• 제목/요약/키워드: micro-beam

검색결과 668건 처리시간 0.032초

IBAD 방법으로 코팅된 PTFE 박막의 마이크로/나노 응착 및 마찰 특성 (Micro/Nano Adhesion and Friction Characteristics of PTFE Coating Film Deposited by IBAD Method)

  • 윤의성;오현진;한흥구;공호성;장경영
    • Tribology and Lubricants
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    • 제20권5호
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    • pp.237-244
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    • 2004
  • Micro/nano tribological characteristics of PTFE coating films were experimentally studied. PTFE (polytetrafluoroethylene) modified polyethylene and low molecular weight PTFE were used as a coating materials. These films were deposited on Si-wafer (100) by IBAD (ion beam assisted deposition) method. The Ar ion beam sputtering was performed to change the surface topography of films using a hollow cathode ion gun under different Ar ion dose conditions in a vacuum chamber. Micro/nano tribological characteristics, water wetting angles and roughness were measured with a micro tribotester, SPM (scanning probe microscope), contact anglemeter and profilometer, respectively. The durability of the films were measured with macro tribotester. Results showed that the PTFE coating surfaces were converted to hydrophobic. The water contact angle of coated surfaces and surface roughness increased with the coating thickness. Adhesion and friction in micro and nano scale were governed by magnitude of normal load in soft material such as PTFE films. As the increase of sputtering time on low molecular weight PTFE films, the surface roughness was increased and nano adhesion and friction were decreased. The nano tribological characteristics of surfaces are mainly improved by chemical modification such as PTFE coating and given a synergy effect by the physical modification such as topographic modification.

표면형상이 젖음각과 마이크로/나노 트라이볼로지 특성에 미치는 영향 (Effect of surface topography on wetting angle and micro/nano-tribological characteristics)

  • 윤의성;오현진;양승호;공호성
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.25-33
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    • 2002
  • Effect of surface topography on the water wetting nature and micro/nano tribological characteristics of Si-wafer and PTFE was experimentally studied. The ion beam treatment was performed with a hollow cathode ion gun in different argon don dose conditions in a vacuum chamber to change the surface topography, Micro/nano tribological characteristics, water wetting angles and roughness were measured with a micro tribo tester, SPM (scanning prove microscope), contact anglemeter and profilometer, respectively. Results showed that surface roughness increased with the argon ion dose. The water wetting angle of tile ion beam treated samples also increased with the ion dose. Results also showed that micro-adhesion and micro-friction depend on the wetting characteristics of the PTFE samples. However, nano-triboloSical characteristics showed little dependence on the wetting angles. The water wetting characteristics of modified PTFE samples were discussed in terms of the surface topographic characteristics.

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나도 Imprinting 을 위한 몰드 제작에 관한 연구 (Nano-mold fabrication for imprinting lithography)

  • 이진형;임현우;김태곤;이승섭;박진구;이은규;김양선;한창수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1073-1077
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    • 2003
  • This study aims to investigate the fabrication process of nano silicon mold using electron beam lithography (EBL) to generate the nanometer level patterns by nano-imprinting technology. the nano-patterned mold including 100mm pattern size has been fabricated by EBL with different doses ranged from 22 to 38 ${\mu}C/cm^2$ on silicon using the conventional polymethylmetharcylate(PMMA) resist. The silicon mold is fabricated with various patterns such as circles, rectangles, crosses, oblique lines and mixed forms, The effect of dosage on pattern density in EBL is discussed based on SEM (Scannning Electron Microscopy) analysis of fabricated molds. The mold surface is modified by hydrophobic fluorocarbon (FC) thin films to avoid the stiction during nano-imprinting process.

