• 한국공작기계학회논문집
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• 제17권2호
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• pp.128-134
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• 2008

This paper presents a machining error compensation methodology due to deflection of micro cutting tools in side cutting processes. Generally in order to compensate for tool deflection errors it is necessary to carry out a series of simulations, cutting force prediction, tool deflection estimation and compensation method. These can induce numerous calculations and expensive costs. This study proposes an improved approach which can compensate for machining errors without simulation processes concerning prediction of cutting force and tool deflection. Based on SEM images of test cutting specimens, polynomial relationships between machining errors and corrected tool positions were induced. Taking into account changes of cutting conditions caused by tool position variation, an iterative algorithm was applied in order to determine corrected tool position. Experimental works were carried out to validate the proposed approach. Comparing machining errors of nominal cutting with those of compensated cutting, overall machining errors could be remarkably reduced.

• 한국생산제조학회지
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• 제19권3호
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• pp.370-375
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• 2010

본 연구에서는 전해가공을 이용해서 직경이 균일한 텅스텐 카바이드 미세축을 제작하는 실험을 수행하였다. 전해가공을 통해 미세축으로 사용 가능한 형상을 얻기 위한 최적의 가공 조건에 대해 고찰하였다 이 과정에서 미세축의 형상에 영향을 주는 여러 인자들을 적절하게 조절하여 최적의 형상을 얻을 수 있었다. 그리고 가공된 미세축을 이용하여 적절한 조건으로 2차, 3차 가공을 수행하여 초미세축을 가공할 수 있음을 보였다. 그리하여 실험 결과 직경 $30{\mu}m$, 길이 $500{\mu}m$의 텅스텐 카바이드 미세축을 제작하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• 소성∙가공
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• 제13권3호
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• pp.262-267
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• 2004

Ultrasonic machining has been known as one of the conventional machining methods in the glass fabrication processes. In ultrasonic machining, typically, glass is removed by the impulse energy of the abrasive generated by the ultrasonic power. However, when the machining feature decrease under hundreds of micrometers, as conventional ultrasonic machining uses only the impulse energy of the abrasive, the speed of ultrasonic machining decreases significantly and the surface roughness becomes deteriorated. To overcome this size effect, the chemicals which can erode glasses, such as HF, XF, etc, are added to the slurry. The chemical-assisted ultrasonic machining method, so called, is another alternating effective way for micro machining of glasses. In previous work, we used the hydrofluoric acid (HF) as an additive chemical. But, as the HF solution is too poisonous to be used as a ultrasonic process additive, it is needed to be substituted by other safe chemicals. As results of the machinability comparison of several chemicals, the GST-500F was selected to replace the HF. The GST-500F (pH $4.0{\pm}1.0$) is non-volatile, odorless. During experimental works, it was shown that the machining rate increases 1.5 times faster than the conventional ultrasonic machining. The machining load also decreases. However, the enlargement of the hole diameter and significant tool wear are still the problems to be solved.

• International Journal of Precision Engineering and Manufacturing
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• 제9권1호
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• pp.3-6
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• 2008

Electrical discharge machining (EDM) is one of the most widespread nonconventional machining processes. Recently, a low-power micro-EDM process was introduced using a cylindrical electrode. Since its development, micro-EDM has been applied effectively to micromachining, and because the device setup for this process is simple, it is suitable for a microfactory that minimizes machines to fabricate small products economically in one system. In the EDM process, however, the electrode is also removed along with the workpiece. Therefore, the electrode shape and length vary as machining progresses. In this paper, a control method using a high speed realtime voltage measurement is proposed to regulate the rate and amount of material removed. The proposed method is based on the assumption that the volume of the workpiece removed in a single discharge pulses is nearly constant. The discharge pulses are monitored and controlled to regulate the amount of material removed. For this purpose, we developed an algorithm and apparatus for counting the number of discharge pulses. Electrode wear compensation using pulse number information was applied to EDM milling in a microfactory, in which a slight tilt of the workpiece may occur. The proposed control method improves the machining quality and efficiency by eliminating the inaccuracies caused by electrode wear and workpiece tilt.

• Design & Manufacturing
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• 제2권5호
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• pp.43-47
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• 2008

Micro Electrochemical Machining(Micro ECM) has traditionally been used in highly specialized fields such as those of the aerospace and defense industries. It is now increasingly being applied in other industries where parts with difficult-to-cut material, complex geometry and tribology such as compute. hard disk drive(HDD) are required. Pulse Electrochemical Micro-machining provides an economical and effective method for machining high strength, high tension, heat-resistant materials into complex shapes such as turbine blades of titanium and aluminum alloys. Usually aluminum alloys are used bearings to hard disk drive in computer. In order to apply aluminum alloys to bearing used in hard disk drive, this paper presents the characteristics of Micro ECM for aluminum alloy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.976-979
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• 2002

This research presents the new method to fabricate small features through applying chemical mechanical micro machining(C3M) for Al5052 and single crystal silicon. To improve machinability of ductile and brittle material, reacted layer was formed on the surface before micro-drilling process by chemical reaction with $HNO_3$(10wt%) and KOH(10wt%). And then workpieces were machined to compare conventional micro-drilling process with newly suggested one. To evaluate whether or not the machinability was improved by the effect of chemical condition, surface defects such as burr, chipping and crack generation were measured. Finally, it is confirmed that C3M is one of the feasible tools for micro machining with the aid of effect of the chemical reaction.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.844-847
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• 2001

The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.

• 한국공작기계학회논문집
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• 제15권6호
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• pp.71-75
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• 2006

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. The target of this paper is the analysis of FIB sputtering process according to tilt angle, dwell time and overlap for application of 3D micro and pattern fabrication and to find the effective beam scanning conditions using Taguchi method. Therefore we make the conclusions that tilt angle is dominant parameter for sputtering yield. Burr size is reduced as tilt angle is higher.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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• pp.229-233
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments of the micro plasma electrode fabrications using FIB. The sputtering of FIB has one major problem that is redeposited by sputtered material including $Ga^+$ ion source. Therefore we have verified the effect of the reposition by EDX. And the optimal condition is suggested to machine the micro plasma electrode.