• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of Integrative Natural Science
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• v.4 no.4
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• pp.311-314
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• 2011

Application of self-assembled monolayers (SAMs) to the fabrication of organic thin film transistor has been recently reported very often since it can help to provide ohmic contact between films as well as to form simple and effective electrode pattern. Accordingly, quality of these ultra-thin films is becoming more imperative. In this study, in order to manufacture a high quality SAM pattern, a hydrophobic alkylsilane monolayer and a hydrophilic aminosilane monolayer were selectively coated on $SiO_2$ surface through the consecutive procedures of a micro-contact printing (${\mu}CP$) and dip-coating methods under extremely dry condition. On a SAM pattern cleaned with SC1 solution immediately after ${\mu}CP$, poly(3,4-ethylenedioxythiophene) (PEDOT) source and drain electrode array were very selectively and nicely vapour phase polymerized. On the other side, on a SC1-untreated SAM pattern, PEDOT array was very poorly polymerized. It strongly suggests that the SC1 cleaning process effectively removes unwanted contaminants on SAM pattern, thereby resulting in very selective growth of PEDOT electrode pattern.

• Korean Journal of Optics and Photonics
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• v.21 no.2
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• pp.41-45
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• 2010

In order to obtain thinner and brighter backlight units (BLU), we simulated a new-type backlight unit. A micro-lens array sheet was formed on the upper plane of the light guide plate (LGP) comprising the backlight unit. Also, in order to match with the LGP, we simulated a functional optical sheet. The conventional BLU uses one LGP and four optical sheets, but we simulated a BLU that uses one optical sheet. Simulation results have revealed that our BLU can achieve the same luminance and 30% better view angle as compared with conventional ones.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.366-370
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• 2022

A 12 ㎛ pixel-sized 360 × 240 microbolometer focal plane array (MBFPA) was fabricated using a complementary metaloxide-semiconductor (CMOS)-compatible process. To release the MBFPA membrane, an amorphous carbon layer (ACL) processed at a low temperature (<400 ℃) was deposited as a sacrificial layer. The thermal time constant of the MBFPA was improved by using serpentine legs and controlling the thickness of the SiNx layers at 110, 130, and 150 nm on the membrane, with response times of 6.13, 6.28, and 7.48 msec, respectively. Boron-doped amorphous Si (a-Si), which exhibits a high-temperature coefficient of resistance (TCR) and CMOS compatibility, was deposited on top of the membrane as an IR absorption layer to provide heat energy transformation. The structural stability of the thin SiNx membrane and serpentine legs was observed using field-emission scanning electron microscopy (FE-SEM). The fabrication yield was evaluated by measuring the resistance of a representative pixel in the array, which was in the range of 0.8-1.2 Mohm (as designed). The yields for SiNx thicknesses of SiNx at 110, 130, and 150 nm were 75, 86, and 86%, respectively.

• The Bulletin of The Korean Astronomical Society
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• v.38 no.2
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• pp.43.1-43.1
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• 2013

We report the preliminary results of our GMVA(Global mm VLBI Array) observation at the frequency of 86 GHz. Observation were made in the dual polarization mode (LCP and RCP), to produce the polarimetric maps with the maximum angular resolution which the array is capable of. We aim to link the source-integrated AGN polarization properties with the polarized spatial source structure, by mapping the polarized "fine structure" of the target AGN. We selected 2 targets, 0954+658 and 0716+714, which (1) have been observed multiple times by the PdBI polarimetric monitoring program; (2) have sufficient integrated fluxes ($S_{90GHz}$ > 1 Jy) ; (3) are close enough to resolve the source structure < 1 pc with given angular resolution ; and (4) are located at high northern declination for good UV coverages. As preliminary results, we present LL and RR polarized images of each target with the maximum angular resolution of ${\sim}60{\mu}as$. Extended structures, probably the jet outflows, are discovered in both sources.

• Journal of electromagnetic engineering and science
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• v.12 no.1
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• pp.122-127
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• 2012

Post-wall waveguide structures have attracted a great deal of attention for micro- and millimeter-wave applications. One of the waveguide’s applications is a slotted waveguide array. In order to design the slotted array, the characteristics of a slot unit alone on the post-wall waveguide should be investigated. In this paper, a method for extracting the S-parameters of a unit slot is proposed. This simple method requires only two kinds of waveguides: waveguides without a slot unit and waveguides with a slot unit. Three kinds of slot units are fabricated, and the extracted results show a high level of agreement with predicted (simulated) results. With this method, the equivalent slot length can also be found.

• Tribology and Lubricants
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• v.12 no.4
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• pp.52-59
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• 1996

The results of the electrical contact conductivity of multi-contact spots accounting the surface roughness and the non-conductive films of different origins such as air, water, cutting oil, and machining oil are presented. The array of metal spheres compressed between two flat plates has been used for simulation of the contact behavior of multiple contact of solids, under normal loading. Measurement of electrical contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spot number and array on conductivity of contact has been evaluated. The results of the experiments show that the contact resistance are closely related to the number of loading cycles, form of surface roughness, and presence of non-conductive films that reduce the size of the real electrical contact spots.

• Journal of Korea Multimedia Society
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• v.20 no.12
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• pp.2009-2015
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• 2017

A two-dimensional lens is required to reproduce both the horizontal and vertical parallax through an autostereoscopic 3D display. Among the two-dimensional lenses, a hexagonal micro lens array (MLA) having good optical efficiency is mainly used. However, the hexagonal MLA has complex geometric features. The first feature is that the lens cells are zigzagged in the vertical direction, which should be reflected in the view number calculation for each sub-pixel. The second feature is that the four sides of a hexagonal lens cell are tilted, requiring a more careful view index assignment to the lens cell. In this paper, we propose a sub-pixel multiplexing scheme suitable for the features of the hexagonal MLA. We also propose a view-overlay algorithm based on a two-dimensional lens and compare subjective image quality with existing view-selection through autostereoscopic 3D display implementation.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.2
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• pp.23-27
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• 2001

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarrays were made by immobilizing many kinds if DNAs on transducers (particles). DNA chip microarrays were prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of micro meter-scale sites. The particles occupied different sites from array to array. Each particle cam be distinguished by a tag that is established on the particle. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using hydrophobic interaction.