• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.1
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• pp.87-96
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• 2019

Flexible organic light-emitting diode (OLED) displays with organic thin-film transistors (OTFTs) backplanes have been studied. A gate driver is required to drive the OLED display. The gate driver is integrated into the panel to reduce the manufacturing cost of the display panel and to simplify the module structure using fabrication methods based on low-temperature, low-cost, and large-area printing processes. In this paper, pseudo complementary metal oxide semiconductor (CMOS) logic gates are implemented using OTFTs for the gate driver integrated in the flexible OLED display. The pseudo CMOS inverter and NAND gates are designed and fabricated on a flexible plastic substrate using inkjet-printed OTFTs and the same process as the display. Moreover, the operation of the logic gates is confirmed by measurement. The measurement results show that the pseudo CMOS inverter can operate at input signal frequencies up to 1 kHz, indicating the possibility of the gate driver being integrated in the flexible OLED display.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.1-7
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• 2000

The SNOSFET memory devices with ultrathin ONO(tunnel oxide-nitride-blocking oxide) gate dielectric were fabricated using n-well CMOS process and investigated its characteristics. The thicknesses of tunnel oxide, nitride and blocking oxide were $23{\AA},\; 53{\AA}\; and\; 33{\AA}$, respectively. Auger analysis shows that the ONO layer is made up of $SiO_2(upper layer of blocking oxide)/O-rich\; SiO_x\N\_y$. It clearly shows that the converting layer with $SiO_x\N\_y(lower layer of blocking oxide)/N-rich SiO_x\N\_y(nitride)/O-rich SiO_x\N\_y(tunnel oxide)$. It clearly shows that the converting layer with $SiO_x\N\_y$ phase exists near the interface between the blocking oxide and nitride. The programming condition of +8 V, 20 ms, -8 V, 50 ms is determined and data retention over 10 years is obtained. Under the condition of 8 V programming, it was confirmed that the modified Fowler-Nordheim tunneling id dominant charge transport mechanism. The programmed threshold voltage is distributed less than 0.1 V so that the reading error of memory stated can be minimized. An $8\times8$ NAND type flash EEPROM with SONOSFET memory cell was designed and simulated with the extracted SPICE parameters. The sufficient read cell current was obtained and the upper limit of $V_{TH}$ for write state was over 2V.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.360-369
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• 2012

The causes of showing different subthreshold slopes (SS) in programmed and erased states for two different charge trap flash (CTF) memory devices, SONOS type flash memory with gate-all-around (GAA) structure and TANOS type NAND flash memory with planar structure were investigated. To analyze the difference in SSs, TCAD simulation and low-frequency noise (LFN) measurement were fulfilled. The device simulation was performed to compare SSs considering the gate electric field effect to the channel and to check the localized trapped charge distribution effect in nitride layer while the comparison of noise power spectrum was carried out to inspect the generation of interface traps ($N_{IT}$). When each cell in the measured two memory devices is erased, the normalized LFN power is increased by one order of magnitude, which is attributed to the generation of $N_{IT}$ originated by the movement of hydrogen species ($h^*$) from the interface. As a result, the SS is degraded for the GAA SONOS memory device when erased where the $N_{IT}$ generation is a prominent factor. However, the TANOS memory cell is relatively immune to the SS degradation effect induced by the generated $N_{IT}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.82-82
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• 2008

One-dimensional (1D) nanowires have been received much attention due to their potential for applications in various field. Recently some logic applications fabricated on various nanowires, such as ZnO, CdS, Si, are reported. These logic circuits, which consist of two- or three field effect transistors(FETs), are basic components of computation machine such as central process unit (CPU). FETs fabricated on nanowire generally have surrounded shapes of gate structure, which improve the device performance. Highly integrated circuits can also be achieved by fabricating on nano-scaled nanowires. But the numerical and SPICE simulation about the logic circuitry have never been reported and analyses of detailed parameters related to performance, such as channel doping, gate shapes, souce/drain contact and etc., were strongly needed. In our study, NAND and NOT logic circuits were simulated and characterized using 2- and 3-dimensional numerical simulation (SILVACO ATLAS) and built-in spice module(mixed mode).

