• Journal of Technology Innovation
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• v.21 no.2
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• pp.285-317
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• 2013

This paper delineates dynamic capabilities, which can be measured by internal capability and external knowledge, and also, in the shape of dynamic capabilities, bases on that corporate actions are expatiated by fitness and rent of evolutionary perspective. To achieve the goal of this study, classifying types of Nano-technology enterprise and suggesting analytical pattern based on dynamic capabilities, this thesis substantially analyzes how to categorize a type of enterprise and gauge a result through a survey of 359 domestic companies producing goods concerned with Nano-technology. This paper analyzes whether or not the internal capability and external knowledge affect the outcome of a certain enterprise. Moreover, in according to the results of practical analysis, it deducts 2 new variables by applying principal component analysis on four previous variables showing the internal capability and external knowledge. By classifying four types of enterprises with criterion of these two factors based on a relative extent and comparing each typical financial result, this paper suggests that the companies with relatively higher level of the internal capability and external knowledge surpass the lower ones at the financial outcome. Not only this, but also the technology-level analysis shows the same result, the higher capability and knowledge the higher performance. However, the analysis based on the difference of the four types of financial outcomes reveals that technological and evolutionary fitness can determine financial achievement.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.372-376
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• 2009

In the modern semiconductor industry, lithography process is used to construct specific patterns. However, due to the decreasing of line width, these days, more and more researchers are interested in PMMA(Poly Methyl Methacrylate) lithography by using e-beam instead of the prior method, PR(Photoresist) lithography by using UV(Ultra-Violet). Additionally, the patterns constructed by lithography are collapsed during the process of cleansing remnants and the resistance against the breakdown of the patterns is known to be proportional to the elastic modulus of pattern-constructing materials. In this research, we measured the change of hardness and elastic modulus of PMMA film surface according to the change of time spent to soft-bake the PMMA film. During the measurement, we controlled the tip pressure from $25{\mu}N$ to $8,500{\mu}N$ having intervals that are $134.52{\mu}N$. For these measurements, we used the Triboindenter from Hysitron to gauge the hardness and elastic modulus and the tip we used was Berkovich diamond Tip.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.4A
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• pp.761-766
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• 2006

Polymer composite are increasingly considered as structural components for use in civil engineering, on account of their enhanced strength-to-weight ratios. Unsaturated polyester (UP) resin have been widely used for the matrix of composites such as FRP and polymer composite, due to its excellent adhesive. Polymer nanocomposites are new class of composites derived from the nano scale inorganic particles with dimensions typically in the range of 1 to 1000 nm that are dispersed in the polymer matrix homogeneously. Owing to the high aspect ratio of the fillers, mechanical, thermal, flame, retardant and barrier properties are enhanced without significant loss of clarity, toughness or impact strength. To prepare the MMT (Montmorillonite)-UP exfoliated nanocomposites, UP was mixed with MMT at $60^{\circ}C$ for 3 hours by using pan mixer. XRD (X-ray diffraction) pattern of the composites and TEM (Transmission Electron Micrographs) showed that the interlayer spacing of the modified MMT were exfoliated in polymer matrix. The mechanical properties also supported these findings, since in general, tensile strength, modulus with modified MMT were higher than those of the composites with unmodified MMT. The thermal stability of MMT-UP nanocomposite is better than that of pure UP, and its glass transition temperature is higher than that of pure UP. The polymer concrete made with MMT-UP nanocomposite has better mechanical properties than of pure UP. Therefore, it is suggested that strength and elastic modulus of polymer concrete was found to be positively tensile strength and tensile modulus of the MMT-UP nanocomposites.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.93-93
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• 2016

Large scale integrated circuits (LSIs) has been improved by the shrinkage of the circuit dimensions. The smaller chip sizes and increase in circuit density require the miniaturization of the line-width and space between metal interconnections. Therefore, an extreme precise control of the critical dimension and pattern profile is necessary to fabricate next generation nano-electronics devices. The pattern profile control of plasma etching with an accuracy of sub-nanometer must be achieved. To realize the etching process which achieves the problem, understanding of the etching mechanism and precise control of the process based on the real-time monitoring of internal plasma parameters such as etching species density, surface temperature of substrate, etc. are very important. For instance, it is known that the etched profiles of organic low dielectric (low-k) films are sensitive to the substrate temperature and density ratio of H and N atoms in the H2/N2 plasma [1]. In this study, we introduced a feedback control of actual substrate temperature and radical density ratio monitored in real time. And then the dependence of etch rates and profiles of organic films have been evaluated based on the substrate temperatures. In this study, organic low-k films were etched by a dual frequency capacitively coupled plasma employing the mixture of H2/N2 gases. A 100-MHz power was supplied to an upper electrode for plasma generation. The Si substrate was electrostatically chucked to a lower electrode biased by supplying a 2-MHz power. To investigate the effects of H and N radical on the etching profile of organic low-k films, absolute H and N atom densities were measured by vacuum ultraviolet absorption spectroscopy [2]. Moreover, using the optical fiber-type low-coherence interferometer [3], substrate temperature has been measured in real time during etching process. From the measurement results, the temperature raised rapidly just after plasma ignition and was gradually saturated. The temporal change of substrate temperature is a crucial issue to control of surface reactions of reactive species. Therefore, by the intervals of on-off of the plasma discharge, the substrate temperature was maintained within ${\pm}1.5^{\circ}C$ from the set value. As a result, the temperatures were kept within $3^{\circ}C$ during the etching process. Then, we etched organic films with line-and-space pattern using this system. The cross-sections of the organic films etched for 50 s with the substrate temperatures at $20^{\circ}C$ and $100^{\circ}C$ were observed by SEM. From the results, they were different in the sidewall profile. It suggests that the reactions on the sidewalls changed according to the substrate temperature. The precise substrate temperature control method with real-time temperature monitoring and intermittent plasma generation was suggested to contribute on realization of fine pattern etching.

