride oxide. Workers in module assembly process may exposed to isopropanol, flux, solders that contain lead, tin and/or copper. To prevent occupational exposure to these hazards, it is essential to identify the hazards in each process and educate workers in industries with proper engineering and administrative control measures.

• 한국산업보건학회지
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• 제29권3호
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• 한국기계가공학회지
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• 제21권2호
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• pp.109-115
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• 2022

The demand for metal 3D printing technology is increasing in various industries. The materials commonly used for metal 3D printing include aluminum alloys, titanium alloys, and stainless steel. In particular, for applications in the aviation and defense industry, aluminum alloy 3D printing parts are being produced. To improve the corrosion resistance in the 3D printed aluminum alloy outputs, a post-treatment process, such as chromate coating, should be applied. However, powdered materials, such as AlSi7Mg and AlSi10Mg, used for 3D printing, have a high silicon content; therefore, a suitable pretreatment is required for chromate coating. In the desmut step of the pretreatment process, the chromate coating can be formed only when a smut composed of silicon compounds or oxides is effectively removed. In this study, suitable desmut solutions for 3D printed AlSi7Mg and AlSi10Mg materials with high silicon contents were presented, and the chromate coating properties were studied accordingly. The smut removal effect was confirmed using an aqueous desmut solution composed of sulfuric, nitric, and hydrofluoric acids. Thus, a chromate coating was successfully formed. The surfaces of the aluminum alloys after desmut and chromate coating were analyzed using SEM and EDS.