• Title/Summary/Keyword: microstructure control

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Photocatalytic Properties of TiO2 Nanopowder Synthesized by Chemical Vapor Condensation Process (화학기상응축 공정으로 제조한 TiO2 나노분말의 광촉매 특성)

  • 임성순;남희영;윤성희;이창우;유지훈;이재성
    • Journal of Powder Materials
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    • v.10 no.2
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    • pp.123-128
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    • 2003
  • $TiO_2$ nanopowder was synthesized by chemical vapor condensation (CVC) process and its photocatalytic property depending on microstructure was considered in terns of decomposition rate of organic compound. In order to control microstructure of $TiO_2$ nanopowder such as particle size and degree of agglomeration, precursor flow rate representing number concentration was changed as a process variable. In TEM observation, spherical $TiO_2$ nanoparticles with average size of 20 nm showed gradual increases in particle size and degree of agglomeration with increase of precursor flow rate. Also decomposition rate of organic compound increased with decreasing precursor flow rate. Thus, it was concluded that photocatalytic property was enhanced by targe surface area of disperse $TiO_2$ nanoparticles synthesized at lower precursor flow rate condition in CVC process.

Microstructure and Synthesis of Nano Palladium Spot Coated Activated Carbon Powders by Hydrothermal Attachment Method (수열흡착법을 이용한 나노팔라듐 점코팅 활성탄 분말의 합성 및 미세조직)

  • Kim, Hyeong Chul;Han, Jae Kil
    • Journal of Powder Materials
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    • v.19 no.6
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    • pp.424-428
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    • 2012
  • Nano Pd spot-coated active carbon powders were synthesized by a hydrothermal-attachment method (HAA) using PVP capped Pd colloid in a high pressure bomb at $250^{\circ}C$, 450 psi, respectively. The PVP capped Pd colloid was synthesized by the precipitation-redispersion method. PVP capped Pd nano particles showed the narrow size distribution and their particle sizes were less than 8nm in diameter. In the case of nano Pd-spot coated active carbon powders, nano-sized Pd particles were adhered in the active carbon powder surface by HAA method. The component of Pd was homogeneously distributed on the active carbon surface.

Microstructure and Synthesis of Ag Spot-coated Cu Nanopowders by Hydrothermal-attachment Method using Ag Colloid (수열흡착법을 이용한 은 점코팅된 구리 나노분말의 합성과 미세조직)

  • Kim, Hyeong-Chul;Han, Jae-Kil
    • Journal of Powder Materials
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    • v.18 no.6
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    • pp.546-551
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    • 2011
  • Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

Effect of the Oxide Glass on the Metal Sintering Behavior in Silver Thick-Film System

  • Chung Young Sir;Kim Ho-Gi
    • Proceedings of the Korean Ceranic Society Conference
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    • 1986.12a
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    • pp.259-267
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    • 1986
  • The sintering behavior of silver-oxide glass composite thick-film has been studied with varing glass content. It is shown that during heat treatment glass became liquid phase to deeply affect the microstructure development of the silver particles and to control the physical properties of the thick-films. As glass content increased, the initial repacking of silver particles took place rapidly but the homogeneities of the microstructure showed different features. When the glass content was over some range, the silver particles exuded glass to decrease net energy and glass formed liquid pools separated from the solid skeletons. Finally the relations between the microstructures and electrical properties of the thick-film were discussed.

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Influence of $TiO_2$ Addition on Microstructure of ZnO Ceramic Varistor (ZnO 세라믹 바리스터의 미세구조에 미치는 $TiO_2$의 영향)

  • 소병문;홍진웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.3
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    • pp.214-220
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    • 1998
  • ZnO varistors are characterized by the features of excellent nonlinearity and surge withstand capability. In this paper, in order to investigate the use of ZnO varistor as surge absorption device in low voltage, metal oxide material($TiO_2$) was selected as control material of grain growth. Samples of ZnO varistors were fabricated with varying the contents, and then the microstructures and V-I characteristics were measured. It was observed by SEM that the mean grain size increased with the increase of the additive. From the measurement of V-I characteristics, it was observed that according to the increase of the quantity of $TiO_2$ as additive, the operating voltage was lowered.

