• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -1
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• pp.515-518
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• 2002

This paper presents the iterative procedure with the concept of expanded waves in the spectral and spatial domains using the fast modal algorithm. We presents its applications to microwave integrated circuits on resistive substrate. The advantage is a reduction in computation time. These calculated results are checked by comparison with the experimental and simulated results by Sonnet and Momentum program.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.245-248
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• 1997

The dielectric resonators(DRs) with dielectric properties are widely used in microwave integrated circuit(MICs) and monolithic microwave integrated circuits(MMICS). The variational method as numerical simulation scheme would be applied to calculate the resonant frequencies(fr) and Q-factors of microwave dielectric resonators. The dielectric resonator with a cylindrical “puck” structure of high dielectric material is modeled in this simulation. The parameters, such as the diameter, the height, and the dielectric constant of dielectric resonator, would determine the resonant frequency and the Q-factor. The relationship between these parameters would effect each other to evaluate the approximate resonant frequency. This simulation method by the variational formula is very effective to calculate fr, and Q-factor. in high frequency microwave dielectric resonator The error rate of the simulation results and the measured results would be considered to design the microwave dielectric resonators.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권6호
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• pp.255-262
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• 2004

In this paper, a number of double-layered microwave integrated circuits (MIC) have been designed and analyzed based on a developed finite-difference time-domain (FDTD) solver. The solver was first validated through comparisons of the computed results with those previously published throughout the literature. Subsequently, various double-layered MIC printed on both isotropic and anisotropic substrates and superstrates, which are frequently encountered in printed circuit boards (PCB), have been designed and analyzed. It was found that in addition to protecting circuits, the added superstrate layer can increase freedoms of design and improve circuit performance, and that the FDTD is indeed a robust and versatile tool for multilayer circuit design.

• Journal of electromagnetic engineering and science
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• 제14권4호
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• pp.342-345
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• 2014

An active frequency doubler monolithic microwave integrated circuit (MMIC) for E-band transceiver applications is presented in this letter. This MMIC has been fabricated in a commercial $0.1-{\mu}m$ GaAs pseudomorphic high electron mobility transistor (pHEMT) process on a 2-mil thick substrate wafer. The fabricated MMIC chip has been measured to have a high output power performance of over 13 dBm with a high fundamental leakage suppression of more than 38 dBc in the frequency range of 71 to 86 GHz under an input signal condition of 10 dBm. A microstrip coupled line is used at the output circuit of the doubler section to implement impedance matching and simultaneously enhance the fundamental leakage suppression. The fabricated chip is has a size of $2.5mm{\times}1.2mm$.

• ETRI Journal
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• 제33권5호
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• pp.818-821
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• 2011

A D-band subharmonically-pumped resistive mixer has been designed, processed, and experimentally tested. The circuit is based on a $180^{\circ}$ power divider structure consisting of a Lange coupler followed by a ${\lambda}$/4 transmission line (at local oscillator (LO) frequency). This monolithic microwave integrated circuit (MMIC) has been realized in coplanar waveguide technology by using an InAlAs/InGaAs-based metamorphic high electron mobility transistor process with 100-nm gate length. The MMIC achieves a measured conversion loss between 12.5 dB and 16 dB in the radio frequency bandwidth from 120 GHz to 150 GHz with 4-dBm LO drive and an intermediate frequency of 100 MHz. The input 1-dB compression point and IIP3 were simulated to be 2 dBm and 13 dBm, respectively.

• 항공우주기술
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• 제7권1호
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• pp.121-128
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• 2008

이동 통신 및 위성 통신 분야에 있어서 무선 통신 기술 분야는 무선 환경에서 신호를 보내고 받는 기능을 수행하는 중요한 분야이다. 이러한 무선 통신 분야에서 송수신한을 구성하는 송수신 부품은 RF 시스템의 성능을 좌우한다. 따라서 위성 통신 분야에 있어서 신뢰성을 획득하기 위해서는 고집적화와 소형화를 통한 경쟁력 확보가 필수적인데 이를 위한 기술이 MMIC 이다. MMIC란 RF 부품을 설계하고 제작하는 기술로서 본 논문은 MMIC 기술에 대한 소개와 위성 분야에서의 기술적인 동향과 전망을 기술하고 있다.

• Journal of Advanced Marine Engineering and Technology
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• 제33권1호
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• pp.159-165
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• 2009

In this study, using a periodical ground structure(PGS) on GaAs monolithic microwave integrated circuit(MMIC), transmission line with a high isolation characteristic was developed for application to compact signal/bias lines of highly integrated MMIC. And the origin of the high isolation characteristic was theoretically investigated. The high isolation characteristic was originated from a resonance between adjacent microstrip lines employing PGS. With only a spacing of $20{\mu}m$, the coupled microstrip line employing PGS showed an isolation value of -47 dB at 60 GHz. The frequency range for high isolation was easily controlled by changing the PGS structure. Above results indicate that microstrip lines employing PGS are very useful for application to compact signal/bias lines of highly integrated MMIC requiring a high isolation characteristics between lines. In addition, equivalent circuit employing closed-form equation for the coupled line with PGS was also extracted.

• 전자공학회지
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• 제14권1호
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• pp.56-63
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• 1987

• Journal of Advanced Marine Engineering and Technology
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• 제37권1호
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• pp.99-104
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• 2013

본 논문에서는 밀리미터파에의 응용을 위하여, 소형화된 다운컨버터 MMIC(monolithic microwave integrated circuit)를 제안하였다. 구체적으로는, RF(radio frequency) 및 LO(local oscilator) 신호의 격리특성을 위해 Lange 커플러가 삽입되었고, ${\lambda}$/4 전송선로를 연결하여 역위상 RF와 동위상 LO 신호가 믹서부분 FET(field effect transistor)의 게이트에 인가되었다. 또한, IF(intermediate frequency) 출력 신호의 역위상의 결합과 LO 누설신호 제거를 위하여 역위상 결합용 능동 벌룬이 출력 포트에 설치되었다. 측정 결과에 따르면, 제안된 다운컨버터 MMIC는 양호한 RF 특성을 보였다. 구체적으로, 63 GHz의 RF 주파수와 60.6 GHz의 LO 주파수에서 IF 출력 포트에서의 LO 누설 전력이 .25 dBc, RF와 LO의 격리특성은 18 dB를 보였으며, 변환 이득이 10.3 dB를 보였다. 따라서, SAW 필터와 같은 LO 제거용 off-chip 소자는 제안된 다운컨버터 MMIC에서는 필요하지 않게 되었다. 모든 능동소자와 수동소자가 GaAs MMIC 내부에 집적되었으며, 전체 사이즈는 $2.2{\times}1.4mm^2$ 로써 초소형 MMIC가 구현되었다.

• ETRI Journal
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• 제9권3호
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• pp.127-138
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• 1987

본고에서는 MMIC (Monolithic Microwave Integrated Circuit)의 연구동향을 미국을 중심으로 소개한다. MMIC의 역사, 공정, 소자, 설계, packaging, 측정에 대하여 조사함으로써 차세대 화합물반도체 MMIC개발의 앞으로의 방향을 모색하고자 한다. 본고는 미국 Microwave & RF 논문지 1987년 3월호에 게재된 R. S. Pegally와 D. Maki의 논문내용을 중심으로 편역한 것이다.