• 대한화학회지
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• 제37권12호
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• pp.1019-1024
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• 1993

상온에서 다결정 니켈 표면에서의 CO와 산소의 공동흡착을 XPS를 이용하여 연구하였다. 산소가 미리 흡착된 다결정 니켈 표면에서의 CO 흡착은 다음의 세 단계로 일어나고 있음을 발견하였다. 즉 초기의 낮은 CO 노출량에서는 니켈 표면에 미리 흡착된 산소와 CO가 일부 반응하여 $CO_2$가 형성되어 $CO_2$로 탈착하며, CO 노출량이 점차적으로 증가함에 따라 CO가 산소와 공동흡착을 일으키며, CO 노출량이 높아지면 미리 흡착된 산소의 양이 적을수록 더 많은 CO가 흡착됨을 관측하였다. 이것은 니켈 표면에 미리 존재하는 산소의 덮임율이 증가함에 따라 CO의 점차율이 감소하고 동시에 CO의 상대적인 흡착자리가 감소하기 때문으로 해석하였다. 한편 CO가 미리 흡착된 다결정 니켈 표면에 산소를 흡착시키면 산소 노출량이 낮을 때는 미리 흡착된 CO가 산소의 흡착을 저해하며, 산소 노출량이 증가하면 CO가 해리흡착되고, 이와 동시에 산소가 니켈 표면에서 해리흡착되어 NiO층을 빠른 속도로 형성함을 관측하였다. CO의 해리흡착은 흡착된 CO와 기체상의 $O_2$의 충돌에 의한 에너지 전이 때문인 것으로 해석된다.

• 대한화학회지
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• 제41권11호
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• pp.594-599
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• 1997

RF 스피터링법을 써서 $Li_{2x}Ni_{1-x}O$ 박막을 제조하였으며, 그 과정에서 기판의 온도$(50/230^{\circ}C)와$ 분위기 $(Ar/O_2)$를 변수로써 막의 미세구조를 조절하였다. 투과전자현미경을 이용한 막 구조 분석에 의해 낮은 기판 온도와 $O_2$ 조건에서 막의 조성입자가 작아짐을 관찰하였고, $50^{\circ}C/O_2$ 하에서 얻이진 $Li_{2x}Ni_{1-x}O$ 박막은 약 $80\AA$ 크기의 입자로 이루어져 있었다. 전기화학적 조건 하에서 $Li_{2x}Ni_{1-x}O$ 박막의 변색현상을 조사한 결과, 박막의 미세구조 발달에 의해 $Li^+$ 이온의 가역적 수용량이 증가하고, 결과적으로 전기변색 기능이 향상됨을 알 수 있엇다. 50 $^{\circ}C/O_2$ 하에서 얻어진 170 nm 두께의 $Li_{2x}Ni_{1-x}O$ 박막은 30 mC/$cm^2$의 $Li^+$ 이온 수용력과 함께 약 1.3의 흡광밀도(OD)를 나타내었다.

• 대한금속재료학회지
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• 제47권5호
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• 한국수소및신에너지학회논문집
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• 제29권5호
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• pp.434-441
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• 2018

The pore size of nickel (Ni) bottom electrode layer (BEL) for low-temperature solid oxide fuel cells embedded with ultrathin-film electrolyte was controlled by changing the substrate surface morphology and deposition process parameters. For ~150-nm-thick Ni BEL, the upper side of an anodic aluminum oxide (AAO) substrate with ~65-nm-sized pores provided ~1.7 times smaller pore size than the lower side of the AAO substrate. For ~100-nm-thick Ni BEL, the AAO substrate with ~45-nm-sized pores provided ~2.6 times smaller pore size than the AAO substrate with ~95-nm-sized pores, and the deposition pressure of ~4 mTorr provided ~1.3 times smaller pore size than that of ~48 mTorr. On the AAO substrate with ~65-nm-sized pores, the Ni BEL deposited for 400 seconds had ~2 times smaller pore size than the Ni BEL deposited for 100 seconds.

• 한국표면공학회지
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• 제19권3호
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• 대한치과교정학회지
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• 제51권4호
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• pp.270-281
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• 2021

Objective: The aim of this in vitro study was to evaluate the changes in friction between orthodontic brackets and archwires coated with aluminum oxide (Al₂O₃), titanium nitride (TiN), or chromium nitride (CrN). In addition, the resistance of the coatings to intraoral conditions was evaluated. Methods: Stainless steel canine brackets, 0.016-inch round nickel-titanium archwires, and 0.019 × 0.025-inch stainless steel archwires were coated with Al₂O₃, TiN, and CrN using radio frequency magnetron sputtering. The coated materials were examined using scanning electron microscopy, an X-ray diffractometer, atomic force microscopy, and surface profilometry. In addition, the samples were subjected to thermal cycling and in vitro brushing tests, and the effects of the simulated intraoral conditions on the coating structure were evaluated. Results: Coating of the metal bracket as well as nickel-titanium archwire with Al₂O₃ reduced the coefficients of friction (CoFs) for the bracket-archwire combination (p < 0.01). When the bracket and stainless steel archwire were coated with Al₂O₃ and TiN, the CoFs were significantly lower (0.207 and 0.372, respectively) than that recorded when this bracket-archwire combination was left uncoated (0.552; p < 0.01). The friction, thermal, and brushing tests did not deteriorate the overall quality of the Al₂O₃ coatings; however, some small areas of peeling were evident for the TiN coatings, whereas comparatively larger areas of peeling were observed for the CrN coatings. Conclusions: Our findings suggest that the CoFs for metal bracket-archwire combinations used in orthodontic treatment can be decreased by coating with Al₂O₃ and TiN thin films.

