• Title/Summary/Keyword: micro pin

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Development and Characterization of Finger-type PIN Photodiode for Fluorescence Detection of RNA (RNA 형광 검출을 위한 Finger형 PIN 광다이오드의 제작 및 평가)

  • Kim, Ju-Hwan;Oh, Myung-Hwan;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.13 no.2
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    • pp.85-89
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    • 2004
  • This paper represents the development of high sensitivity photo-sensor for the fluorescence detection in the integrated biological analysis system. The finger-type PIN photodiodes were fabricated as the photo-sensor, and had a high sensitivity ($I_{light}/I_{dark}$ = 8720). The interference filter consisted of $TiO_{2}$ and $SiO_{2}$ was directly deposited on the photodiodes. Deposited filter with 95.5% reflection under 532 nm and 98% transmission over 580 nm exceedingly decreased the magnitude of background signal in the detection. The PDMS micro-fluidic channels are bonded on the photodiode by $O_{2}$ plasma treatment. The detection current was proportional to two primary parameters (light intensity, concentration), and the on-chip detection system could detect fluorescence signals down to 100 nM concentration (LOD = Limit of detection of rhodamine).

Abrasive Wear Characteristics of Materials for Diesel Engine Cylinder Liner and Piston Ring (디젤엔진 실린더 라이너-피스톤 링 소재의 연삭 마멸 특성)

  • Jang, Jeong-Hwan;Kim, Jung-Hoon;Kim, Chang-Hee;Moon, Young-Hoon
    • Journal of the Korean Society for Heat Treatment
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    • v.20 no.2
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    • pp.72-77
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    • 2007
  • Abrasive wear between piston ring face and cylinder liner is an extremely unpredictable and hard-to-reproduce phenomenon that significantly decreases engine performance. Wear by abrasion are forms of wear caused by contact between a particle and solid material. Abrasive wear is the loss of material by the passage of hard particles over a surface. From the pin-on-disk test, particle dent test and scuffing test, abrasive wear characteristics of diesel engine cylinder liner-piston ring have been investigated. Pin-on-disk test results indicate that abrasive wear resistance is not simply related to the hardness of materials, but is influenced also by the microstructure, temperature, lubricity and micro- fracture properties. In particle dent test, dent resistance stress decreases with increasing temperature. From the scuffing test by using pin-on-disk tester, scuffing mechanisms for the soft coating and hard coating were proposed and experimentally confirmed.

Macro-Micro Reconfigurable Antenna for Multi Mode & Multi Band(MMMB) Communication Systems (다중 모드 다중 대역(MMMB) 통신 환경을 위한 매크로-마이크로 주파수 재구성 안테나)

  • Yeom, In-Su;Choi, Jung-Han;Jung, Young-Bae;Kim, Dong-Ho;Jung, Chang-Won
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.10
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    • pp.1031-1041
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    • 2009
  • A small microstrip monopole antenna for macro-micro frequency tuning over multiple bands is presented. The meander-shape antenna is fabricated on a conventional printed circuit board(FR-4, $\varepsilon_r=4.4$ and tan $\delta=0.02$). The antenna operates over WiBro(2.3~2.4 GHz) and WLAN a/b(2.4~2.5 GHz/5.15~5.35 GHz) service bands with an essentially constant antenna gain within each service band. Two diodes, a PIN diode and a varactor, are embedded into the antenna for frequency reconfiguration. The PIN diode is used for frequency switching(macro-tuning) between 2 GHz and 5 GHz bands while the varactor is used for frequency tuning(micro-tuning) within the service bands, 2.3~2.5 GHz and 5.15~5.35 GHz. Unwanted resonances between the two frequency bands(2 GHz and 5 GHz) are suppressed by filling up the gaps between the meander lines. The antenna gain is essentially constant and higher than 2 dBi within each service band. The measured performance of the proposed antenna system suggests the macro-micro frequency tuning techniques be useful in reconfigurable wireless communication systems.

Experimental Study on Micro-Scale Surface Texturing for Friction Reduction (저마찰을 위한 Micro-Scale Surface Texturing의 실험적 연구)

  • 채영훈
    • Tribology and Lubricants
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    • v.20 no.5
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    • pp.266-271
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    • 2004
  • The aim of this paper is to investigate the effect of surface texturing on reduction friction and to understand the potential of friction reduction through micro-scale dimple to fabricate by photolithography on pin-on-disk test using flat-on-flat contact geometry. It was verify that the friction property with respect to the same pitch has been influence on the size of dimple under lubricated sliding contact. Also, we can recognize from Stribeck curve that the friction property has a connection with the size of dimple. It can explain a relationship between the friction coefficient and a dimensionless parameter for lubrication condition. The friction property has been an effect on the size of surface texture on reduction friction, not only because the density of dimple, but also because the ratio of diameter/pitch. This ratio of approximately 0.5 recommend under the tested friction condition. It suggested that the ratio of d/p is an important parameter for surface texture design.

Sliding Friction Property of Angle Effect for Crosshatch Micro-grooved Pattern under Lubricated (마이크로 크기를 가지는 빗살무늬 그루우브 패턴의 빗살각도변화에 대한 실험적 마찰특성)

  • Kim, Seock-Sam;Chae, Youn-Ghun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.3
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    • pp.94-99
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    • 2011
  • Micro-scale surface pattern has an benefit of tribological application under lubricated sliding contact. Therefore, a special pattern, that has to reduce the coulomb friction under contact, is considered to be necessary for improved efficiency of machines. The current study investigated the friction property of angle effect for micro-scale grooved crosshatch pattern on bearing steel surface using pin-on-disk type. The samples fabricated by photolithography process and then these are carry out the electrochemical etching process. We discuss the friction property due to the influence of hatched-angle on contact surface. We could be explained the lubrication mechanism for a Stribeck curve. It was found that the friction coefficient depend on an angle of the crosshatch on contact surface. It was thus verified that micro-scale crosshatch grooved pattern could affect the friction reduction.