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미소 원주의 사출 성형 실험 (Injection Molding Experiments for Small Diameter Column)

  • 제태진;이응숙;김재구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.85-88
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    • 1995
  • Recently, the micro mold maching techining technology is developed by means of the mechanical and high energy beam process. It is possible to make the micro structure mold with high aspect ratio by the LIGA technology. This mode is used for mass production of plastic parts by the micro injection molding method. In this study, we intend to research on the basic technology of micro injection molding. As the result, we developed the injection molding technology for small column plastic parts which diameter is 500 .mu. m and 200 .mu. m respectively with wbout aspect ratio 20.

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Electron Temperature, Plasma Density and Luminous Efficiency in accordance with Discharge Time in coplanar AC PDPs

  • Jeong, S.H.;Moon, M.W.;Oh, P.Y.;Jeong, J.M.;Ko, B.D.;Park, W.B.;Lee, J.H.;Lim, J.E.;Lee, H.J.;Han, Y.G.;Son, C.G.;Lee, S.B.;Yoo, N.L.;Choi, E.H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1203-1206
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    • 2005
  • Electron temperature and plasma density in coplanar alternating-current plasma display panels (AC-PDP's) have been experimentally investigated in accordance with discharge time by a micro-probe in this experiment. The resolution of a step mortor to move in micro-Langmuir probe is 10um.[1-3] The used gas in this experiment is He-Ne-Xe (4%) mixure gas. And sustain voltage is 320V which is above of firing voltage for degradation. The electron temperature and plasma density can be obtained from current-voltage (I-V) characteristics of micro Langmuir probe, in which negative to positive bias voltage was applied to the probe. And Efficiency is calculated by formula related discharge power and light emission. Those experiments operated as various discharge time ($0{\sim}72$ Hours). As a result of this experiment, Electron Temperature was increased from 2eV to 5eV after discharge running time of 20 hours and saturates beyond 20 hours. The plasma density is inversely proportional to the square root of electron temperature. So the plasma density was decreased from $1.8{\times}10^{12}cm^{-3}$ to $8{\times}10^{11}cm^{-3}$ at above discharge running time. And the Efficiency was reduced to 70% at 60hours of discharge running time.

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마이크로 광 조형기술을 이용한 3차원 형태의 응용제품 제작 및 이의 평가 (Development and Evaluation of Applications Using Micro-stereolithography Technology)

  • 이인환;김동성;조동우;권태헌
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.233-236
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    • 2003
  • The micro-stereolithography technology made it possible to fabricate a freeform 3D micro-structure. Using this technology, two kind of applications were fabricated and tested: micro-lens and micro-mixers. The focal length and f-number of the micro-lens were 5 mm and 2.5, respectively. The focusing ability of the micro-lens was verified by defocusing the He-Ne laser beam after passing the lens. Two mixers are Kenics micro-mixer and BEKM. BEKM is a modified Kenics micro-mixer by introducing barriers on the pipe walt periodically to enhance the mixing via the chaotic mechanism in the helical flow of Kenics micro-mixer. Experimental result shows good mixing performance of developed mixers. Especially, the BEKM shows better mixing performance then Kenics micro-mixer.

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집속 아르곤 이온 레이저 빔을 이용한 실리콘 기판의 식각 (Etching of Silicon Wafer Using Focused Argon lon Laser Beam)

  • 정재훈;이천;박정호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권4호
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    • pp.261-268
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    • 1999
  • Laser-induced thermochemical etching has been recognized as a new powerful method for processing a variety of materials, including metals, semiconductors, ceramics, insulators and polymers. This study presents characteristics of direct etching for Si substrate using focused argon ion laser beam in aqueous KOH and $CCl_2F_2$ gas. In order to determine process conditions, we first theoretically investigated the temperature characteristics induced by a CW laser beam with a gaussian intensity distribution on a silicon surface. Major process parameters are laser beam power, beam scan speed and reaction material. We have achieved a very high etch rate up to $434.7\mum/sec$ and a high aspect ratio of about 6. Potential applications of this laser beam etching include prototyping of micro-structures of MEMS(micro electro mechanical systems), repair of devices, and isolation of opto-electric devices.

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