• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.11
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• pp.24-30
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• 2018

Various investigations of vegetable oil extracted from natural resources are underway because of their low cost and environmental value. On the other hand, the double bonds in vegetable oil should be substituted to other high reactive functional groups due to their low reactivity for synthesizing bio-polymeric materials. ${\alpha}$-eleostearic acid, which consists of a conjugated triene, is the main component of tung oil, and the conjugated triene allows tung oil to have higher reactivity than other vegetable oils. In this study, tung oil was copolymerized with styrene and divinylbenzene to make a thermoset resin without any substitution of functional groups. The thermal and mechanical properties were measured to examine the effects of the composition of each monomer on the synthesized thermoset resin. The results showed that the products have only one Tg, which means the synthesized thermoset resins are homogeneous at the molecular level. The mechanical properties show that tung oil acts as a soft segment in the copolymer and makes a more elastic product. On the other hand, divinylbenzene acts as a hard segment and makes a more brittle product.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.623-626
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• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Korean Chemical Engineering Research
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• v.49 no.1
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• pp.75-82
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• 2011

Five different composition UV-cured poly(urethane acrylate-co-acrylic acid) (PU-co-AA) films have been prepared by reacting isophorone diisocyanate(IPDI), polycaprolactone triol(PCLT), 2-hydroxyethyl acrylate(HEA), and different weight ratio trimethylolpropane triacrylate(TMPTA) and acrylic acid(AA) as diluents, and characterized using a Fourier transform infrared spectroscopy(FT-IR). The adhesion properties onto the stainless steel, morphology, mechanical hardness, and electrical property of UV-cured PU-co-AA films were investigated as a function of acrylic acid(AA) content. All the PU-co-AA films are structure-less and the molecular ordering and packing density decreased with increasing content of AA due to the flexible structure and -COOH side chains in AA. The crosscut test showed that PU-co-AA films without AA and with low content of AA showed 0% adhesion(0B) and the adhesion of PU-co-AA films in the range of 40-50% AA increased dramatically as the content of AA increases. The pull-off measurements showed that the adhesion force of PU-co-AA films to stainless steel substrate varied from 6 to 31 kgf /$cm^2$ and increased linearly with increasing AA content. The mechanical hardness also decreased as the content of AA increases. This may come from relatively linear and flexible structure in AA and low crystallinity in PU-co-AA films with higher content of AA. The higher AA-containing PU-co-AA films showed higher dielectric constant due to the increase of polarization by introducing AA monomer. In conclusion, the physical properties of UV-cured PU-co-AA films are strongly dependent upon the content of AA and the incorporation of AA in polyurethane acrylate is very useful way to increase the adhesion strength of UV-curable polymers on the stainless steel substrate.

• Korean Journal of Optics and Photonics
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• v.21 no.2
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• pp.82-88
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• 2010

Photopolymer is a material for recording three dimensional holograms containing photo information. Photopolymer has been found to be a proper material due to many advantages such as high DE value, easy processing, and low price. Compositions of PVA, monomer, initiater and photosensitizer were determined by previous experiments and the compositions of $SeO_2$ and $TiO_2$ were considered as variable to find out the effects of $TiO_2$ on DE. The DE values were constant for the varying compositions of $TiO_2$ (0.1 mg~1.0 mg). In other words, $TiO_2$ is not directly effective on the DE values. Composition change experiments from $SeO_2$ 0.1 mg, $TiO_2$ 0.9 mg to $SeO_2$ 0.9 mg, $TiO_2$ 0.1 showed a maximum DE value of 73.75% at a component of $SeO_2$ 0.8 mg, $TiO_2$ 0.2 mg. It seemed that regardless of the amount of $TiO_2$, increasing the amount of $SeO_2$ gently increases DE`s. If nano particles are heavily added, transparent films could not be made due to the separation of particles by the solubility decrease. Photopolymer films could be made with high DE values for an extensive angle range if $TiO_2$ additions were kept minimum and $SeO_2$ additions were kept maximum.