Duplex Surface Modification with Micro-arc Discharge Oxidation and Magnetron Sputtering for Aluminum Alloys

  • Tong, Honghui;Jin, Fanya;He, Heng
    • Journal of the Korean Vacuum Society
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    • v.12 no.S1
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    • pp.21-27
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    • 2003
  • Micro-arc discharge oxidation (MDO) is a cost-effective plasma electrolytic process which can be used to improve the wear and corrosion resistance of Al-alloy parts by forming a alumina coating on the component surface. However, the MDO coated Al-alloy components often exhibit relatively high friction coefficients and low wear resistance fitted with many counterface materials, additionally, the pitting corrosion for the MDO coated AI-alloy components, especially for a thinner alumina coating, often occurs in atmosphere circumstance due to the porous alumina coats. Therefore, a duplex treatment, combining a MDO coated ahumina thin layer with a TiN coating, prepared by magnetron sputtering (MS), has been investigated. The Vicker's microhardness, pin-on-disc, electrochemical measurement, salt spray, XRD and SEM tests were used to characterize and analyze the treated samples. The work demonstrates that the MDO/MS coated samples have a combination of a very low friction coefficient and good wear resistance as well as corrosion since the micro-holes on alumina coating are partly or fully covered by TiN material.

Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

Mechanical Characteristics and Macro-and Micro-structures on Friction Stir Welded Joints with 5083O Al Alloys (Al 5083O합금의 마찰교반용접부의 조직과 특성평가)

  • Jang, Seok-Ki;Park, Jong-Seek
    • Journal of Advanced Marine Engineering and Technology
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    • v.33 no.1
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    • pp.104-111
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    • 2009
  • This paper shows the behaviors of macro- and micro-structures and mechanical properties for specimen's welding region welded by FSW. according to welding conditions with 5mm thickness aluminum 5083O alloy plate. It apparently results in defect-free weld zone in case traverse speed was changed to 32 mm/min under conditions of anti-clockwise direction and tool rotation speed such as 800 and 1250 rpm with tool's pin diameter of 5 ${\Phi}mm$ and shoulder diameter of 20 ${\Phi}mm$, pin length of 4.5 mm and tilting angle of $2^{\circ}$. The ultimate stress of ${\sigma}_T=331$ MPa and the yield point of 147 MPa are obtained at the condition of the travel speed of 32 mm/min with the tool rotation speed of 1250 rpm. There is neither voids nor cracks on bended surface of $180^{\circ}$ after bending test. The improvement of toughness after impact test was found. The lower rotating and traverse speed became, the higher were yield point, maximum stress and elongation(%) with the stresses and the elongation(%) versus the traverse speed diagram. Vickers hardness for cross section of welding zone were also presented. The typical macro-structures such as dynamically recrystallized zone, thermo-mechanically affected zone and heat affected zone and the micro-structures of the transverse cross-section were also showed. However, the author found out that the region of 6mm far away from shoulder circumference was affected by friction heat comprehensively, that is, hardness softened and that part of micro-structures were re-solid-solution or recrystallized, the author also knew that there is no mechanically deformation on heat affected zone but there are the flow of plastic deformation of $45^{\circ}$ direction on thermo-mechanically affected zone and the segregation of Al-Mg on nugget. The solid solution wt(%) of parent material as compared against of friction stir welded zone was comprehensively changed.

Observation of Dynamic Movement of Probing Pin on PCB Pad Using Electrical Reliability Test (인쇄회로 기판의 전기검사에서의 미세 탐침과 패드의 동적 거동 현상 관측)

  • Song, Seongmin;Cha, Gangil;Kim, Myungkyu;Jeon, Seungho;Yu, SangSeok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.3
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    • pp.245-251
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    • 2015
  • In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.

Effect of Thermal Contact Resistence on the Heat Transfer Characteristics of Air Flow around the Finned Micro-Channel Tube for MF Evaporator (Micro-Channel형 열교환기에 부착된 핀의 열접촉저항이 열전달 특성에 미치는 영향)

  • Park, Yong-Seok;Sung, Hong-Seok;Sung, Dong-Min;Suh, Jeong-Se
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.11
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    • pp.121-126
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    • 2021
  • In this study, the effect of thermal contact resistance between pin-channel tubes on the heat transfer characteristics was analytically examined around the channel tubes with the pins attached to two consecutive arranged channel pipes. The numerical results showed that the heat transfer coefficient decreased geometrically as the thermal contact resistance increased, and the corresponding temperature change on the contact surface increased as the thermal contact resistance increased. The thinner the pin, the more pronounced the geometric drop in the heat transfer coefficient. It was confirmed that the higher the height of the pin, the higher was the heat transfer coefficient, however, the greater the size of the thermal contact resistance, the smaller was the heat transfer coefficient. It was found that the temperature change in the inner wall of the channel tube did not significantly affect the heat transfer characteristics owing to the thermal contact resistance. Furthermore, the velocity of air at the entrance of the channel tube was proportional to the heat transfer coefficient due to a decrease in the convective heat resistance corresponding to an increase in the flow rate.