• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.113-119
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat material by means of an electric current that is caused to flow through the material or its container by electromagnetic induction. It has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers a finite element analysis of the induction heating process which can rapidly raise mold temperature. To simulate the induction heating process, the electromagnetic field analysis and transient heat transfer analysis are required collectively. In this study, a coupled analysis connecting electromagnetic analysis with heat transfer simulation is carried out. The estimated temperature changes are compared with experimental measurements for various heating conditions.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.426-428
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• 2007

A simple method is presented for fabricating micro/nanoscale combined hierarchical structures using a two-step UV-assisted capillary molding technique. This lithographic method consists of two steps: (i) fabrication of partially cured polymer microstructures using a PDMS mold and (ii) subsequent nanofabrication using a high-resolution polyurethane acrylate (PUA) mold on top of the pre-formed microstructures. Using this technique, various micro/nano hierarchical structures were fabricated with minimum resolution down to 70 nm over a large area with very good reproducibility.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.284-284
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• 2010

We report a fabrication of 6, 13-bis(triisopropylsilylethynyl) (TIPS) pentacene nanowires that made on Si substrates by liquid bridge-nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the TIPS-pentacene nanowire and the Si substrate. The patterned TIPS-Pentacene nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and electrical properties.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.589-595
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• 2011

Laminated glass fiber-reinforced plastic (GFRP) composites were applied to an insulating structure of a magnet system for a nuclear fusion device. Decreased inter-laminar strength by a strong repulsive force between coils which is induced a problem of structural integrity in laminated GFRPs. Therefore, it is important to investigate the inter-laminar characteristics of laminated GFRP composites in order to assure more reliable design and better structural integrity. Three types of the laminated GFRP composites using a high voltage insulating materials were fabricated according to each molding process. To evaluate the grade of the fabricated composites, mechanical tests, such as hardness, tensile and compressive tests,were carried out. The autoclave molding composites satisfied almost of the mechanical properties reguested at the G10 class standard, but the vacuum impregnation (VPI) and Prepreg composites did not.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.91-91
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• 2010

In this paper, nano composites material is produced by adding MgO with particle size of 5 [nm] into epoxy resign using as insulating material of power transformer apparatus and molding part to study the volume resistivity of nano composites used epoxy. We measured the volume resistivity using the High Resistance Meter(4329A) depending on changing the amount of addition and temperature in this experience. In result, we have confirmed that 1.0, 3.0, 5.0 and 10.0 [wt%] as about 2.9, 7.6, 7.5 and 6.1 times increased than virgin. Therefore, the characteristic of volume resistivity was relatively stable as specimen by added 3.0 [wt%] than the others.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.999-1005
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• 2004

A new stamp fabrication technique for the soft lithography has been developed in the range of several microns by means of a nano-replication printing (nRP) process. In the nRP process, a figure or a pattern can be replicated directly from a two-tone bitmap figure with nano-scale details. A photopolymerizable resin was polymerized by the two-photon absorption which was induced by a femtosecond laser. After the polymerization of master patterns, a gold metal layer (about 30 ㎚ thickness) was deposited on the fabricated master patterns for the purpose of preventing a join between the patterns and the PDMS, then the master patterns were transferred in order to fabricate a stamp by using the PDMS (poly-dimethylsiloxane). In the transferring process, a few of gold particles, which were isolated from the master patterns, remained on the PDMS stamp. A gold selective etchant, the potassium iodine (KI) was employed to remove the needless gold particles without any damage to the PDMS stamp. Through this work, the effectiveness of the nRP process with the PDMS molding was evaluated to make the PDMS stamp with the resolution of around 200 ㎚.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.3
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• pp.57-66
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• 2024

In this study, silicon sludge from a semiconductor packaging process is recycled to fabricate silica coated silicon-sludge and applied as a filler for an epoxy molding compound(EMC). Silicon-sludge powder(S-sludge) is treated with acid to remove metallic impurities and then coated using the sol-gel method to synthesize silica coated silicon-sludge powder(SS-sludge). The as-synthesized SS-sludge is subsequently mixed with epoxy resin, a curing agent, and carbon black to create an EMC(SS-sludge EMC). The heat dissipation properties of the EMC were examined using an IR camera. IR camera analysis confirmed that the SS-sludge EMC exhibited the highest surface temperature of 58.5℃ compared to SiO₂-based EMC. This enhancement in heat dissipation using SS-sludge EMC is attributed to the excellent thermal conductivity(150W/mK) of the silicon substrate and the presence of the silica layer on the SS-sludge surface which effectively enhances the thermal property of the EMC. Therefore, this study successfully demonstrates the recycling of silicon sludge from a semiconductor packaging process by synthesizing silica coated silicon-sludge and suggests a novel application of this material in semiconductor packaging.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1051-1057
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• 2011

By the recently developed GMP(Glass Molding Press) process, aspheric glass lenses are widely used in many optical applications such as digital cameras, optical data storages and electrical devices etc. The GMP process can economically produce complex shaped glass lenses with high precision and good repeatability. This study deals the optimization of molding conditions for aspheric glass lenses in progressive GMP process through Design Of Experiment(Taguchi method). Tree main factors for molding conditions were selected based on pressure, temperature and cooling time at 1st cooling stage. From the analysis of experiments which were preformed with 3-cavity glass mold, it was revealed that the cooling time was the most sensitive parameter for form accuracy(PV) in progressive GMP process.

• Proceedings of the KAIS Fall Conference
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• 2003.06a
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• pp.356-358
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• 2003

본 연구에서는 일반사출과 MmSH방식 두 가지의 사출성형공정을 이용하여 나노 패턴 구조물을 제작하였다. 성형품에 나타난 나노패턴의 진사성은 MmSH방식을 이용한 PC 성형품에서 가장 우수했다. 일반사출공정에서 HIPS로 제작된 성형품은 나노패턴의 전사가 잘 형성되었고, PC의 경우 전사가 잘 이루어지지 않았다. 연구 결과 수지의 유동성이 좋고, 금형표면 온도가 높을수록 나노패턴의 전사성은 향상됨을 알 수 있었다.