• The Journal of Korean Academy of Prosthodontics
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• v.35 no.1
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• pp.221-243
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• 1997

The objective of this study was to characterize the mechanical properties of $Y_{2}O_{3}$-containing glass infiltrated ceramic core material, which was made by pressureless powder packing method. A pure alumina powder with a grain size of about $4{\mu}m$ was packed without pressure is silicon mold to form a bar shaped sample, and applied PVA solution as a binder. Samples were sinterd at $1350^{\circ}C$ for 1 hour. After cooling, $Y_{2}O_{3}$-containing glass($SiO_{2},\;Y_{2}O_{3},\;B_{2}O_{3},\;Al_{2}O_{3}$, ect) was infiltrated to the sinterd samples at $1300^{\circ}C$ for 2 hours and cooled. Six different proportions $Y_{2}O_{3}$ of were used to know the effect of the mismatch of the thermal expansion coefficient between alumina powder and glass. The samples were ground to $3{\times}3{\times}30$ mm size and polished with $1{\mu}m$ diamond paste. Flexural strength, fracture toughness, hardness and other physical properties were obtained, and the fractured surface was examined with SEM and EPMA. Ten samples of each group were tested and compared with In-Ceram(tm) core materials of same size made in dental laboratory. The results were as follows : 1. The flexural strengths of group 1 and 3 were significantly not different with that of In-Ceram, but other experimental groups were lower than In-Ceram. 2. The shrinkage rate of samples was 0.42% after first firing, and 0.45% after glass infiltration. Total shrinkage rate was 0.87%. 3. After first firing, porosity rate of experimental groups was 50%, compared with 22.25% of In-Ceram. After glass infiltration, porosity rate of experimental groups was 2%, and 1% in In-Ceram. 4. There was no statistical difference in hardness between two materials tested, but in fracture toughness, group 2 and 3 were higher than In-Ceram. 5. The thermal expansion coefficients of experimental groups were varied to $4.51-5.35{\times}10^{-6}/^{\circ}C$ according to glass composition, also the flexural strengths of samples were varied. 6. In a view of SEM, many microparticles about $0.5{\mu}m$ diameter and $4{\mu}m$ diameter were observed in In-Ceram. But in experimental group, the size of most particles was about $4{\mu}m$, and a little microparticles was observed. The results obtained in this study showed that the mismatch of the thermal expansion coefficients between alumina powder and infiltrated glass affect the flexural strength of alumin/glass composite. The $Y_{2}O_{3}$-containing glass infiltrated ceramic core made by powder packing method will takes less time and cost with sufficient flexural strength similar to all ceramic crown made with slip casting technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.151-157
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• 2023

Integrating dielectric materials into LTCC is a convenient method to increase the integration density in electronic circuits. To enable co-firing of the high-k and low-k dielectric LTCC materials in a multi-material hetero-laminate, the shrinkage characteristics of both materials should be similar. Moreover, thermal expansion mismatch between materials during co-firing should be minimized. The alternating stacking of an LTCC with silica filler and that with calcium-zirconate filler was observed to examine the use of the same glass in different LTCCs to minimize the difference in shrinkage and thermal expansion coefficient. For the LTCC of silica filler with a low dielectric constant and that of calcium zirconate filler with a high dielectric constant, the amount of shrinkage was examined through a thermomechanical analysis, and the predicted appropriate fraction of each filler was applied to green sheets by tape casting. The green sheets of different fillers were alternatingly laminated to the thickness of 500 ㎛. As a result of examining the junction, it was observed through SEM that a complete bonding was achieved by constrained sintering in the structure of 'calcium zirconate 50 vol%-silica 30 vol%-calcium zirconate 50 vol%'.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.63-66
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• 2000

This research addresses study on thermal residual stress of a composite patch repair of the edge cracked aluminium panel of aging aircraft. Composite patch repair is an efficient and economical technique to improve the damage tolerance of cracked metallic structures. These are thermal residual stresses due to the mismatch of coefficient of thermal expansion, and these are affected by the curing cycle of patch specimen. In this study, three curing cycles were selected for F.E. analysis. This study features the effect on composite patch and aluminum by thermal residual stress during crack propagation in aluminum plate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.660-665
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• 1993

An elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two special cases of fiber misorientation ; two-dimensional in-plane and three-dimensional axisymmetric. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is nuque in that it is able to account for interactions among fibers. The model is more general than past models and it is able to treat prior analyses of the simpler composite systems as extram cases. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for both in-plane and axisymmetric fiber misorientation. Fiber volum fraction, aspect ratio, and disturbution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stress than fiber distrubution type for both in-plane and axisymmetric misorientation.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Journal of Applied Reliability
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• v.8 no.4
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• pp.155-166
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• 2008

PTH cracks are caused by the mismatch of coefficient of thermal expansion(CTE) between polymer and laminated materials, and are one of the main failure mechanisms of multi layer boards. In spite of its importance, it is usually hard to measure or detect them because of its small size and invisibility. To detect PTH cracks more effectively, this paper proposes a theoretical model that can estimate the resistance value from crack size of PTHs. Using four-point probe resistance measurement method, the resistance value of test coupons is measured. Through measured data, we verify the validity of the proposed theoretical model and set up criteria of failure.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.11
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• pp.1672-1678
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• 1989

Major problems preventing the device-quality GaAs/Si heterostructure are the lattice mismatch of about 4% and difference in thermal expansion coefficient by a factor of 2.64 between Si and GaAs. Ge is a good candidate for the buffer layer because its lattice parameter and thermal expansion coefficient are almost the same as those of GaAs. As a first step toward developing heterostructure such as GaAs/Ge/Si entirely by a home-built PAE (plasma-assisted epitaxy), Ge films have been deposited on p-type Si (100)substrate by the plasma assisted evaporation of solid Ge source. The characteristics of these Ge/Si heterostructure were determined by X-ray diffraction, SEM and Auge electron spectroscope. PAE system has been successfully applied to quality-good Ge layer on Si substrate at relatively low temperature. Furthermore, this system can remove the native oxide(SiO2) on Si substrate with in-situ cleaning procedure. Ge layer grown on Si substrate by PAE at substrate temperature of 450\ulcorner in hydrogen partial pressure of 10mTorr was expected with a good buffer layer for GaAs/Ge/Si heterostructure.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.