• Restorative Dentistry and Endodontics
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• 제43권2호
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• pp.15.1-15.7
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• 2018

Objectives: The present study aimed to evaluate the shaping ability of 2 thermally treated nickel-titanium reciprocating systems in simulated curved canals. Materials and Methods: Forty simulated canals were prepared to apical size 25 using Reciproc Blue R25 (VDW) and WaveOne Gold Primary (Dentsply Sirona) instruments. Standard pre- and post-preparation images were taken and superimposed. The removal of resin material was measured at 5 standard points: the canal orifice, halfway between the canal orifice and the beginning of the curve, the beginning of the curve, the apex of the curve, and the end-point of the simulated canal. The data were analysed using the independent sample t-test with a 5% significance threshold. Results: The canals in which Reciproc Blue R25 was used showed a significantly greater widening than those in which WaveOne Gold was used at 4 of the 5 measurement points (p < 0.05). The Reciproc Blue R25 instrument removed significantly more resin from the inner aspect of the curve at 2 of the 5 points and similar amounts at the remaining 3 points. At the 2 apical points, there was no significant difference between the Reciproc Blue R25 and WaveOne Gold Primary instruments. Conclusion: Both instruments respected the original canal anatomy; however, WaveOne Gold resulted in a more conservative shape with less transportation.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.165-165
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• 2013

Nickel oxide was deposited on mesoporous silica by atomic layer deposition (ALD) consisting of sequential exposures to Ni(cp)2 and $H_2O$. NiO/silica samples were characterized by inductively coupled plasma-mass spectroscopy (ICP-MS), transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS), etc. The flow-type reactor was used to measure activity of NiO/silica catalyst for catalytic combustion of toluene. The activity of NiO/silica catalyst was evaluated in terms of toluene removal efficiency and selectivity to $CO_2$ and compared with those of bare nickel oxide nanoparticles. In order to investigate influence of reaction temperature on combustion aspect, the catalytic combustion experiments were carried out at various temperatures. We show that both bare and supported NiO can be efficient catalysts for total oxidation of toluene at a temperature as low as $250^{\circ}C$.

• 천문학회보
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• 제39권2호
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• pp.103-103
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• 2014

Manufacturing of lens and mirror using Diamond Turning Machine (DTM) offers distinct advantages including short fabrication time and low cost as compared to grinding or polishing process. However, the DTM process can leave mid-frequency error in the optical surface which generates an undesirable diffraction effect and stray light. The mid-frequency error is expected to be eliminated by mechanical polishing after the DTM process, but polishing of soft surface of ductile aluminum is extremely difficult because the polishing process inevitably degrades the surface form accuracy. In order to increase its surface hardness, we performed electroless nickel plating on the surface of diamond-turned aluminum (Al-6061T6) off-axis mirrors, which was followed by the 6-hour-long baking process at $200^{\circ}C$ for improving its hardness. Then we polished the nickel plated off-axis mirrors to remove the mid-frequency error and measured polished mirror surfaces using the optical surface profilometer (NT 2000, Wyko Inc.). Finally, we ascertained that the mid-frequency error on the mirror surface was successfully removed. During the whole processes of nickel plating and polishing, we monitored the form accuracy using the ultra-high accurate 3-D profilometer (UA3P, Panasonic Corp.) to maintain it within the allowable tolerance range (< tens of nm). The polished off-axis mirror was optically tested using a visible laser source and a pinhole, and the airy pattern obtained from the polished mirror was compared with the unpolished case to check the influence of mid-frequency error on optical images.

• 구강회복응용과학지
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• 제23권4호
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• pp.293-302
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• 2007

I. Objectives The purpose of this study was to compare the shaping ability between the single length technique performed with Mtwo instruments (VDW, Munich, Germany) and the crown-down technique using K3 (SybronEndo, West Collins, CA, USA) and RaCe (FKG, La Chaux-de-Fonds, Switzerland) instruments. II. Materials & Methods Forty five curved canals in resin blocks were equally divided in to three groups. Group 1 (Mtwo) was instrumented used the full length of canal according to the manufacturer's instructions. The simulated canals was prepared to an instrument size of 35, 0.04 taper canal terminus. In group 2 (Race) and group 3 (K3) was instrumented in a crown-down manner and prepared to an instrument size of 30, 0.06 taper canal terminus. Pre- and post-instrumentation images were scanned and assessment of canal shape was completed with a computer image analysis program. Material removal was measured at 7 measuring points, beginning 1mm from the end point of preparation. Differenced of centering ratio were statistically analyzed using One-way ANOVA followed by Duncan's test. II. Results & Conclusion There was no significant difference on 1, 2, 3 and 7mm measuring point. At 4 and 5 measuring point, significant difference showed between the Mtow instruments and other two instruments. (p<0.05)

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2008년도 춘계학술대회 논문집
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• pp.247-250
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• 2008

