• Proceedings of the KSME Conference
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• 2001.06a
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• pp.237-242
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• 2001

Residual stress is a dominant obstacle to efficient production and safe usage of products by reducing the mechanical strength and failure properties. Especially, it causes interfacial failure and substrate deflection in the case of thin film. So, the exact evaluation and optimum control of thin film residual stress is indispensable. However, hole drilling or X-ray diffraction techniques have some limits in application to thin film. And, curvature technique for thin film materials cannot give the information about local stress variation. Therefore, we applied the nanoindentation technique in evaluating the thin film residual stress. In this study, we modeled the change of indentation loading curve for residually stressed and stress-free thin films during stress relaxation. The value of residual stress was directly related to the indentation depth change by relaxation. The residual stress from nanoindentation analysis was consistent with the result from curvature technique.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.33-38
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• 2014

Nanoindentater tests were conducted to conducted nanoindentation microhardness of the individual phase of ferrite and martensite of 680MPa dual-phase (DP) steel charged with hydrogen. Hydrogen was charged by electrochemical method with current densities of 150, $200mA/cm^2$ for charging times of 5, 10, 25, 50 hours, respectively. Nanoindenter test results showed that the nanoindentation microhardnesses of ferrite phase of DP steel were varied from min. 1.58 GPa to max. 2.82 GPa, and the nanoindentation microhardnesses of martensite phase varied from min. 3.19 GPa to max. 5.16 GPa with the variation of hydrogen charging conditions. It was observed that the variations of the nanoindention microhardnesses of martenstie phase were higher than those of ferrite phases. It was thought that martensite phase in the 680MPa DP steel was more sensitive than ferrite phase to hydrogen embrittlement.

• Composites Research
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• v.24 no.3
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• pp.17-24
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• 2011

The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the N$\'{o}$se-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.

• Korean Journal of Materials Research
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• v.13 no.9
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• pp.606-612
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• 2003

Surface and mechanical properties of thin films with submicron thickness was characterized by nanoindentation with Berkovich and Vickers tips, and scanning probe microscopy. Nanoindention was made in a depth range of 15 to 200 nm from the surface by applying tiny force in a range from 150 to $9,000 \mu$N. Stiffness, contact area, hardness, and elastic modulus were determined from the force-displacement curve obtained. Reliability was first tested by using fused quartz, a standard sample. Elastic modulus and hardness values of fused quartz measured were the same as those reported in the literature within two percent of error. Mechanical properties of ITO thin film were characterized in a depth range of 15∼200nm. As indentation depth increased, elastic modulus and hardness decreased by substrate effect. Ion beam deposited DLC thin films were indented in a depth range of 40∼50 nm. The results showed that the DLC thin film using benzene and bias voltage 0∼-50 V has elastic modulus and hardness value of 132 and 18 GPa respectively. Pure DLC thin films showed roughnesses lower than 0.25 nm, but silicon-added DLC thin films showed much higher roughness values, and the wavy surface morphology.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.382-387
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• 2004

Nanoindentation technique has been used to measure the mechanical properties of aluminium alloy foam cell walls. Al-Si-Cu-Mg alloy foams of different compositions and different cell morphologies were produced using powder metallurgical method. Cell morphology of the foam was controlled during production by varying foaming time and temperature. Mechanical properties such as hardness and Young's modulus were calculated using two different methods: a continuous stiffness measurement (CSM) and an unloading stiffness measurement (USM) method. Experimental results showed that hardness and Young's modulus of Al-5%(wt.)Si-4%Cu-4%Mg (544 alloy) precursor and foam walls are higher than those of Al-3%Si-2%Cu-2%Mg (322 alloy) precursor and foam walls. It was noticed that mechanical properties of cell wall are different from those of precursor materials.

• Nuclear Engineering and Technology
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• v.49 no.3
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• pp.576-580
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• 2017

A dynamic nanoindentation method was applied to study an Fe-18 at.% Gd alloy as a neutron-absorbing material prepared by vacuum arc-melting and cast in a mold. The Fe-18 at.% Gd cast alloy had a microstructure with matrix phases and an Fe-rich primary dendrite of $Fe_9Gd$. Rietveld refinement of the X-ray spectra showed that the Fe-18 at.% Gd cast alloy consisted of 35.84 at.% $Fe_3Gd$, 6.58 at.% $Fe_5Gd$, 16.22 at.% $Fe_9Gd$, 1.87 at.% $Fe_2Gd$, and 39.49 at.% ${\beta}-Fe_{17}Gd_2$. The average nanohardness of the primary dendrite phase and the matrix phases were 8.7 GPa and 9.3 GPa, respectively. The fatigue limit of the matrix phase was approximately 37% higher than that of the primary dendrite phase. The dynamic nanoindentation method is useful for identifying local phases and for analyzing local mechanical properties.

• Composites Research
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• v.22 no.3
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• pp.9-17
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• 2009

Nanoindentation behaviours on the films of softer Ag film/harder Cu substrate structure were studied by the molecular dynamics method. As a result, it was shown that the stiffness and hardness of films were strongly dependent on the thickness of films. The stiffness and hardness increased with the thickness of film within a critical range as an inverse Hall-Petch relation. The stiffness and hardness of Cu substrate with Ag film less than 5 nm were observed to be lower than those of bulk silver. In particular, the flower-like dislocation loop was created on the interface by the interaction between dislocation pile-up and misfit dislocation during the indentation of Ag film/Cu substrate with film thickness less than 4 nm, which seemed to be associated with the drop of load in the indentation load versus displacement curve.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.77-77
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• 2001

• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.447-452
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• 2014

This paper presents the effects of pulse plasma parameters such as duty cycle and pulse frequency on the properties of TiAlN coatings deposited by asymmetric bipolar pulsed DC magnetron sputtering systems. The results show that, with decreasing duty cycle and increasing pulse frequency, the coating morphology changes from a columnar structure to a dense structure with finer grains. Pulsed sputtered TiAlN coatings showed higher hardness, higher residual stress, and smaller grain sizes than did DC prepared TiAlN coatings. Moreover, residual stress and nanoindentation hardness of pulsed sputtered TiAlN coatings increased with increasing pulse frequency. Meanwhile, the surface roughness decreased continuously with increasing pulsed DC frequency up to 50 kHz.

• Nuclear Engineering and Technology
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• v.52 no.9
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• pp.2041-2046
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• 2020

The present article investigates the influence of hydrogen concentration on the creep performance of cold-worked stress-relieved unirradiated Zircaloy-4 cladding tube using nanoindentation technique. The as-received Zircaloy-4 tube is hydrided to the concentrations of 600 ppm and 900 ppm using gaseous hydrogen charging method. Constant load indentation creep tests are performed for a dwell period of 600 s in the temperature range of 300℃-500 ℃ at 1000 μN, 2000 μN, and 3000 μN. The impact of hydrogen is evaluated in terms of steady state power law creep exponent and activation energy. The power law creep exponent decreases with increase in hydrogen concentration, however, it remains fairly constant with increase in temperature up to 500 ℃. Moreover, activation energy too decreases significantly with increase in hydrogen concentration. The mean stress exponent and activation energy are found to be 3.58 and 28.67 kJ/mol, respectively, for as-received sample.