• Journal of the Korean Magnetics Society
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• v.18 no.2
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• pp.49-53
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• 2008

Magnetic and crystallographic properties of patterned media fabricated by nanoimprint lithography and Co-Pt electroplating were studied. Thin films of Ru(20 nm)/Ta(5 nm)/$SiO_2$(100 nm) were deposited on Si(100) wafer and then 25 nm hole pattern was fabricated by nanoimprint lithography on substrate. The electroplated Co-Pt nano-dots have the diameter of 35 nm and the height of 27 nm. Magnetic dot patterns of Co-Pt alloy were created using electroplated Co-Pt alloy and then their properties were measured by MFM, SQUID, SEM, TEM and AFM. We observed single domain with perendicular anisotropy for each dot and achieved optimum coercivity of 2900 Oe. These results mean that patterned media fabricated by nanoimprint lithography and electroplating have good properties in view of extending superparamagnetic limit while satisfying the writability requirements with the present write heads.

• Korean Journal of Optics and Photonics
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• v.20 no.3
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• pp.175-181
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• 2009

Holographic lithography is one of the potential technologies for next generation lithography which can print large areas (6") as well as very fine patterns ($0.35{\mu}m$). Usually, photolithography has been developed with two target purposes. One was for LCD applications which require large areas (over 6") and micro pattern (over $1.5{\mu}m$) exposure. The other was for semiconductor applications which require small areas (1.5") and nano pattern (under $0.2{\mu}m$) exposure. However, holographic lithography can print fine patterns from $0.35{\mu}m$ to $1.5{\mu}m$ keeping the exposure area inside 6". This is one of the great advantages in order to realize high speed fine pattern photolithography. How? It is because holographic lithography is taking holographic optics instead of projection optics. A hologram mask is the key component of holographic optics, which can perform the same function as projection optics. In this paper, Surface-Relief TIR Hologram Mask technology is introduced, and enables more robust hologram masks than those previously reported that were formed in photopolymer recording materials. We describe the important parameters in the fabrication process and their optimization, and we evaluate the patterns printed from the surface-relief TIR hologram masks.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.2
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• pp.159-168
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• 2012

In this paper, we designed the antipodal vivaldi antenna for IR-UWB systems application and evaluated IR-UWB antenna performance for the ultra wideband impulse signal transmission in the time- and frequency-domain. The designed antipodal vivaldi antenna was fabricated using FR-4 substrate which thickness 1.6 mm, dielectric constant ${\epsilon}_r=4.7$ and $tan{\delta}=0.002$. We measured the return loss, far filed radiation pattern at the anechoic chamber in the frequency-domain. We also performed the pulse fidelity analysis in the time-domain using nano-second impulse signal transmission and demonstrated the feasibility of ultra wideband signal stable transmission in the UWB band. The designed and fabricated antipodal vivaldi antenna could be emitting and receiving the IR-UWB signal while preserving low pulse distortion and good radiation pattern in time- and frequency-domain.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Proceedings of the Korean Society of Computer Information Conference
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• 2011.01a
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• pp.107-108
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• 2011

Since the development of railway technology, the current urban Railway the first train line in the country for safe operation control automatic/unattended operation, automatic train operation equipment available (ATO) on time and reliable operation has introduced. ATO Automatic operation controlled by the value (Target velocity) and the feedback value (Actual velocity) by the error between the backing and braking of the train by repeated low energy efficiency. In this paper, given a fixed distance stations between time operation with minimal energy in the driving characteristics and driving trains are modeled. Therefore, in line 5 real route time sectional drive straight sections for experimental data analysis / draft Section / curved and section of the train on that line is selected according to the changing driving patterns to minimize the energy optimal driving patterns were presented.