• Journal of the Korean Institute of Telematics and Electronics
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• v.17 no.6
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• pp.51-57
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• 1980

Any switching function can be constructed with universal building block of MAND gate. Threelevel AND-NOT logic networks with only true inputs are called TANT networks. Systematic approach to TANT minimization starts from the UF type minterm with the smallest subscript and ends when UF type minterms are all covered. Optinal PEI is composed of CPPI or EPPi without C-C table. The algorithm in this work is usful in solving TANT optimization porblem of four or five variables by hand solution. When variable are six or more, it is required to be solved by computer, A CAD software package of this algorithm with FORTRAN IV language is made to solve such problems.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.17 no.1
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• pp.165-184
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• 2023

The ARX-based lightweight block cipher is widely used in resource-constrained IoT devices due to fast and simple operation of software and hardware platforms. However, there are three weaknesses to ARX-based lightweight block ciphers. Firstly, only half of the data can be changed in one round. Secondly, traditional ARX-based lightweight block ciphers are static structures, which provide limited security. Thirdly, it has poor diffusion when the initial plaintext and key are all 0 or all 1. This paper proposes a new dynamic ARX-based lightweight block cipher to overcome these weaknesses, called DABC. DABC can change all data in one round, which overcomes the first weakness. This paper combines the key and the generalized two-dimensional cat map to construct a dynamic permutation layer P1, which improves the uncertainty between different rounds of DABC. The non-linear component of the round function alternately uses NAND gate and AND gate to increase the complexity of the attack, which overcomes the third weakness. Meanwhile, this paper proposes the round-based architecture of DABC and conducted ASIC and FPGA implementation. The hardware results show that DABC has less hardware resource and high throughput. Finally, the safety evaluation results show that DABC has a good avalanche effect and security.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.111-114
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• 2000

Single Electron Transistor Logic (SETL) can be characterized by HSPICE simulation using a SPICE macro model. First, One unit SET is characterized by Monte-carlo simulation and then we fit SPICE macro-modeling equations to its characteristics. Second, using this unit SET, we simulate the transient characteristics of two-input NAND gate in both the static and dynamic logic schemes. The dynamic logic scheme shows more stable operation in terms of logic-swing and on/off current ratio. Also, there is a merit that we can use the SET only as current on-off switch without considering the voltage gain.

• Proceedings of the Korean Society of Computer Information Conference
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• 2017.01a
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• pp.145-146
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• 2017

본 논문에서는 CPLD 구조를 고려한 게이트 레벨 글리치 제거 방법에 대해 제안하였다. CPLD는 AND-OR 게이트의 2단 구조를 가진 LE를 기본 구조로 구성되어 있는 소자이다. CPLD로 구현할 회로에 대한 DAG를 CPLD 구조에 맞도록 그래프를 분할하여 매핑가능클러스터를 생성한다. 생성된 매핑가능클러스터는 내부의 글리치와 전체 회로에 대한 글리치 발생 가능성을 검사하여 글리치를 제거한다. AND게이트와 OR게이트를 사용하는 2단 구조는 게이트가 달라 글리치가 발생될 수 있는 가능성을 검사하기 어렵다는 단점이 있어 AND-OR 게이트의 2단 구조와 동일한 구조를 가지고 있으며 게이트가 동일한 NAND 게이트를 이용하여 전체 회로를 변환한 후 글리치 발생여부를 검사함으로서 정확한 글리치 발생 가능성을 제거한다. 실험 결과는 제안 된 알고리즘 [10]과 비교하였다. 소비 전력이 2 % 감소되어 본논문에서 제안한 방법의 효율성이 입증되었다.

• Proceedings of the IEEK Conference
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• 2000.07a
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• pp.347-350
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• 2000

We present the design of ternary flip-flop which is based on ternary logic so as to process ternary data. These flip-flops are fabricated with ternary voltage mode NOR, NAND, INVERTER gates. These logic gate circuits are designed using CMOS and obtained the characteristics of a lower voltage, a lower power consumption as compared to other gates. These circuits have been simulated with the electrical parameters of a standard 0.25 micron CMOS technology and 2.5 volts supply voltage. The Architecture of proposed ternary flip-flop is highly modular and well suited for VLSI implementation, only using ternary gates.