• 대한금속재료학회지
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• 제49권10호
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• pp.811-817
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• 2011

In this study, we have investigated the role of a metal oxide hole injection layer (HIL) between an Indium Tin Oxide (ITO) electrode and an organic hole transporting layer (HTL) in organic light emitting diodes (OLEDs). Nickel Oxide films were deposited at different deposition times of 0 to 60 seconds, thus leading to a thickness from 0 to 15 nm on ITO/glass substrates. To study the influence of NiO film thickness on the properties of OLEDs, the relationships between NiO/ITO morphology and surface properties have been studied by UV-visible spectroscopy measurements and AFM microscopy. The dependences of the I-V-L properties on the thickness of the NiO layers were examined. Comparing these with devices without an NiO buffer layer, turn-on voltage and luminance have been obviously improved by using the NiO buffer layer with a thickness smaller than 10 nm in OLEDs. Moreover, the efficiency of the device ITO/NiO (< 5 nm)/NPB/$Alq_3$/ LiF/Al has increased two times at the same operation voltage (8V). Insertion of a thin NiO layer between the ITO and HTL enhances the hole injection, which can increase the device efficiency and decrease the turn-on voltage, while also decreasing the interface roughness.

• 한국재료학회지
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• 제5권8호
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• pp.1013-1019
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• 1995

본 연구에서는 무전해 도금범으로 polyester film 상에 Co-Ni-P 박막을 석출시키고, pH, 온도 그리고 도금용액의 농도에 따른 도금속도 및 석출된 도금박막의 합금조성과 합금조성에 따른 자기적 특성을 고찰하였다. 무전해도금의 석출속도는 pH 8.5, 온도 90℃일때 가장 좋았으며, 자기적 특성도 이 때가 가장 좋았다. 합금조성은 pH와 착화제의 농도에 따라서는 크게 변화하였으나, 그 밖의 인자들에 의해서는 변화하지 않았다. 최적조건에서 만들어진 박막의 합금조성은 코발트가 78%, 니켈이 16%, 인이 6%였고, 보자력은 370 Oe, 각형비는 0.65였다. 박막은 합금조성에 따라 경질자성막과 연질자성막의 두가지 형태로 변화했고, 니켈이 30% 이상 공석(共席)되었을 때, 연질자성막으로 되었다. 연질자성막일때, 합금박막의 결정구조는 니켈이 강하게 배향된 비정질 형태를 나타냈고, 경질자성 막일때는, 코발트(101)과 (100)면으로 배향된 α-코발트의 hcp 결정구조를 나타내었다.

• 비파괴검사학회지
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• 제32권1호
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• pp.41-46
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• 2012

MEMS/NEMS 구조체의 개발과 응용기술의 발달로 박판 및 박막의 기계적 물성 평가에 대한 요구가 점차 늘어나고 있다. 기계적 물성은 주로 인장시험이나 초음파의 속도 측정으로 평가되어 왔으나, 박판/박막 구조의 경우 기존의 기술로는 측정에 한계가 있어 나노압입시험법, 유도초음파법 등의 새로운 기술이 개발되고 있다. 본 연구에서는 박판 구조의 금속재료의 탄성계수를 평가하기 위하여 EMAT으로 송수신된 박판내에서의 유도초음파 진행 속도를 측정하였으며, 이론적으로 계산된 유도초음파 군속도와 실험적인 군속도의 최적화 과정을 통해 최종적으로 박판의 탄성계수를 평가하였다. 두께 $50{\mu}m$의 니켈 박판에서 측정된 영률은 201.6 GPa이었으며, 나노압입시험법으로 측정된 207 GPa, 참고문헌의 203.7 GPa과 비교하면 약 3% 내에서 일치하는 결과이다.

• The Korean Journal of Ceramics
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• 제2권1호
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• pp.19-24
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• 1996

The phase distribution and interface chemistry by the solid-state reaction between SiC and nickel were studied at temperatures between $550 \;and\; 1250^{\circ}C$ for 0.5-100 h. The reaction with the formation of silicides and carbon was first observed above $650^{\circ}C$. At $750^{\circ}C$, as the reaction proceeded, the initially, formed $Ni_3Si_2$ layer was converted to $Ni_2$Si. The thin nickel film reacted completely with SiC after annealing at $950^{\circ}C$ for 2 h. The thermodynamically stable $Ni_2$Si is the only obsrved silicide in the reaction zone up to $1050^{\circ}C$. The formation of $Ni_2$Si layers with carbon precipitates alternated periodically with the carbon free layers. At temperatures between $950^{\circ}C$ and $1050^{\circ}C$, the typical layer sequences in the reaction zone is determined by quantitative microanalysis to be $SiC/Ni_2$$Si+C/Ni_2$$Si/Ni_2$$Si+C/…Ni_2$Si/Ni(Si)/Ni. The mechanism of the periodic band structure formation with the carbon precipitation behaviour was discussed in terms of reaction kinetics and thermodynamic considerations. The reaction kinetics is proposed to estimate the effective reaction constant from the parabolic growth of the reaction zone.