• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.79-79
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• 1999

The varous techniques for fabrication of si or metal tip as a field emission electron source have been reported due to great potential capabilities of flat panel display application. In this report, 240nm thermal oxide was initially grown at the p-type (100) (5-25 ohm-cm) 4 inch Si wafer and 310nm Si3N4 thin layer was deposited using low pressure chemical vapor deposition technique(LPCVD). The 2 micron size dot array was photolithographically patterned. The KOH anisotropic etching of the silicon substrate was utilized to provide V-groove formation. After formation of the V-groove shape, dry oxidation at 100$0^{\circ}C$ for 600 minutes was followed. In this procedure, the orientation dependent oxide growth was performed to have a etch-mask for dry etching. The thicknesses of the grown oxides on the (111) surface and on the (100) etch stop surface were found to be ~330nm and ~90nm, respectively. The reactive ion etching by 100 watt, 9 mtorr, 40 sccm Cl2 feed gas using inductively coupled plasma (ICP) system was performed in order to etch ~90nm SiO layer on the bottom of the etch stop and to etch the Si layer on the bottom. The 300 watt RF power was connected to the substrate in order to supply ~(-500)eV. The negative ion energy would enhance the directional anisotropic etching of the Cl2 RIE. After etching, remaining thickness of the oxide on the (111) was measured to be ~130nm by scanning electron microscopy.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.253-256
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• 2017

A thin Te interlayer was applied to a Ni/n-InGaAs contact to reduce the contact resistance between Ni-InGaAs and n-InGaAs. A 5-nm-thick Te layer was first deposited on a Si-doped n-type $In_{0.53}Ga_{0.47}As$ layer, followed by in situ deposition of a 30-nm-thick Ni film. After the formation of the Ni-InGaAs alloy by rapid thermal annealing at $300^{\circ}C$ for 30 s, the extracted specific contact resistivity (${\rho}_c$) reduced by more than one order of magnitude from $2.86{\times}10^{-4}{\Omega}{\cdot}cm^2$ to $8.98{\times}10^{-6}{\Omega}{\cdot}cm^2$ than that of the reference sample. A thinner Ni-InGaAs alloy layer with a better morphology was obtained by the introduction of the Te layer. The improved interface morphology and the graded Ni-InGaAs layer formed at the interface were believed to be responsible for ${\rho}_c$ reduction.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Applied Chemistry for Engineering
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• v.25 no.2
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• pp.174-180
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• 2014

A plasma hydrophobic coating on commercial fish feed was conducted to prolong the floating time of feed, thereby enhancing the feed consumption rate and reducing the contamination of water in fish farms. The hydrophobic coating on the fish feed was prepared using an atmospheric-pressure dielectric barrier discharge (DBD) plasma with hexamethyldisiloxane (HMDSO), toluene and n-hexane as the precursors. The effect of the parameters such as input power, precursor type and coating time on the coating performance were examined. The physicochemical properties of the coating layer were analyzed using a Fourier transform infrared (FTIR) spectrometer and a contact angle (CA) analyzer. The water CA increased after the coating preparation, indicating that the surface changed from hydrophilic to hydrophobic. The FTIR characterization revealed that the hydrophobic layer was comprised of functional groups such as $CH_3$, Si-O-Si and Si-C. As a result of the hydrophobic coating, the floating time of the fish feed increased from several seconds to 3 minutes, which suggested that the plasma coating method could be a viable means for practical applications. Compared to the water CA measured as soon as the coating layer was prepared, the 6-day aged sample exhibited a substantial CA increase, confirming the aging effect on the improvement of the hydrophobicity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.177-177
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• 2007

