• Title/Summary/Keyword: mounter

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A Study of Dynamic Characteristics for Frame Base of the Chip Mounter (표면실장기 기저부의 동특성 연구)

  • 성기창;박진무
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.807-811
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    • 2002
  • As the requirements on precision and speed of motion in chip mounter increase, vibration forces are always exerted on operating conditions. To insure safety of the chip mounter, the vibration must be kept within an acceptable limit. The focus of this paper is on the identification of dynamic load characteristics and the estimation of static and dynamic stiffness characteristics for Frame Base by judicious selection of the number and the location of the support points. This study carried an analytical and experimental method to estimate the dynamic characteristics in structure.

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Simultaneous Positioning and Vibration Control of Chip Mounter with Structural Flexibility (칩마운터 구조물의 유연성을 고려한 위치와 진동 동시 제어)

  • Kang, Min Sig
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.1
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    • pp.53-59
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    • 2013
  • Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

Development of measuring and calibrating technology for moving error and precision of chip mounter using Ball Bar (Ball Bar를 이용한 칩마운터의 운동 오차 정밀도 측정 및 평가 기술 개발)

  • 이창하;김정환;박희재
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.621-628
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    • 2000
  • A kinematic ball bar measuring system can analyze the various errors of a machine tool easil rapidly with only one measurement, But it cannot be used to measure the errors of the equipment the semiconductor manufacturing (e.g. chip mounter, PCB router etc.) not to use a cir interpolation. This paper presents the method to apply a kinematic ball bar measuring system tc machines which use merely a linear interpolation Also, the work of measuring and calibratir various errors of a chip mounter with a kinematic bal1 bar measurement system is accomplished

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Dynamic characteristic analysis of SMT mounter system (SMT 마운터의 동특성 분석)

  • Rim, Kyung-Hwa;Jung, Jin-Ho;Beom, Hee-Rak
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2011.10a
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    • pp.440-445
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    • 2011
  • Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

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Improvement in Operation Efficiency for Chip Mounter Using Web Server

  • Lim, Sun-Jong;Joon Lyou
    • International Journal of Precision Engineering and Manufacturing
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    • v.4 no.6
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    • pp.5-11
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    • 2003
  • The number of the enterprises which utilize network technology has been increasing for solving problems such as productivity improvement, market trend analysis, and material collection for making decision. Especially, the management of equipment and the recovery time reduction when machines break down are very important factors in productivity improvement of the enterprise. Currently, most of the remote trouble diagnosis of equipment using the internet have just one function of transmitting the trouble information to the user. Therefore it does not directly reflect the user's recovery experience or the developer's new recovery methods. If the user's experienced recovery methods or the developer's recovery methods as well as the basic recovery methods are reflected online or on the internet, it makes it possible to recover faster than before. In this paper, we develop a Remote Monitoring Server (RMS) for chip mounters, and make it possible to reduce the recovery time by reflecting the user's experience and developer's new methods in addition to presenting the basic recovery methods. For this, trouble recovery concept will be defined. Based on this, many functions(trouble diagnosis, the presentation of the basic recovery methods, user's and developer's recovery method, counting function of the trouble number of each code, and presentation of usage number of each recovery methods) were developed. By utilizing the reports of the actual results of chip mounter and the notice function of the parts change time, the rate of operation of the chip mounter can be improved.

A Study on the Design of Small SMT Platform for Education (교육용 소형 SMT 플랫폼 설계에 관한 연구)

  • Park, Se-Jun
    • Journal of Platform Technology
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    • v.8 no.1
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    • pp.24-32
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    • 2020
  • This paper designed and manufactured a chip mounter based on 3D printer technology that can be used for educational research or sample production to disseminate chip mounter, a core technology of SMT line. A stepper motor with open loop control is used for low cost drive design. The shortcomings of the motor's vibration and disassembly caused by the use of the step motor were compensated by the Micro-Step control method. In the chip mounter experiment, the gerber file was generated on the small chip mounter, printed at the actual size, and the solder cream was printed on the HASL-treated PCB in the same manner as the sample board fabrication. As a result of the experiment, unlike the 2012 micro components, parts such as SOIC and TQFP that require correction are twice as long as the component mounting time, but it can be confirmed that they are mounted relatively accurately. In addition, as a result of repeatedly measuring the error of the initial position 10 times, it was confirmed that a relatively small error of about 0.110mm occurs.

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Compatibility Solution of IC Information for Board Production Automation (보드 생산 자동화를 위한 IC 정보의 호환성 Solution)

  • Kim, Gui-Jung
    • Proceedings of the Korea Contents Association Conference
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    • 2006.11a
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    • pp.512-515
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    • 2006
  • This paper proposes the solution of compatibility problem between heterogeneous by converting automatically CAD data into proper data for the PCB board production process by using IC item information. This paper has a purpose of maximizing work efficiency with NC Programming automation and contributing to maximize productivity by NC program conversion of different Mounters and Mounter Data & Line Balance optimization.

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A PC-based Control Software for Wafer Tape Mounter (PC 기반의 웨이퍼 테이프 마운터 (Wafter Tape Mounter) 제어 소프트웨어)

  • Jeon, Chanug;Kim, Sang-Chul;Lee, Song-Rak
    • Annual Conference of KIPS
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    • 2002.11c
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    • pp.2395-2398
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    • 2002
  • 국내의 반도체산업의 비약적인 발전과 함께 반도체 장비의 국산화에 대한 시도가 점차로 확산되어 가고있다. 최근 일본의 수입장비에만 의존하던 웨이퍼 테이프 마운터 (Wafer Tape Mounter) 장비가 국산화됨으로써 원가절감에 크게 기여하였다. 본 논문에서는 국산 웨이퍼 테이프 마운터 장비의 동작을 제어하는 운영 소프트웨어에 대해서 기술한다. PLC 기반의 기존 외국 장비와는 달리 국산 장비는 PC 기반으로 동작함으로써, 제어 소프트웨어의 역할이 훨씬 커지게 되었고, 기능의 추가 변경이 용이한 점이 장점이다. 소프트웨어는 여러개의 장치 (모터 등)을 동시에 구동하기 위한 효과적인 멀티스레딩 구조를 갖는다. 우리의 조사에 따르면, PC기반 웨이퍼 테이프 마운터의 제어 소프트웨어에 대한 연구는 거의 발표된 적이 없었다.

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Dynamic Behavior Analysis of Driving Part in CHIP MOUNTER (CHIP MOUNTER 구동부의 동적 거동 해석)

  • 박원기;박진무
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.471-474
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    • 2001
  • Recently, due to demands of faster speed and extra features for the chip mounters, there has been ever-demanding needs for the basic technology. Until four or five years ago, chip mounters placing 0.3sec/chip were considered to be in the high speed category, but since then it has become a borderline for categorizing high speed machines capable of placing 0.1sec/chip. In this study, in order to analyze the vibration of head generated by the dynamic behavior of x-frame, FEM model is composed and modal analysis is performed to identify the dynamic characteristics of the structure. Those results are compared with the modal test in order to verify the model. In this paper, Several other factors, such as definition of dynamic accuracy, static accuracy and tolerance of the axis settling range, that might affect the dynamic behavior the head are discussed.

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