• Journal of Korea Foundry Society
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• v.40 no.3
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• pp.61-65
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• 2020

Rheo-diecasting with stirring has been used in many material industries. As the 4th Industrial Revolution approaches the world, eco-friendly high-strength and light-weight materials become more important. Casting methods have been studied and used for aluminum-alloy automobile parts. This study carried out the effect analysis of the micro-structure and mechanical properties, such as yield/ultimate tensile strength, elongation, and hardness, of A356 using the 6-pole EMS (electro-magnetic stirring) casting process with a high electromagnetic force. As a result, the hardness and elongation of the A356 after T6 heat-treatment show a significant improvement, respectively, by 20% and 50%.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.51-54
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• 2008

Drill process is usually used to manufacture a industry about processing, Therefore, the burr problem is very significant, The burrs took place when drill process. And then, sometimes, the burrs are often caused of some problems during automatic such as no good quality products and having good surface roughness products. And also, this paper had some experiments using magnesium. Specially, the magnesium is one of the non-ferromagnetic materials. Magnesium has attracted a lot of interest for using the industry. They offer a possible alternative to steel and aluminum in automotive and aero industries to satisfy the lightweight requirement. also, magnesium has good specific strength and absorbs vibration in occurring working process. So, it has good quality of product processing. And then, it is one of the lightest materials being used to electronic product's cases and automotive because of lightweight and miniaturization. But this material has not widely used all of the industry due to its natural property. If the magnesium is contacted water, it will cause the exploration. But, nowadays many of people study magnesium to safe their experiment and to widely use this industry.

• Proceedings of the Korean Magnestics Society Conference
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• 2013.12a
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• pp.95-95
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• 2013

The NdFeB magnet can be classified into the sintered magnet and bonded magnet. The former has superior magnet characteristics but the degree of freedom in shape is highly restricted, whereas the latter has a high degree of freedom, but its magnet characteristics are inferior to the former. When a NdFeB magnet is used at the elevated temperature, part of Nd must be replaced with a high priced Dy to increase its coercive force. For these reasons, a Dy free and high performance NdFeB bonded magnet is desired strongly. The author successfully developed a Dy free NdFeB anisotropic bonded magnet based on discovery of new phenomena called as d-HDDR reaction and its mass production process such as a thermally balanced hydrogen reaction furnace, micro capsuled powder, compression molding / injection molding under magnetic field, magnetic die and so on. Applied to DC brush seat motor for automotive use, the motor has become 50% small in size and weight. The commercialization of a half sized motor for automotive use has been realized up to the market share of 30%. At present, its commercialization is extending to various types of motors such as power tool, ABS motor, wiper motor, window motor, electric bike power motor, and compressor motor. It is expected that the applications will be increasingly enlarged to EV motor, wind generator, EPS motor, washing machine, and glass cutting machine. This innovative technology has realized Dy free high performance magnet and mudt make big contribution to not only rare element strategies but also energy conservation.

• Journal of Applied Reliability
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• v.7 no.1
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• Laser Solutions
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• v.18 no.2
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• pp.1-4
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• 2015

This study is related to the surface hardening treatment to spheroidal graphite cast iron for die by using high power diode laser. Laser device used in this experiment is capable of real-time laser power control. This is because the infrared temperature sensor (two color pyrometer) attached to the optical system measures the surface temperature of specimen and adjusts the laser power in real time. The surface treatment was carried out with the change of heat treatment temperature at the beam travel speed 3 mm/sec. Hardened width and depth was measured and hardened zone was analyzed by micro vickers hardness test in order to research the optimum condition of heat treatment. The changes in microstructure of the hardened zone also was examined. As a result of hardness measurement and observations on microstructure of hardened zone, hardness increased over three times as compared with base metal because the martensite was formed on the matrix structure.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.40 no.1
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• pp.19-29
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• 2003

This paper proposes a CMOS readout circuit for uncooled micro-bolometer arrays adopting a four-point step calibration technique. The proposed readout circuit employing an 11b analog-to-digital converter (ADC), a 7b digital-to-analog converter (DAC), and an automatic gain control circuit (AGC) extracts minute infrared (IR) signals from the large output signals of uncooled micro-bolometer arrays including DC bias currents, inter-pixel process variations, and self-heating effects. Die area and Power consumption of the ADC are minimized with merged-capacitor switching (MCS) technique adopted. The current mirror with high linearity is proposed at the output stage of the DAC to calibrate inter-pixel process variations and self-heating effects. The prototype is fabricated on a double-poly double-metal 1.2 um CMOS process and the measured power consumption is 110 ㎽ from a 4.5 V supply. The measured differential nonlinearity (DNL) and integrat nonlinearity (INL) of the 11b ADC show $\pm$0.9 LSB and $\pm$1.8 LSB, while the DNL and INL of the 7b DAC show $\pm$0.1 LSB and $\pm$0.1 LSB.

• Design & Manufacturing
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• v.15 no.2
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• pp.11-16
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• 2021

Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.