• 산업기술연구
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• 제23권A호
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• pp.21-27
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• 2003

The bio-micro pin is usually used for biochemistry analysis. The capability of manufacturing the micro-pin and array with effective and low-cost way is very important to developers. The micro-pin is composed of "sample channel" putting liquid into already fixed volume, "flat tip" having connection with printing quantity, and "head part" for preventing it from rotation of pin in the holder. We analyzed out printing variation in accordance with shape and tip size of the micro-pin point channel, In this study, we suggested the manufacturing progress and shape demand condition of the micro-pin which could put $0.2{\mu}{\ell}$-biochemistry material into the sample volume, and will be able to produce the micro-pin which can put $10n{\ell}$-biochemistry material into the sample volume in the future.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.500-504
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• 2004

The bio-micro pin has been usually used for the biochemistry analysis. The manufacturing capability of the micro-pin and the their array with the effective and low-cost way is very important and it gives great economical benefits to developers. The micro-pin is composed of the sample channel for holding the liquid with the fixed volume, the flat tip which determines the printing quality and the pin head for preventing the rotation of the pin in the holder. In this study, we have manufactured newly designed micro-pins by the wire-EDM process with special jigs, and analyzed liquid holding and printing characteristics with respect to the variation of the shape and the tip size of the micro-pin.

• 한국세라믹학회지
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• 제35권7호
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• pp.721-725
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• 1998

본 연구에서는 Boron과 Carbon black이 소결조재로 첨가된 탄화규소 분말을 $1950^{\circ}C$에서 상압소결 방법으로 시편을 제조하고 꺽임강도, 파괴인성, 비마모량을 측정하고 파단면 및 마찰마모면의 미세구조를 SEM으로 관찰하여 마찰마모특성과 미세구조와의 관계를 규명하였다. 또한 마모상대재료로서 SiC pin과 $Al_{2}O_{3}$ pin을 사용하였을때 마찰마모특성과 미세구조와의 관계도 비교 검토하였으며 다음과 같은 결론을 얻었다. 1. SiC pin을 사용한 경우 소결시편의 비마모량은 $Al_{2}O_{3}$ pin을 사용한 경우보다 많았으나, 가압하중이 증가하면 $Al_{2}O_{3}$ pin을 사용한 경우가 SiC pin을 사용한 경우보다 비마모량의 증가율이 6.5배로 되었다. 2. Pin의 비마모량은 SiC pin의 경우가 $Al_{2}O_{3}$의 경우보다 많았으나 가압하중이 증가하면 $Al_{2}O_{3}$ pin의 경우가 SiC pin의 경우보다 비마모향의 증가율이 약4배로 되었다. 3. 마모상대재료의 마찰계수가 작은 경우에는 마모면의 미세구조가 평활하면서 crack이 나타나지 않았으나, 마찰계수가 큰 경우에는 마모면이 평활치 못하고 crack의 전파현상이 크게 나타났다. 4. 사용된 Pin의 마찰계수가 큰 경우에는 고상소결한 SiC 시편도 액상소결한 시편과 마찰마모 특성이 유사하였다.

• 동력기계공학회지
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• 제21권3호
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• pp.37-44
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• 2017

In this study, failure analysis of the angular pin for molding machines to aluminum component molding was carried out. SM45C steel was used for the angular pin, it was surface hardened by the induction surface hardening heat treatment. The cross section of damaged angular pin was observed, and micro Vickers hardness value from the fractured part was measured. Brittle fracture was occurred from the fracture surface of angular pin, therefore, impact toughness value was evaluated by V-notch Charpy impact test. It was confirmed that the impact absorption energy was high when was tempered at a high temperature for a long time, and the toughness was slightly increased. Also, 2-parameter Weibull statistical analysis was investigated in order to evaluate the reliability of the measured micro Vickers hardness values and absorbed energy. The micro Vickers hardness and absorbed energy well followed a two-parameter Weibull probability distribution, respectively. The reverse design against angular pin was proposed as possible by using test results.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.71-71
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• 2012

Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.163-164
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• 2012

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1950-1953
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• 1996

A $1\;{\times}\;4$ micro mirror array is designed and fabricated. In contrast to other micro mirrors which utilize torsional flexure hinges or cantilevers for restoring torque and supporting purpose, we have placed a substrate hinge structure under each mirror. Each micro mirror consists of address electrode, substrate hinge consisting of pin and staple, supporter post, and mirror plate. Electrical connection between mirror plate and ground electrode is established by substrate hinge. Mirror undergoes a rotational motion due to electrostatic force when voltage difference is applied between address electrode and mirror plate. Micro mirrors with two different types of staple shape and two different pin sizes are designed and fabricated. Each mirror is designed to have ${\pm}\;10^{\circ}$ of deflection angle and have $100\;{\times}\;110\;{\mu}m^2$ of size.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.225-226
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.795-796
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• 2011

• Journal of Welding and Joining
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• 제27권4호
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.