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Effect of Annealing and Co contents on the Structural and Physical Properties in AlN Thin Films

  • Han, Chang-Suk;Han, Seung-Oh
    • Journal of the Korean Society for Heat Treatment
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    • v.23 no.6
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    • pp.331-337
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    • 2010
  • Aluminum nitride (AlN) thin films containing various amounts of Co content have been deposited by using a two-facing targets type sputtering (TFTS) system. The deposited films were also annealed successively and isothermally at different temperatures. Annealing treatment can control the physical properties as well as the microstructure of AlN films with Co particles. High magnetization and high resistivity are obtainable in AlN films containing dispersed Co particles. The coercivity of the films does not depend on annealing time, but it increases with increasing annealing temperature due to the increase of the grain size. A high saturation magnetization of 46 kG and resistivity of 2200 ${\mu}{\Omega}$-cm was obtained for AlN films containing 25 at% Co.

Processing of Plasma Resistant Alumina Ceramics (내플라즈마성 알루미나 세라믹스 제조 공정)

  • Lee, Hyun-Kwuon;Cho, Kyeong-Sik;Kim, Mi-Young
    • Journal of the Korean Ceramic Society
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    • v.46 no.4
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    • pp.385-391
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    • 2009
  • Need for plasma resistant ceramic materials has been continuously increased in semiconductor and display industry requiring plasma processing to realize ultra fine circuit process. Among promising candidates, alumina ceramics have still some advantages with respect to its economic aspect. In this study, fabrication of plasma resistant alumina ceramics was tried, and its processing optimization was also aimed. Careful processing control and thereby uniform microstructure of $Al_2O_3$ gave rise to enhanced plasma resistance, even comparable to market-governing commercial $Al_2O_3$. A further study is needed concerning ${\beta}-Al_2O_3$ materials system, presumably playing a decisive role in decreasing plasma resistance of $Al_2O_3$ ceramics.

The Anodicc PolarizationBehavior of Fe-Cr-Ni-W alloy in 1N HCI Solution (1N 염산 용액에서 Fe-Cr-Ni-W 합금의 양분극 거동에 관한 연구)

  • 윤재돈;강성군
    • Journal of Surface Science and Engineering
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    • v.21 no.4
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    • pp.176-182
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    • 1988
  • Effects of Cr, Ni and W on the anodic polarization behavior were investigated for Fe-Cr-Ni-W alloys in deaerated 1N HCI solution. Surface films formed on the polarization were analysed using AES, SEM and EDAX. A higerconcentration of tungten was found in the surface oxide film compared to the matrix. It played an importanet role on incresing the stability of the passive film. The presence of an adequate amount of Cr was essential to increase the pitting resistance of the alloys in acid chloride media. Under 12 wt%cr,alloys containing 6wt%W did not exhidit any passivity at all. The main role of Ni was to control the microstructure rather than to modify the corrosion resistance. In 23 cr-14Ni-^W alloy, the duplex microstructure of ferrite($\delta$-phase) in an austenic matrix was developed. The reson why proferred pitting appeared in austenite and ferrite/austenite interface was that ferrite had more amount of Cr and W than austenite.

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The Effect of the Gate Shape on the Controlled Material the Microstructure of Grain Size (게이트 형상이 결정입 제어 소재의 미세조직에 미치는 영향)

  • Jung Y. S.;Bae J. W.;Seo P. K.;Kang C. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.10a
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    • pp.152-155
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    • 2004
  • In the semi-solid die casting process, the important thing is the flow behaviors of semi-solid material. The flow patterns of semi-solid material can make the defects during die filling. To control of the flow patterns, is very important and difficult. In this paper, the flow behaviors of the semi-solid A356 alloy material during die filling at various die gate shapes has been observed with the grain size controlled material. The effects of the gate shape on the die filling characteristics were investigated. The filling tests in each plunger strokes were experimented, also simulated on the semi-solid material die casting process by MAGMAsofi. According to the filling tests and computer simulation, the effect of the gate shape on liquid segregation had been investigated.

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Applications of Semi-Solid Forming and its Problems (반용융 성형공정의 응용 및 문제점)

  • 강충길
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1997.06a
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    • pp.135-147
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    • 1997
  • The production of light metal parts using aluminum is mainly performed by die casting and squeeze casting, which directly fabricate the required shape from the liquid state. However, die casting is subject to defects such as shrinkage porosity and air trapped when molten metal enters the cavity, whilst squeeze casting also has defects due to turbulent flow in the die cavity. Both diecasting and sqeeze casting have inhomogeneous mechanical property in terms of dendritic structure during solidification. Active research has been carried out on semi-solid processing, rather than on conventional process methods such as die casting, which involve various problems. Therefore in this paper, to introduce the fundamental technology for d e design, in die casting and forging process with semi-solid materials, relationship between stress and strain of semi-solid materials, and for producing parts die design has been proposed as parameters of globulization of the microstructure and gate shape. The prevention of various defects to produce sound parts are also introduced.

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