• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.86-86
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• 2012

The new approaches for silicon solar cell of new concept have been actively conducted. Especially, solar cells with wire array structured radial p-n junctions has attracted considerable attention due to the unique advantages of orthogonalizing the direction of light absorption and charge separation while allowing for improved light scattering and trapping. One-dimenstional semiconductor nano/micro structures should be fabricated for radial p-n junction solar cell. Most of silicon wire and/or pillar arrays have been fabricated by vapour-liquid-solid (VLS) growth because of its simple and cheap process. In the case of the VLS method has some weak points, that is, the incorporation of heavy metal catalysts into the growing silicon wire, the high temperature procedure. We have tried new approaches; one is electrochemical etching, the other is noble metal catalytic etching method to overcome those problems. In this talk, the silicon pillar formation will be characterized by investigating the parameters of the electrochemical etching process such as HF concentration ratio of electrolyte, current density, back contact material, temperature of the solution, and large pre-pattern size and pitch. In the noble metal catalytic etching processes, the effect of solution composition and thickness of metal catalyst on the etching rate and morphologies of silicon was investigated. Finally, radial p-n junction wire arrays were fabricated by spin on doping (phosphor), starting from chemical etched p-Si wire arrays. In/Ga eutectic metal was used for contact metal. The energy conversion efficiency of radial p-n junction solar cell is discussed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.393-393
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• 2012

Optically active nanostructures such as subwavelength moth-eye antireflective structures or surface enhanced Raman spectroscopy (SERS) active structures have been demonstrated to provide the effective suppression of unwanted reflections as in subwavelength structure (SWS) or effective enhancement of selective signals as in SERS. While various nanopatterning techniques such as photolithography, electron-beam lithography, wafer level nanoimprinting lithography, and interference lithography can be employed to fabricate these nanostructures, roll-to-roll (R2R) nanoimprinting is gaining interests due to its low cost, continuous, and scalable process. R2R nanoimprinting requires a master to produce a stamp that can be wrapped around a quartz roller for repeated nanoimprinting process. Among many possibilities, two different types of mask can be employed to fabricate optically active nanostructures. One is self-assembled Au nanoparticles on Si substrate by depositing Au film with sputtering followed by annealing process. The other is monolayer silica particles dissolved in ethanol spread on the wafer by spin-coating method. The process is optimized by considering the density of Au and silica nano particles, depth and shape of the patterns. The depth of the pattern can be controlled with dry etch process using reactive ion etching (RIE) with the mixture of SF6 and CHF3. The resultant nanostructures are characterized for their reflectance using UV-Vis-NIR spectrophotometer (Agilent technology, Cary 5000) and for surface morphology using scanning electron microscope (SEM, JEOL JSM-7100F). Once optimized, these optically active nanostructures can be used to replicate with roll-to-roll process or soft lithography for various applications including displays, solar cells, and biosensors.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.136.2-136.2
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• 2015

반도체 제조는 chip의 성능 향상 및 단가 하락을 위해 지속적으로 pattern size가 nano size로 감소해 왔고, capacitor 용량은 증가해 왔다. 이러한 현상은 contact hole의 aspect ratio를 지속적으로 증가시킨바, 그에 따라 최적의 HARC (high aspect ratio contact)을 확보하는 적합한 dry etch process가 필수적이다. 그러나 HARC dry etch process는 많은 critical plasma properties 에 의존하는 매우 복잡한 공정이다. 따라서, critical plasma properties를 적절히 조절하여 higher aspect ratio, higher etch selectivity, tighter critical dimension control, lower P2ID과 같은 plasma characteristics을 확보하는 것이 요구된다. 현재 critical plasma properties를 제어하기 위해 다양한 plasma etching 방법이 연구 되어왔다. 이 중 plasma를 낮은 kHz의 frequency에서 on/off 하는 pulsed plasma etching technique은 nanoscale semiconductor material의 etch 특성을 효과적으로 향상 시킬 수 있다. 따라서 본 실험에서는 dual-frequency capacitive coupled plasma (DF-CCP)을 사용하여 plasma operation 동안 duty ratio와 pulse frequency와 같은 pulse parameters를 적용하여 plasma의 특성을 각각 제어함으로써 etch selectivity와 uniformity를 향상 시키고자 하였다. Selective SiO2 contact etching을 위해 top electrode에는 60 MHz pulsed RF source power를, bottom electrode에는 2MHz pulse plasma를 인가하여 synchronously pulsed dual-frequency capacitive coupled plasma (DF-CCP)에서의 plasma 특성과 dual pulsed plasma의 sync. pulsing duty ratio의 영향에 따른 etching 특성 등을 연구 진행하였다. 또한 emissive probe를 통해 전자온도, OES를 통한 radical 분석으로 critical Plasma properties를 분석하였고 SEM을 통한 etch 특성분석과 XPS를 통한 표면분석도 함께 진행하였다. 그 결과 60%의 source duty percentage와 50%의 bias duty percentage에서 가장 향상된 etch 특성을 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• 지질공학
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• 제22권1호
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• pp.49-58
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• 2012

