• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.683-686
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• 2005

By now, we have been analysing the resistance values on 3 dimensional structure using experimental statical method or theoretical modeling, while devices miniaturizing reveals the limitation of the traditional methods to calculate 3 dimensional resistance. In addition, 2 dimensional analysing can not produce 3 dimensional characteristic following miniaturizing. To solve the limitations , we must do high level modeling of semi-conductor process. In this thesis, we analyzed the Laplace equation that is the basic and important for 3 dimensional structure resistance with computer simulation method and on the basis of this, analyzed the characteristic of resistance of 3 dimensional structure communication semiconductor device.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.9 no.4
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• pp.164-167
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• 2010

In this paper, an artificial transmission line of triangular-patch type with slots is proposed. This artificial transmission line is useful for miniaturizing the electrical lengths of conventional transmission lines. Also, this structure is easy to regulate the characteristic impedance and electrical lengths. The electrical lengths and the characteristic impedances of the proposed artificial transmission line with some parameters are researched and summarized The proposed artificial transmission line could be useful for compact designs for most of the passive microwave components. The optional-artificial transmission line is fabricated and measured at 2.45GHz.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.81-89
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• 1999

The fabrication process for miniaturizing the Electronic Article Surveillance (EAS) sensor was studied using micromachining technique. Two types of sensor structure, free standing membrane type and diving beard type, were proposed and researched for establishing the fabrication process. The membrane type structure was easy to change the sensor shape but had the limitation for miniaturizing, because the size of the sensor depends on the silicon substrate thickness. The diving board type structure has the advantage of miniaturization and of free motion. Since the elastic modulus is not trio high, SiN film is expected to be adequate for the supporting membrane of magnetic sensor. The selectivity of $H_2O_2$for sputtered W with respect to Fe-B-Si, which was studded for magnetic sensor materials, was high enough to be removed after using as a protection layer. Therefore, the diving board type process using the silicon nitride film for the supporter of the sensor material and the sputtered W for protection layer is expected to be useful fur miniaturizing the Electronic Article Surveillance (EAS) sensor.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.5
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• pp.106-114
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• 2005

• Journal of the Korean Society of Visualization
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• v.8 no.2
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• pp.23-30
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• 2010

Regarding the aircrafts with a rotor blade system, the miniaturization of them is limited due to the rotor blade length and the tail rotor system. To miniaturize an aircraft, an equipment is required that increases thrust and also shortens the length of the rotor blade. The present study will conduct the flow analysis for miniaturizing the aircraft by applying a duct to the coaxial rotor blade system without tail rotor. First, the verification on the calculated results was conducted through the computational flow analysis on the coaxial rotor blade system without a duct. Then, the flow analysis for the coaxial rotor blade systems was performed including Ka-60 duct, Single duct, Twin duct, and Double duct, respectively. From the numerical results, the thrust coefficient appeared higher with the duct than without a duct for the coaxial rotor blade system. Especially, in the case of Double duct, the thrust was improved due to the increase of incoming flow and the extension of the wake area. These results will be used as the basic concepts for miniaturizing the aircraft with the rotor blade system. The flow analysis on the coaxial rotor blade system including the fuselage remains as a future work.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1999.12a
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• pp.93-99
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• 1999

It is definite trend that the functional devices are to be integrated by miniaturizing of individual components. Bulk crystals turn into wafer form, while thin film of the functional materials is being fabricated for single and multi-layer devices. In addition, single crystals with multi-function performance would be desirable for further miniaturization. crystal growers have the responsibility for synthesis single crystals work to meet ever increasing requirement of future devices.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.246-249
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• 2002

In this paper, a rectangular patch antenna is miniaturized by changing tile middle of patch into narrow microstrip line except the edges of the patch where the fringing field occurs. Miniaturizing rate, gain, radiation patterns of suggested antennas were compared with general square microstrip antenna by using simulator Ensemble. As a result, it reduces the size of antenna by 30% and improves the characteristic of X pol as a advantage while it reduces gain and bandwidth.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.739-742
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• 1999

This study is to increase capability of the DC/DC converter (for PCS) in miniaturizing, stabilizing by locating an inductor with the structure of multi layer on to the glass/ceramic circuit board. When the DC/DC converter is stimulated. the characteristic operation of PWM switching circuit, losses. output power to input power, stability, efficiency and interfaces inside of control circuit and convener circuit are to be distinguished. The process would make it able to develop the techniques of designing and manufacturing of the converter of next generation.

• Journal of the Korea Fashion and Costume Design Association
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• v.8 no.3
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• pp.27-34
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• 2006

Flexibility, love of symbols, small size-these are all qualites that accompany the proclivity towards compactness in Japanese culture. They developed and have been refined to an unusual level in Japan partly out of the necessity to use limited space economically, but these qualities also characterize the aesthetic preferences of the people. Because space is so precious, it receives a great deal of attention in every aspect of life. Over the centuries Japanese have devised innumerable ways to use space that are ingenious in their successful combination of pragmatism, harmony, and beauty. Folding, stacking, rolling, nesting, carrying, consolidating, miniaturizing and transforming are some of the techniques for living that have created the compact culture. Folding allows a one-dimensional object to be placed in prescribed small space. Stacking objects of the same shape makes use of vertical space, saving valuable horizontal space. Rolling an object reduces it to a tidy cylinder without creasing it, creating yet another form of repose for functionally flat things. Nesting several identically shaped objects of graduated sizes is known as ireko. Carrying things by hand makes them available for any occasion, by plan or on impulse. Consolidating is to bring together the multifarious systems of living into an integrated whole. Miniaturizing things is a way to bring even the universe down to the scale of a human hand. Transforming the face of things is another notable propensity in the Japanese life style. Each one is put to use in countless ways, suggesting principles and conceptions that encapsulate the wisdom of tradition. In this study I wishes to investigate the principals of Japanese traditional design and the applied case in fashion goods.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.72-73
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• 2016

In this paper, we studied a method for miniaturizing a broadband stacked patch antenna structure which is widely used for bandwidth improvement. Main patch is a rectangular microstrip patch antenna fed by a 50-ohm microstrip line, and a parasitic patch is laid above the main patch. The size of the main patch is designed to be resonated near the center frequency of the desired frequency band. Then parasitic patch longer than main patch is placed above the main patch. The distance between two patches might be adjusted so as to achieve impedance matching using a shunt open stub. The shunt matching stub is inserted underneath the parasitic patch and so it does not require additional space, which enables the proposed antenna structure to be advantageous in miniaturizing antenna. The effects of the various parameters on the antenna performance are examined, and we introduced the design procedure for the proposed antenna to operate in the frequency range of 2.3-2.7 GHz.