Biomass gasification is a promising technology for producing a fuel gas which is useful for power generation systems. In biomass gasification processes, tar formation often causes some problems such as pipeline plugging. Thus, proper tar treatment is necessary. So far, nickel (Ni)-based catalysts have been intensively studied for the catalytic tar removal. However, the deactivation of Ni-based catalysts takes place because of coke deposition and sintering of Ni metal particles. To overcome these problems, we have been using ruthenium (Ru)-based catalyst for tar removal. It is reported by Okada et al., that a Ru/$Al_2O_3$ catalyst is very effective for preventing the carbon deposition during the steam reforming of hydrocarbons. Also, this catalyst is more active than the Ni-based catalyst at a low steam to carbon ratio (S/C). Benzene was used for the tar model compound because it is the main constituent of biomass tar and also because it represents a stable aromatic structure apparent in tar formed in biomass gasification processes. The steam reforming process transforms hydrocarbons into gaseous mixtures constituted of carbon dioxide ($CO_2$), carbon monoxide (CO), methane ($CH_4$) and hydrogen ($H_2$).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 공업화학
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• 제32권1호
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• pp.97-101
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• 2021

스코리아와 활성탄의 혼합 충전탑에서 중금속과 유기물의 흡착 특성, 스코리아의 물리화학적 특성과 관능기를 조사하였다. 스코리아의 혼합비율이 증가할수록 카드뮴, 니켈, 크롬, 납 이온의 평균제거율은 증가하였으나, 벤젠과 톨루엔의 평균 제거율은 감소하였다. 스코리아와 활성탄의 혼합 충전탑은 중금속과 유기물의 동시 제거에 효과적으로 사용될 수 있었다. 스코리아는 Si-H와 Si-O 작용기를 갖고 있으며, 이중 Si-O 관능기가 중금속의 흡착에 크게 기여함을 확인할 수 있었다.

• 한국산학기술학회논문지
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• 제18권2호
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• pp.95-101
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• 2017

본 논문에서는 복합재료로 만들기 위한 전처리 단계에서 수행한 사이징 제거 상태를 영상처리 알고리즘을 적용하여 수치적으로 나타내었고, 전자파 차폐 성능을 높이기 위해서 건식 공정 방식으로 니켈도금 탄소섬유를 제작하였다. 탄소섬유 제조에서 폴리머 종류로 감싸져 나온 사이징은 건식 코팅을 위해서는 제거해야 한다. 사이징이 제거된 상태를 주사 전자현미경(scanning electron microscope, SEM)으로 촬영한 이미지에서 탄소 섬유의 규칙적인 패턴, 즉 상관성을 구함으로써 수치적인 값으로 나타낼 수 있다. 사이징의 제거 방식은 용액, 압축 공기와 용액과 압축공기(하이브리드)로 제거한 SEM 영상에 대하여 제안된 방법을 적용한 결과 하이브리드 방식이 우수함을 확인 할 수 있었다. 그리고 사이징이 제거된 스프레딩 탄소 섬유 롤을 롤투롤 스퍼터 방식으로 니켈도금 탄소 섬유를 제작할 수 있었다. 제작된 30um, 40um과 100um 니켈코팅 탄소섬유에 대해서 전자파 차폐 성능을 측정하였다. 한국산업기술시험원에서 100um 니켈코팅 탄소섬유의 전자파 차폐 성능을 평가한 결과 최저 66.7(dB)에서 최고 73.2(dB)의 전자파 차폐 성능을 보였다. 이것은 구리의 전자파 차폐율과 유사하여 EV/HEV자동차의 케이블로 사용될 수 있다.

• 청정기술
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• 제27권2호
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• pp.139-145
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• 2021

본 연구의 목적은 건식 공정을 통해 폐전지에서 금속을 회수하는 것이다. 특히, 열처리 온도를 변수로 하여 공정 중에 발생되는 액상 및 기상상태의 생성물과 공정 후에 회수되는 고상상태의 생성물에 대하여 정성 및 정량적으로 분석하여 비교하였다. 폐전지의 커버를 제거한 후, NaCl 용액에 존치하여 방전시켰다. 폐전지를 파쇄과정을 통하여 가루형태로 만들어서 산소 분위기의 튜브 전기로에서 폐전지의 용융실험을 수행하였다. 리튬이온 폐전지는 반응온도 850 ℃에서 고체상태 생성물의 회수율은 80.1 wt%이었고, 주성분은 27.2 wt%의 코발트이었으며 그 외 리튬, 구리, 알루미늄 등이 미량 존재하였다. 니켈-수소 폐전지는 반응온도 850 ℃에서 회수율이 99.2 wt%로 건식공정으로부터 손실되는 금속이 거의 없었으며 약 37.6 wt%의 니켈이 주성분이었다. 그 외, 철을 포함하여 여러 금속을 가지고 있다. 니켈-카드뮴 폐전지는 온도가 증가할수록 카드뮴이 기화되면서 회수율이 65.4 wt%까지 낮아진다. 반응온도 1050 ℃에서 회수된 고체상태의 주 금속성분은 41 wt%의 니켈과 12.9 wt%의 카드뮴이었다. 또한 니켈-카드뮴 폐전지는 다른 이차 폐전지로부터 검출되지 않은 벤젠과 톨루엔 성분이 기체상태의 생성물에서 검출되었다. 본 연구 결과는 폐 이차전지의 건식 리사이클링 공정 연구에 기초 자료로서 활용 가능하다.