ZnO는 3.36eV의 넓은 밴드캡을 가지는 II-IV족 반도체로써 태양전지, LED와 같은 광학적 소자로 이용이 기대가 되는 물질이다. 더욱이, 상온에서의 60meV에 해당하는 큰 엑시톤 에너지와 밴드캡 에지니어링이 가능하다는 장점 때문에 광학적 소자로 널리 이용되고 있는 GaN을 대체할 수 있는 물질로 주목을 받고 있다. 하지만, p-type ZnO는 형성이 어렵고 낮은 이동도와 케리어 농도의 특성을 보이고, 대기 중에 장시간 노출할 경우 n-type ZnO의 특성으로 돌아가는 불안정성을 보이고 있다. 최근에 몇몇의 연구자들에 의해 V족의 원소인 P(phosphorous), N(nitrogen), As(arsenic))를 도핑하여 p-type ZnO의 형성에 대한 논문이 발표되고 있다. 또한, V족 원소 중에 P는 p-type ZnO 형성에 효과적인 도핑 물질로 보고되 고 있다. 본 연구는 마그네트론 스퍼터링을 이용하여 다양한 온도에서 성장된 P도핑 ZnO 박막의 특성에 대해 연구하였다. P도핑된 ZnO 박막은 사파이어 기판에 buffer층을 사용한 Insulator 특성의 ZnO박막위에 400, 500, 600, $700^{\circ}C$에서 성장되 었다. 박막의 특성 분석에는 325nm의 파장을 가지는 He-Cd의 레이져 광원을 사용하여 10K의 저온 PL과 0.5T의 자기장을 사용한 van der Pauw configuration에 의한 Hall effect측정, 그리고 결정성 분석에는 XRD와 TEM을 이용하였다. 상온 Hall-effect 측정 결과, $400{\sim}600^{\circ}C$ 에서 성장된 박막은 n-type의 특성을 보였고, $700^{\circ}C$에서 성장된 Phosphorous 도핑 ZnO박막은 $1.19{\times}10^{17}$의 캐리어 농도를 가지는 p-type의 특성을 보였다. 그리고 XRD분석과 TEM분석을 통하여 박막의 성장온도가 증가 할수록 P도핑된 ZnO박막의 결정성이 향상되는 것을 알 수 있었다. 또한 10K의 저온 PL분석을 통해 p도핑에 의한 액셉터에 관련된 피크들을 관찰할 수 있었다.

• Polymer(Korea)
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• v.24 no.4
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• pp.571-577
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• 2000

A new type of filler for epoxy-clay nanocomposites has been prepared by the reaction of octadecyltrimethylammonium bromide and layered sodium montmorillonite (MMT) via an ion-exchange reaction. The gallery space was further modified by grafting the aminopropyl groups via a reaction between a octadecyltrimethylammonium-MMT and 3-aminopropyltriethoxysilane (APS). The interlayer modification of MMT was confirmed by XRD, IR, and solid-state $^{29}$ Si CP/MAS NMR. Furthermore, clay-polymer nanocomposites have been synthesized by the polymerization of diglycidyl ether of bisphenol A(DGEBA) and $C_{18}$ H$_{37}$ N($CH_3$)$_3$-APS-MMT. The resulting hybrid nanocomposites were characterized by XRD, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results proved that the organomontmorillonite could be exfoliated and uniformly dispersed in the epoxy matrix.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.504-504
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• 2011

최근 디지털 프린팅 기술의 핵심기술로 떠오르고 있는 잉크젯 프린팅 기술은 최근 기존의 문서인쇄 뿐 아니라, 직물 인쇄, 태양전지 등의 다양한 반도체 소자 제조에 널리 활용되고 있으며, 점차 그 응용 분야를 넓혀가고 있다. 특히 thermal 방식의 잉크젯 피린팅 기술은 etching, thin film process, lithography등의 반도체 공정 기술을 이용하여 제작할 수 있기 때문에, 현재 잉크젯 프린팅 기술은 대부분 thermal 방식을 체택하고 있다. 이러한 thermal 잉크젯 프린팅 방법에서는 잉크를 토출시키기 위하여, 전기적 에너지를 열에너지로 전환하는 전자저항막층이 필수적으로 필요하게 되는데, 이러한 전자저항막층은 수백도가 넘는 고온 및 잉크와 접촉으로 인한 부식 및 산화 문제가 발생할 수 있는 열악한 환경에서 사용되므로, Ta, SiN과 같은 보호층을 필수적으로 필요로 한다. 그러나 최근 잉크젯 프린터의 고해상도 고속화, 대면적 인쇄성 등과 같은 다양한 요구 증가에 따라, 잉크젯 프린터의 저전력 구동이 이슈로 떠올라 열효율에 방해가 되는 보호층을 제거할 필요성이 제기되고 있다. 지금까지는 Poly-Si, $HfB_2$, TiN, TaAl, TaN _0.8 등의 물질들이 잉크젯 프린터용 전자저항막 물질로 연구되거나 실제로 사용되어져 왔으나, 이러한 물질들을 보호층을 제거하는 경우 쉽게 산화되거나, 부식되는 문제점을 가지고 있다. 따라서, 기존 전자저항막의 기능을 만족시키면서, 산화나 부식에 대한 강한 내성을 가져 보호층을 제거하더라도 안정적으로 구동이 가능한 하이브리드 기능성(히터 + 보호층)을 가지는 잉크젯 프린터용 전자저항막 물질의 개발이 시급한 실정이다. 본 연구에서는 자기조립특성을 가져 정밀제어가 가능한 원자층증착법(Atomic Layer Deposition)을 이용하여 원자/나노 단위의 미세 구조 컨트롤을 통해 내열 내산화 내부식성 저온도저항계수를 동시에 가지는 다기능성 전자저항막을 설계 및 개발하고자 하였다. 전자저항막 개발을 위하여 우수한 내부식 내산화성을 가지고 결정립 크기에 따른 온도저항계수 조절이 가능한 platinum group metal들과 전기 저항 및 내열성 향상을 위한 물질의 복합구조막을 원자증증착법으로 증착하였다. 또한, 전자저항막 증착시 미세구조와 공정 변수가 내부식성, 내산화성, 그리고 온도저항계수에 미치는 영향을 체계적으로 연구하여, proto-type의 inkjet printhead를 구현하였다.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.17-26
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• 2013

