• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.795-796
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.253-254
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• 2011

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.360-360
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• 2011

In this work, SUS310S used for valve plate assembly was electron beam (EB) welded to determine the influence of the parametric conditions on the characteristics of the weld and to minimize porosity and micro-fissures among others. The evolution in the weld geometry and microstructure was examined as a function of the process conditions such as beam current and focusing current under a constant welding speed and accelerating voltage. The integrity of the EB welds in SUS310S was examined for defects (e.g. cracking, porosity, etc.), adequate penetration depth, and tolerable weld width deviation for the various welding conditions. Optical microscopy (OM), x-ray photoelectron spectroscopy analysis (XPS), scanning electron microscopy (SEM) and 3D micro-computed tomography (Micro-CT) for the cross section analysis of the electron beam welded SUS310S were utilized. The tensile strength and hardness were analyzed for the mechanical properties of the EB weld. At the 6 kV accelerating voltage, it was determined that a satisfactory penetration depth and desirable weld width deviation requires a beam current of 30 mA and a focusing current of 0.687 A at the welding speed of 25 mm/sec.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.109-110
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• 2008

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.58-63
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• 2006

FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\Phi}10nm$ and smaller is available. Since general FIB uses very short wavelength and extremely high energy, it can directly make a micro structure less than $1{\mu}m$. As a result, FIB has been probability in manufacturing high performance micro devices and high precision micro structures. Until now, FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, IC error correction, etc. In this paper FIB-Sputtering and FIB-CVD characteristic analysis were carried out according to $Ga^+$ ion beam current that is very important parameter for minimizing the pattern size and maximizing the yield. Also, for FIB-Sputtering burr caused by redeposition of the substrate characteristic analysis was carried out.

• Structural Engineering and Mechanics
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• v.59 no.3
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• pp.579-599
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• 2016

In this study, static bending of edge cracked micro beams is studied analytically under uniformly distributed transverse loading based on modified couple stress theory. The cracked beam is modelled using a proper modification of the classical cracked-beam theory consisting of two sub-beams connected through a massless elastic rotational spring. The deflection curve expressions of the edge cracked microbeam segments separated by the rotational spring are determined by the Integration method. The elastic curve functions of the edge cracked micro beams are obtained in explicit form for cantilever and simply supported beams. In order to establish the accuracy of the present formulation and results, the deflections are obtained, and compared with the published results available in the literature. Good agreement is observed. In the numerical study, the elastic deflections of the edge cracked micro beams are calculated and discussed for different crack positions, different lengths of the beam, different length scale parameter, different crack depths, and some typical boundary conditions. Also, the difference between the classical beam theory and modified couple stress theory is investigated for static bending of edge cracked microbeams. It is believed that the tabulated results will be a reference with which other researchers can compare their results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.593-597
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• 2005

FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\phi}$ 10nm and smaller is available. Currently FIB is not being applied in the fabrication of this micro part because of some problems to redeposition and charging effect of the substrate causing reduction of accuracy with regards to shape and productivity. Furthermore, the prediction of the material removal rate information should be required but it has been insufficient for micro part fabrication. The paper have the targets that are FIB-CVD characteristic analysis and minimum line pattern resolution achievement fur 3D micro fabrication. We make conclusions with the analysis of the results of the experiment according to beam current, pattern size and scanning parameters. CVD of 8 pico ampere shows superior CVD yield but CVD of 1318 pico ampere shows the pattern sputtered. And dwell time is dominant parameter relating to CVD yield.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.171-179
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• 2004

Micro-stereolithography technology has made it possible to fabricate a freeform 3D microslructure. This technology is based on conventional stereolithography, in which a UV laser beam irradiates the open surface of a UV-curable liquid photopolymer, causing it to solidify. In micro-stereolithography, a laser beam of a few $\mu m$ diameter is used to solidify a very small area of the photopolymer. This is one of the key technological elements, and can be achieved by using a focusing lens. Thus, the solidification phenomena of the liquid photopolymer must be carefully investigated. In this study, the photopolymer solidification phenomena in response to variations in the scanning pitch of a focused laser beam was investigated experimentally. The effect of layer thickness on the solidification width and depth was also examined. These studies were conducted under the conditions of relatively lower laser power and relatively higher scanning speed. Moreover, the photopolymer solidification phenomena for the relatively higher laser power and lower scanning speed was investigated, too. In this case, comparing to the case of lower laser power and higher scanning speed, the photopolymer absorbed large amount of irradiation energy of the laser beam. These results were compared with those obtained from a photopolymer solidification model. From these results, a new laser-scanning scheme was proposed according to the shape of the 3D model. Samples by each method were fabricated successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1179-1180
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• 2005

3D micro scaled shapes are fabricated with the method of direct writing and superposing grooving in ambient air using femto-second laser pulses and copper, aiming at establishing an industrially useful femto-second laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. For the several advantages, there is no thermally influenced region around the area irradiated by the laser beam and surfaces irradiated laser beam are smooth and substances ablated to form are no attached on the surface of works and so on, the femto-second laser technology is anticipated for advanced micro/nano precision technology.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.575-580
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• 2002

To evaluate elastic and micro-failure properties of MEMS materials, the electro-statically operated test devices were designed and fabricated by micro machining technology. The test structures consist or comb drives for loading and suspending beams in testing. From the analysis of beam displacement based on elastic beam theory, elastic modulus and yield strength of Al film were measured. And, by introducing the micro notch and cyclic loading, the micro-failure was Induced and the micro-fracture toughness of Si film was evaluated. Moreover, the cycles to failure were estimated from the degradation of resonant frequency. Finally, the effects of notch on micro failure were discussed.