• Structural Engineering and Mechanics
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• v.60 no.2
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• pp.175-191
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• 2016

The present article is aimed at an investigation of stresses produced in a microstretch elastic half-space due to a moving load. The expressions of normal stress, shear stress and tangential couple stress produced in this case have been obtained in closed form. To find the displacement fields the perturbation method is applied. Significant effect of moving load on variation of stresses developed at different depths below the surface due to the depth of substrate and frictional coefficient of the rough surface of the medium has been observed. The effects of different shapes of irregularity and depth of irregularity on normal, shear and tangential couple stresses have been discussed. Some particular cases have also been deduced from the present investigation. Finally, the analytical developments have been illustrated numerically for aluminium-epoxy-like material substrate under the action of moving load.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.327-331
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process as a formation of electrode such as metal or transparent conductive oxide layer. A reverse moving system was equipped in the in-line wet etch/cleaning system for the alternating motion of glass substrate in a wet etch bath of the system. Therefore, it was possible for the glass substrate to be moved back and forth and it was possible to reduce the size of the system by using the reversing moving system. For the effect of the alternating motion of substrate on the etch rate in the in-line wet etch bath, indium tin oxide(ITO) patterns were obtained through wet etch process in the in-line system in which the substrate was moved back and forth. From the CD(critical dimension) skews resulted from the ADI CD and ACI CD of the ITO patterns, it was concluded that the alternating motion of glass substrate are possible to be applied to the mass production of wet etch process.

• Progress in Superconductivity
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• v.8 no.1
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• pp.93-97
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• 2006

YBCO films were deposited on a moving substrate by a spray pyrolysis method using nitrate aqueous solution as precursors. Deposition was made on $LaAlO_3$(100) single crystal substrate by spraying precursor droplets generated by a concentric nozzle. The cation ratio of precursor solution was Y:Ba:Cu=1:2.65:4.5. The distance between nozzle and substrate was 15 cm. Substrate was transported with a speed ranging from 0.23 cm/min to 0.5 cm/min. Films were deposited at the pressure ranging from 10 Torr to 20 Torr and the deposition temperature was ranged from $740^{\circ}C\;to\;790^{\circ}C$. Oxygen partial pressure was controlled between 1 Tow and S Torr. Superconducting YBCO films were obtained from $740^{\circ}C\;to\;790^{\circ}C$ with an oxygen partial pressure of 3 Torr. Scanning electron microscope(SEM) and X-ray diffraction(XRD) observation revealed that films are smooth and highly texture with(001) plans parallel to substrate plane. Highest Jc was 0.72 $MA/cm^2$ at 77K and self-field for the film with a thickness of 0.15 m prepared at a substrate temperature of $740^{\circ}C$ and $PO_2$=3 Torr.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.863-866
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• 2008

For the cost reduction in the fabrication of display panels, a reverse moving system was equipped to a compacted in-line wet etch/cleaning system. For the effect of the alternating movement of substrate on the wet etch process, ITO layers were etched in various moving modes of substrates and the results were compared and analyzed.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.42-44
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• 2003

The paper presents the method and apparatus for conformal photoresist spray coating on the 3D structured substrate. The system consists of a high-temperature-rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. The coating uniformity is acquired by controlling the moving speed of the ultrasonic spray nozzle across the substrate which is rotated constantly. To coat the photoresist conformally the spray angle of the nozzle and the temperature of the substrate are controlled during spray coating. The rotational chuck can be heated up by hot air or $N_2$. The photoresist (AZ1512) has been coated on the 3D structured wafer by spray coating system and the characteristics have been evaluated.

• Smart Structures and Systems
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• v.23 no.1
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• pp.31-44
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• 2019

The present study investigate the compressive stress, shear stress, tensile stress, vertical electrical displacement and horizontal electrical displacement induced due to a load moving with uniform velocity on the free rough surface of an irregular transversely isotropic functionally graded piezoelectric material (FGPM) substrate. The closed form expressions ofsaid induced stresses and electrical displacements for both electrically open condition and electrically short condition have been deduced. The influence of various affecting parameters viz. maximum depth of irregularity, irregularity factor, parameter of functionally gradedness, frictional coefficient of the rough upper surface, piezoelectricity/dielectricity on said induced stresses and electrical displacements have been examined through numerical computation and graphical illustration for both electrically open and short conditions. The comparative analysis on the influence of electrically open and short conditions as well as presence and absence of piezoelectricity on the induced stresses and induced electrical displacements due to a moving load serve as the salient features of the present study. Moreover, some important peculiarities have also been traced out by means of graphs.

• Particle and aerosol research
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• v.13 no.3
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• pp.111-118
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• 2017

Electrohydrodynamic (EHD) printing with the aid of strong electric fields can generate and pattern droplets that are smaller than droplets by other printing technologies. Conventional EHD printing has created two-dimensional (2D) patterns by moving its nozzle or a substrate in X and Y directions. In this study, we aimed to develop an EHD system that can create 2D patterns using a multielectrode array (MEA) without moving a nozzle or substrate. In particular, printing ink mixtures of biodegradable polymers and model dyes was patterned on a thin film made of another biodegradable polymer. Without movement of a nozzle and substrate, stable 2D patterning of minimum $6{\mu}m$ size over a range of about 1 mm away from the nozzle position was achieved by MEA control only. We also demonstrated the possibility of denser 2D pattering of the ink mixtures by moving a target substrate relative to MEA position.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 1997.11a
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• pp.162-168
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• 1997

A theoretical model for the interaction of the moving heat source and a solid substrate when they are in contact is described. for purposes of the model the substrate is assumed to act as a continuum and the Fourier equation for transient. three-dimensional conduction is solved using Laplace and Fourier transformations. Unlike most previous models, this model shows the explicit relations between the properties of heat source and that of the substrate. Since the size, shape and speed of heat source impact the ignition of substrate, considerable attention is devoted to evaluating these parameters. Results are presented which show the effects of the size, shape and speed of heat source on the substrate.

• 한국초전도학회:학술대회논문집
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• v.16
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• pp.99-99
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• 2006

• Journal of Welding and Joining
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• v.18 no.4
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• pp.55-63
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• 2000

This paper presents a study of the solder bumping process. The theoretical model, based on the variational principle instead of solving the Navier-Stokes equation with moving boundaries, was developed to considered the energy dissipation in semi-solid phase and the approximate solidification time of the molten metal droplet. The simulation results revealed that the developed model could reasonably describe the collision behavior of molten metal with solid surface. Simulations were made with variation of initial droplet temperature, substrate metal and initial substrate temerature.