• 제목/요약/키워드: nano-grain

검색결과 343건 처리시간 0.028초

ZnO 나노파우더 바리스터의 C-V 및 주파수 특성 분석 (Analysis of C-V and Frequency Characteristics of the ZnO nano-powder Varistors)

  • 왕민성;정종엽;송민종;박춘배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.183-184
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    • 2005
  • In this study, our varistors based on M.Matsuoke's composition were fabricated with ZnO nano-powder whose sizes were 50nm and 100nm. Electrical properties of ZnO nano-powder varistors were obtained by capacitance-voltage and frequency-real impedance. nano-powder varistors are indicated the change of the interface defects density $N_t$ at the grain boundaries and the donor concentration $N_d$ in the ZnO grains. Frequency analysis was accomplished to understand the equivalent circuit.

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Micro Metal Injection Molding Using Hybrid Micro/Nano Powders

  • Nishiyabu, Kazuaki;Kakishita, Kenichi;Osada, Toshiko;Tanaka, Shigeo
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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    • pp.36-37
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    • 2006
  • This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.

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표면크랙 예측을 위한 결정립 제어 레오로지 소재 표면의 나노 변형특성에 관한 연구 (A Study on the Nano-Deformation Characteristics of Grain-Size Controlled Rheology Material Surfaces for Surface Crack Prediction)

  • 윤성원;김현일;강충길
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.355-358
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    • 2004
  • In this study, the deformation characteristics of grain-size controlled rheology materials surfaces were investigated as a part of the research on the surface crack prediction in semi-solid formed automobile components. The microstructure of rheology Al-Si alloys consists of primary and eutectic regions. In eutectic regions the crack initiation begins with initial fracture of the eutectic silicon particles and inside other intermetallic phases. Nano-deformation characteristics in the eutectic and primary region of semi-solid aluminum alloys (356 alloy and 319 alloy) were investigated through the nanoindentation/scratch experiments and the AFM observation.

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나노 구리 분말의 냉간정수압 공정에 대한 치밀화 거동 해석 (Analysis of Densification Behavior of Nano Cu Powders during Cold Isostatic Pressing)

  • 윤승채;김형섭;이창규
    • 한국분말재료학회지
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    • 제11권4호
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    • pp.341-347
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    • 2004
  • In the study, a hybrid constitutive model for densification of metallic powders was applied to cold isostatic pressing. The model is based on a pressure-dependent plasticity model for porous materials combined with a dislocation density-based viscoplastic constitutive model considering microstructural features such as grain size and inter-particle spacing. Comparison of experiment and calculated results of microscale and nanoscale Cu powders was made. This theoretical approach is useful for powder densification analysis of various powder sizes, deformation routes and powder processing methods.

전기도금법으로 제조한 Ni-Fe 나노박막의 스트레스와 자기적 특성에 미치는 용액의 조건 및 전류밀도의 영향 (Effect of Bath Conditions and Current Density on Stress and Magnetic Properties of Ni-Fe Nano Thin Films Synthesized by Electrodeposition Methods)

  • 구본급
    • 한국표면공학회지
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    • 제44권4호
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    • pp.137-143
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    • 2011
  • The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

나노 Fe 분말을 이용하여 사출 성형된 Fe 소결체의 제조 (Fabrication of Injection Molded Fe Sintered Bodies Using Nano Fe Powder)

  • 김기현;임재균;최철진;이병택
    • 한국재료학회지
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    • 제14권11호
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    • pp.795-801
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    • 2004
  • The injection molded Fe sintered bodies were fabricated using two kinds of Fe powders haying 50 nm and $3\sim5{\mu}m$ in diameter. In the using of Fe powder having 50 nm in diameter, the comparatively dense bodies ($94\sim97\%$) were obtained even at low sintering temperature ($600\sim700^{\circ}C$), while in the sintered bodies ($1000^{\circ}C$) using $3\sim5{\mu}m$ Fe powder, their relative densities showed low values about $93\%$, although they were strongly depend on the sintering temperature and volume ratio of Fe powder and binder. In the sintered bodies using of 50 nm Fe powders, the volume shrinkage and grain size increased as the sintering temperature increased, but the values of hardness decreased. In the sample sintered at $650^{\circ}C$, the values of relative density, volume shrinkage and grain size were $96\%,\;37\%\;and\;0.97{\mu}n$, respectively and the minimum value of wear depth was obtained due to combination of fine grain and comparatively high density.

ZnO 나노 분말 바리스터의 전기적 특성 (Electrical Characteristics of ZnO Nano-Powder Varistors)

  • 소순진;임근영;김호걸;김종호;박춘배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.416-420
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    • 2004
  • Varistors based on M.Matsuoka were prepared from ZnO nanopowders, every one of which had bar type and about less 100nm length. The compact green disks were conventionally sintered in air for 2 hours at a temperature of $1050^{\circ}C$. The Varistors with nonlinear coefficient ${\alpha}=45$, leakage current $I_{\ell}=2{\times}10^{-7}A/cm^2$, operating voltage 9000v/cm, and average grain size $3{\mu}m$ were obtained. The advantages of the samples were due to greater structural homogenity, higher density, smaller grain size.

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구조용 나노금속재료의 소성변형 특성 (Plastic Deformation Behavior of Structural Nano Metallic Materials)

  • 윤승채;팜쾅;복천희;곽은정;김형섭
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.25-26
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    • 2007
  • At the time when nanostructured materials (NSMs) are becoming a major focus of materials research, the attention of researchers is turning more to their mechanical performance. In contrast with conventional coarse grained materials, which are either strong or ductile, but rarely both at the same time, it is expected that with NSMs both high strength and ductility can be achieved and confirmed by several experimental studies. In spite of the significant interest and efforts in the mechanical properties of NSMs, deformation mechanisms during plastic deformation as well as elastic deformation are not well established yet. In this talk, the deformation mechanisms of NSMs under various grain sizes, temperatures and strain rates were investigated. It is based on recent modelling that appears to provide a conclusive description of the phenomenology and the mechanisms underlying the mechanical properties of NSMs. Based on the theoretical model that provides an adequate description of the grain size dependence of elasticity and plasticity covering all grain size range from coarse down to the nanoscale, the tensile deformation response of NSMs, especially focusing on the deformation mechanisms was investigated.

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사파이어 웨이퍼 CMP 공정 신뢰성 향상을 위한 혼합 나노실리카 콜로이달 슬러리 (Mixed Nano Silica Colloidal Slurry for Reliability Improvement of Sapphire Wafer CMP Process)

  • 정찬홍
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제14권1호
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    • pp.11-19
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    • 2014
  • A colloidal silica slurry has been manufactured by mixing nano silica powders having different grain size to improve the reliability of Sapphire wafer CMP process. The main reliability problem of CMP process such as the breaking of wafer can be prevented by reducing the size of particles in a slurry. While existing commercial colloidal silica slurries are usually made of single grain size silica powder of about 120nm, in the present study 40nm and 100nm silica powders are mixed to achieve a similar removal rate. The new colloidal silica slurry showed wafer removal rate of $3.04{\mu}m/120min$ while that of a commercial colloidal silica slurry was $3.03{\mu}m/120min$. The roughness was less than $4{\AA}$ and scratch was 0. It is also expected that the reduction of the size of nano silica particles can improve the dispersion stability and prolong the useful life of the slurry.