In contrast to conventional crystalline cells, back-contact solar cells feature high efficiencies, simpler module assembly, and better aesthetics. The highest commercialized cell and module efficiency was recorded by n-type back-contact solar cells. However, the mainstream PV industry uses a p-type substrate instead of n-type due to the high costs and complexity of the manufacturing processes in the case of the latter. P-type back-contact solar cells such as metal wrap-through and emitter wrap-through, which are inexpensive and compatible with the current PV industry, have consequently been developed. In this paper the characteristics of EWT (emitter wrap-through) solar cells and their status and prospects for development are discussed.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.3 no.2
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• pp.25-31
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• 1996

Various treaments such heating, acid tenting, acid healing, alkaline treating, acid+alkaline renting were attempted to investigate their effects on molar ratio, chemical composition, DTA and specific surface area(SSA) of natural zeolite poder. Molar ratio, Si to AI. of natural zeolite was 4.78, which represented high silica type. Composition of natural zeolite showed that $SiO_2$ was 66.34% $Al_2O_3$ was 13.89%, $Fe_2O_2$ was 1.55% X-ray diffraction showed that main component of natural zeolite was mordenite and clinoptliolite. Differential Thermal Analysis and Thermogravimetry curve of natural zeolite was showed to peak of endothermic peak at $80^{\circ}C$ and it means to the peak of dehydrate reaction, but recristalization was not formed below at $1,000^{\circ}C$. Weight loss during calcination was 16% at $1,000^{\circ}C$. Thermal treatments on SSA of natural zolite powder decreased from $75.2m^2/g\;to\;2.1m^2/g$. In contrast chemical treatments on SSA showed to increase to $300.2m^2/g$(1 N HCl treating), $54.9m^2/g$(1 N NaOH) and $90.9m^2/g$(HCl+NaOH)tudy, it could be proposed to employ acid tret method as packaging materisls for MA packaging.

• Korean Journal of Materials Research
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• v.30 no.10
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• pp.509-514
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• 2020

The two key variables of an Si solar cell, i.e., emitter (n-type window layer) and base (p-type substrate) doping levels or concentrations, are studied using Medici, a 2-dimensional semiconductor device simulation tool. The substrate is p-type and 150 ㎛ thick, the pn junction is 2 ㎛ from the front surface, and the cell is lit on the front surface. The doping concentration ranges from 1 × 10¹⁰ cm^-3 to 1 × 10²⁰ cm^-3 for both emitter and base, resulting in a matrix of 11 by 11 or a total of 121 data points. With respect to increasing donor concentration (Nd) in the emitter, the open-circuit voltage (Voc) is little affected throughout, and the short-circuit current (Isc) is affected only at a very high levels of Nd, exceeding 1 × 10¹⁹ cm^-3, dropping abruptly by about 12%, i.e., from Isc = 6.05 × 10^-9 A·㎛^-1, at Nd = 1 × 10¹⁹ cm^-3 to Isc = 5.35 × 10^-9 A·㎛^-1 at Nd = 1 × 10²⁰ cm^-3, likely due to minority-carrier, or hole, recombination at the very high doping level. With respect to increasing acceptor concentration (Na) in the base, Isc is little affected throughout, but Voc increases steadily, i.e, from Voc = 0.29 V at Na = 1 × 10¹² cm^-3 to 0.69 V at Na = 1 × 10¹⁸ cm^-3. On average, with an order increase in Na, Voc increases by about 0.07 V, likely due to narrowing of the depletion layer and lowering of the carrier recombination at the pn junction. At the maximum output power (Pmax), a peak value of 3.25 × 10^-2 W·cm^-2 or 32.5 mW·cm^-2 is observed at the doping combination of Nd = 1 × 10¹⁹ cm^-3, a level at which Si is degenerate (being metal-like), and Na = 1 × 10¹⁷ cm^-3, and minimum values of near zero are observed at very low levels of Nd ≤ 1 × 10¹³ cm^-3. This wide variation in Pmax, even within a given kind of solar cell, indicates that selecting an optimal combination of donor and acceptor doping concentrations is likely most important in solar cell engineering.