• 대한전자공학회논문지SD
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• 제47권11호
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• pp.1-5
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• 2010

본 논문에서는 외팔보 배열 구조를 가지는 MEMS 테스트 소켓을 SOI 웨이퍼를 이용하여 개발하였다. 외팔보는 연결부분의 기계적 취약점을 보완하기 위해 모서리가 둥근 형태를 가지고 있다. 측정에 사용 된 BGA IC 패키지는 볼 수 121개, 피치가 $650{\mu}m$, 볼 직경 $300{\mu}m$, 높이 $200{\mu}m$ 을 가지고 있다. 제작된 외팔보는 길이 $350{\mu}m$, 최대 폭 $200{\mu}m$, 최소 폭 $100{\mu}m$, 두께가 $10{\mu}m$인 곡선 형태의 외팔보이다. MEMS 테스트 소켓은 lift-off 기술과 Deep RIE 기술 등의 미세전기기계시스템(MEMS) 기술로 제작되었다. MEMS 테스트 소켓은 간단한 구조와 낮은 제작비, 미세 피치, 높은 핀 수와 빠른 프로토타입을 제작할 수 있다는 장점이 있다. MEMS 테스트의 특성을 평가하기 위해 deflection에 따른 접촉힘과 금속과 팁 사이의 저항과 접촉저항을 측정하였다. 제작된 외팔보는 $90{\mu}m$ deflection에 1.3 gf의 접촉힘을 나타내었다. 신호경로저항은 $17{\Omega}$ 이하였고 접촉저항은 평균 $0.73{\Omega}$ 정도였다. 제작된 테스트 소켓은 향 후 BGA IC 패키지 테스트에 적용 가능 할 것이다.

• 한국기계가공학회지
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• 제5권1호
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• pp.45-50
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• 2006

This paper shows a new precision actuator of MUTM(miniature universal testing machine) for the testing of compression and tensile load on the MEMS materials and structures. The MUTM consists of a sample holder, an ultraprecision precision actuator(tranlation stage) and load sensor. The precision actuator has been developed for generating displacements with nanometer accuracy and a dynamic range of 1mm simultaneously. In this paper, it can be made by using the displacement property of bi-morph type PZT, which is able to extend the long range(stroke) according to cantilever size. However, it is not enough to be generated for compression and tensile load in miniature universal testing machine. Therefore, three dozen bi-morph type PZTs are used for generating the load. The load and displacement of the precision actuator are 35g and 0.4mm respectively.

• 대한기계학회논문집A
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• 제28권6호
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• pp.717-725
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• 2004

A power generation systems are proposed to convert ambient mechanical vibration into electrical energy using cantilever-type piezoelectric materials. The vibration-based power device can be used for self-powered systems without batteries. This paper presents the theoretical analysis for the coupled equations of piezoelectric and structural motions and investigates the dynamic characteristics of the self-power system using transfer function method. The theoretical model is verified by the finite element analysis of the resonance frequency, the dynamic response of the structure and the sensor sensibility. Experimental results measured using a prototype system agree with the theoretical predictions. The system is shown to produce 34.5 ㎼ in average. Finally, we perform the optimal design for system variables to maximize output power.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.608-613
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• 2007

Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

• 한국정밀공학회지
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• 제21권4호
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• pp.32-38
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• 2004

Laser-induced thermochemical wet etching of titanium in phosphoric acid has been investigated to examine the feasibility of this method fur fabrication of microstructures. Cutting, drilling, and milling of titanium foil were carried out while examining the influence of process parameters on etch width, etch depth, and edge straightness. Laser power, scanning speed of workpiece, and etchant concentration were chosen as major process parameters influencing on temperature distribution and reaction rate. Etch width increased almost linearly with laser power showing little dependence on scanning speed while etch depth showed wide variation with both laser power and scanning speed. A well-defined etch profile with good surface quality was obtained at high concentration condition. Fabrication of a hole, micro cantilever beam, and rectangular slot with dimension of tess than 100${\mu}{\textrm}{m}$ has been demonstrated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1988-1990
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• 2002

마이크로 바이오칩용 미세 무게 감지 소자를 개발하기 위해 통상적인 MEMS 공정에 PZT sol solution을 함침하여 binder로서 적용하는 복합적인 스크린 인쇄 방법을 적용해 $800-850^{\circ}C}$의 비교적 저온에서 높은 소결밀도와 우수한 전기적인 특성을 가지는 PZT-0.12PCW 후막 구동형 캔틸레버 소자를 Pt/$TiO_2$/YSZ/$SiO_2$/Si 기판에 제조하였다. 제조된 PZT-0.12PCW 후막 구동형 캔틸레버 소자의 공진 주파수와 변위를 레이저 미소 변위 측정 시스템을 이용하여 공기 중 및 액체 중에서 측정함으로써 캔틸레버 크기에 따른 공진 특성 변화, 액체 내에서의 댐핑 효과 등을 분석할 수 있었다. 또한 Au를 증착하거나biotin-streptoavidin 반응을 통해 단백질을 고정화시켜 무게변화를 야기시킨 후 소자의 감도를 평가함으로써 PZT-0.12PCW 후막 구동형 캔틸레버를 우수한 성능의 바이오칩용 미세 무게 감지 소자로 응용할 수 있음을 알 수 있었다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 추계학술대회논문집
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• pp.1059-1066
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• 2003

A power generation system are proposed to convert ambient mechanical vibration into electrical energy using cantilever-type piezoelectric materials. The vibration-based power device can be used for self-powered systems without batteries. This paper presents the theoretical analysis for the coupled equations of piezoelectric and structural motions and investigates the dynamic characteristics of the self-power system using transfer function method. The theoretical model is verified by the finite element analysis of the resonance frequency, the dynamic response of the structure and the sensor sensibility. Experimental results measured using a prototype system agrees with the theoretical predictions. The system is shown to produce 2.53㎼ in average. Finally, we perform the optimal design for system variables to maximize output power.

• Journal of Mechanical Science and Technology
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• 제19권5호
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• pp.1065-1071
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• 2005

In this study, residual stress distribution in multi-stacked film by MEMS (Micro-Electro Mechanical System) process is predicted using Finite Element method (FEM). We evelop a finite element program for residual stress analysis (RESA) in multi-stacked film. The RESA predicts the distribution of residual stress field in multi-stacked film. Curvatures of multi­stacked film and single layers which consist of the multi-stacked film are used as the input to the RESA. To measure those curvatures is easier than to measure a distribution of residual stress. To verify the RESA, mean stresses and stress gradients of single and multi layers are measured. The mean stresses are calculated from curvatures of deposited wafer by using Stoney's equation. The stress gradients are calculated from the vertical deflection at the end of cantilever beam. To measure the mean stress of each layer in multi-stacked film, we measure the curvature of wafer with the left film after etching layer by layer in multi-stacked film.

• 한국정밀공학회지
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• 제25권7호
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• pp.87-94
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• 2008

The displacement sensor using optical pickup head is presented. The measuring principle of optical pickup head in focusing direction is adopted to measure displacement. The preliminary tests were carried out to verify the feasibility of the optical pickup head as a displacement sensor and optical pickup head showed about $8\;{\mu}m$ measuring range and 10nm resolution. The methodology to expand measuring range is proposed and proved its validity. The proposed displacement sensors are applied to AFM(Atomic Force Microscope) probe head to measure the deflection of micro-cantilever.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권6호
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.