앵커두부에서의 많은 문제점들은 앵커두부가 외부에 노출되어 풍화에 직접적인 영향을 받고, 진동이나 외력에 의해 물리적인 변형과 손상을 많이 받기 때문이다. 본 연구에서는 기존 수압판 방식의 파괴원인을 분석하여 앵커두부에서 발생하는 문제점 해결을 위해 앵커두부의 지표면 근입방식을 제시하였다. 앵커두부처리 방식의 안정성을 기존방식과 비교, 검토하기 위하여 범용해석프로그램인 ABAQUS로 3차원 정밀 수치해석을 수행하여 하중조건에 따른 변위 및 응력분포양상을 분석하였고, 현장 적용성 검증을 위한 시험시공과 계측을 통해 적용 가능성을 평가하였다. 수치해석 결과는 최대수직응력이 9.73 MPa, 수직변위가 1.34 mm로 나타났고, 현장시험을 통하여 콘크리트 수압판의 변위가 근입형 지압판에 비해 3~4배의 큰 변위량을 보인다는 것을 확인하였다.

• Tribology and Lubricants
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• 제33권3호
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• pp.92-97
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• 2017

The understanding of the friction characteristics of micro-textured surface is of great importance to enhance the tribological properties of nano- and micro-devices. We fabricate rectangular patterns with submicron-scale structures on a Si wafer surface with various pitches and heights by using a focused ion beam (FIB). In addition, we fabricate tilted rectangular patterns to identify the influence of the tilt angle ($45^{\circ}$ and $135^{\circ}$) on friction behaviour. We perform the friction test using lateral force microscopy (LFM) employing a colloidal probe. We fabricate the colloidal probe by attaching a $10{\pm}1-{\mu}m$-diameter borosilicate glass sphere to a tipless silicon cantilever by using a ultraviolet cure adhesive. The applied normal loads range between 200 nN and 1100 nN and the sliding speed was set to $12{\mu}m/s$. The test results show that the friction behavior varied depending on the pitch, height, and tilt angle of the microstructure. The friction forces were relatively lower for narrower and deeper pitches. The comparison of friction force between the sub-micro-structured surfaces and the original Si surface indicate an improvement of the friction property at a low load range. The current study provides a better understanding of the influence of pitch, height, and tilt angle of the microstructure on their tribological properties, enabling the design of sub-micro- and micro-structured Si surfaces to improve their mechanical durability.

• 소성∙가공
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• 제22권1호
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• pp.23-29
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• 2013

In this study, a micro/nano-random-pattern-structure surface was machined by electric discharge machining (EDM) followed by replicating the EDM surface with a silicone elastomer having low energy and greater hydrophobicity. The variation of hydrophobicity was of prime interest and was examined as a function of the surface roughness of the replicated silicone elastomer. The hydrophobicity was evaluated by the water contact angle (WCA) measured on the relevant surface. For the experiments, the original surfaces were machined by die sinking electric discharge machining (DS-EDM) and wire cutting electric discharge machining (WC-EDM). The ranges of surface roughness were Ra $0.8{\sim}19{\mu}m$ for the DS-EDM and Ra $0.5{\sim}4.7{\mu}m$ for the WC-EDM. In order to fabricate a hydrophobic surface, the EDM surfaces were directly replicated using a liquid-state silicone elastomer, which was thermally cured. The measured WCA on the replicated surfaces for DS-EDM was in the range of $115{\sim}130^{\circ}$ and for WC-EDM the WCA was in the range of $123{\sim}150^{\circ}$. Additionally, the dynamic hydrophobicity was evaluated by measuring an advancing and a receding WCA on the replicated silicone elastomer surfaces.

• 대한기계학회논문집A
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• 제35권1호
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• pp.107-114
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• 2011

본 논문에서는 나노 래핑 표면의 형상과 레이저산란 패턴 사이의 실험적 모델링에 관한 연구를 하였다. 우선, 반사표면에서 나타나는 산란광 속성들을 고찰하여 암시야 기반의 레이저산란 검사 메커니즘을 구성하였다. 이 메커니즘을 이용한 레이저산란 패턴 분석의 경우, 나노 래핑 표면 형상으로부터 산란된 레이저산란 성분은 불규칙하게 사선형태로 교차됨을 알 수 있다. 또한, 실험 계획법을 기반으로 도출된 매개변수로 적용된 최적의 레이저산란 영상에서 나노 래핑 표면 거칠기와 레이저산란 성분 사이의 상관관계를 회귀분석법을 이용하여 수학적 모델링을 시도 하였다. 이 모델의 검증을 위해 나노 래핑 표면 3 종류의 거칠기에 대해 50 번의 반복실험을 수행한 결과, 제시된 수학적 모델은 실제 거칠기 값에 근접하게 추정할 수 있음을 보였다.

• 한국진공학회지
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• 제15권4호
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• pp.354-359
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• 2006

일반적인 포토리소그래피를 사용하지 않고 마이크로미터 혹은 나노미터 단위의 패턴형성을 위한 연구가 최근 많은 연구그룹에 의해 진행되고 있다. 본 실험에서는 패턴이 형성된 polydimelthylsiloxane (PDMS) 몰드를 octadecyltrichlorosilane (OTS) 용액에 dipping 하여 PDMS 표변에 OTS 단분자막을 형성하고 micro contact printing (${\mu}-CP$) 방법으로 OTS 단분자 막을 유리기판 표면위로 전사하였다. 전사된 OTS 단분자막은 친수성 유리기판 위에서 소수성 표면특성을 갖게 하며, 친수성은 용액 속에 dipping 하였을 때 소수성 표면 위에는 코팅되지 않도록 한 이 방법을 이용하여 유리기판 위에 Ag 패턴을 형성하였다. 또한, 세척직후 친수성 표면 특성을 보이는 유리기판의 시간에 따른 접촉각 측정을 통해 표면에너지의 변화를 분석하였다.

• Progress in Superconductivity
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• 제7권1호
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• pp.58-63
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• 2005

We investigated the surface oxidation behavior of cube-textured polycrystalline nickel at various oxidation conditions. Cube-textured NiO film was formed on a cube-textured polycrystalline nickel regardless of oxidation conditions but different growth behavior of NiO crystals was observed depending on the oxidation conditions. The introduction of water vapor into $O_2$ did not affect the texture evolution, but rough and porous microstructure was developed. Microstructure of NiO film tends to be denser as the oxygen partial pressure increases. It is interesting that (111) peak of theta - two theta diffraction pattern started to get stronger in air atmosphere and (111) plane became the major texture in the substrate oxidized in high purity argon gas. Small amount of high index crystallographic plane NiO peak crystal was observed when $N_{2}O$ was used as an oxidant while only (200) plane crystal was formed in dry $O_2$ atmosphere. Flat and smooth surface was changed into rough faceted one when ramping rate to oxidation temperature was faster. The grain size of NiO was decreased when the oxygen partial pressure was low. It was also observed that the modification of nickel surface suppressed the development of (200) texture.