• Journal of the Korean Society for Heat Treatment
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• v.17 no.3
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• pp.189-198
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• 2004

• Journal of Korea Foundry Society
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• v.13 no.4
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• pp.342-349
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• 1993

The purpose of this study is to obtain basic information on the particle dispersion, the coefficient of thermal expansion and the thermal conductivity of compocasted Al-xSi-2Cu-1Mg/ySiC(x:6, 12, 18. $y:0{\sim}10wt.%$) composite. With increasing the content of SiC particles, the thermal expension coefficient and the thermal conductivity decrease. The coefficient of thermal expension between 20 and $300^{\circ}C$ is $21.3{\times}10^{-6}/^{\circ}C{\sim}18.0{\times}10^{-6}/^{\circ}C$ for the Al-Si alloys and $18.4{\times}10^{-6}/^{\circ}C{\sim}16.0{\times}10^{-6}/^{\circ}C$ for the composite with 10wt.% SiC. The thermal conductivity at $300^{\circ}C$ is $121{\sim}169W{\cdot}m^{-1}{\cdot}k^{-1}$ for the Al-Si alloys and $114{\sim}159W{\cdot}m^{-1}{\cdot}k^{-1}$ for the composite with 10wt.% SiC.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.2
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• pp.119-128
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• 2022

Recent advancement of Internet of Things (IoT) and energy harvesting technology enable realization of flexible thermoelectric energy harvester (f-TEH), with technological prowess for use in biomedical monitoring system integrated applications. To expand a flexible thermoelectric energy harvesting platform, the f-TEH must be required for optimized flexible thermoelectric materials and device structure. In response to these demands related to thermoelectric energy harvesting, many research groups have investigated various f-TEHs applied as a power source for wearable electronics. As a key member of the f-TEH, film-based f-TEHs possess significant applicability in research to realize self-powered wearable electronics, owing to their excellent flexibility, low thermal conductivity, and convenient fabrication process. Thus, based on the rapid growth of thermoelectric film technology, this review aims to overview comprehensively the f-TEH made of various inorganic/organic thermoelectric materials including developed fabrication methods, high thermoelectric performance, and wide-range applications.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.533-537
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• 1995

The stress in Permalloy thin films fabricated by rf magnetron sputtering on the Si (100) substrates has been investigated with various deposition parameters such as the film thickness, argon pressure, and rf power. The internal stress changes from compressive to tensile with higher input power and argon pressure. The cause of stress variations with these deposition parameters is discussed in terms of thermal and/or intrinsic stress changes. Low coercive force is obtained from Permalloy thin films at a condition of low compressive stress.

• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1028-1034
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• 2001

The 2.5 vol% TiNi/6061Al composites were fabricated by permanent mold casting. The microstructures and tensile test for the cold rolled composites with maximum 50% reduction ratio were investigated. In the case of TiNi fiber with 2mm interval in preform, the interface bonding of fabricated composites were good, interface diffusion layer of this composites was made by the mutual diffusion. Transverse section of TiNi fiber was decreased with increasing reduction ratio and longitudinal section of TiNi fiber showed multiple wave phenomenon. And the tensile strength of composites at 38% reduction ratio was the most high. In the case of over 38% reduction ratio, the decrease of the tensile strength was due to TiNi fiber rupture by excess working. The fracture mode was appeared brittle fracture with increasing reduction ratio.

• Journal of Ocean Engineering and Technology
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• v.26 no.3
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• pp.55-60
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• 2012

This study was carried out to investigate the effect of the deformation temperature in high manganese austenitic stainless steel. ${\alpha}$'-martensite was formed with a specific direction by deformation. The volume fraction of the deformation induced martensite was increased by increasing the degree of deformation and decreasing the deformation temperature. With the increase in the deformation, the hardness and tensile strength were increased, while the elongation was rapidly decreased at the initial stage of the deformation, and then gradually decreased. The hardness and tensile strength were increased and the elongation was decreased with adecrease in the deformation temperature. The hardness and tensile strength were strongly controlled by the volume fraction of martensite, but the elongation was controlled by the transformation behavior of the deformation induced martensite.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.5
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• pp.195-199
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• 2008

Production of the silicon feedstock for the semiconductor industry cannot meet the requirement for the solar cell industry because the production volume is too small and production cost is too high. This situation stimulates the solar cell industry to try the lower grade silicon feedstock like UMG (Upgraded Metallurgical Grade) silicon of 5$\sim$6 N in purity. However, this material contains around 1 ppma of dopant atoms like boron or phosphorous. Calculation of the composition profile of these impurities using segregation coefficient during crystal growth makes us expect the change of the type from p to n : boron rich area in the early solidified part and phosphorous rich area in the later solidified part of the silicon ingot. It was expected that the change of the growth speed during the silicon crystal growth is effective in controlling the amount of the metal impurities but not effective in reducing the amount of dopants.

• Journal of Korea Foundry Society
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• v.30 no.2
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• pp.60-65
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• 2010

In this study, we investigate the effects of austempering heat treatment on the processing window and mechanical properties in cast and hot-rolled Fe-0.7 C-2.3 Si-0.3 Mn steel. Each specimens were austenitised at $900^{\circ}C$ for 7 min, and austempered at $260^{\circ}C,\;320^{\circ}C$, and $380^{\circ}C$ for the various periods of time from 2 min to 240 min. After heat treatment, the evaluation of stage I and stage II as performed by optical metallography, XRD, hardness test. Both cast and hot rolled specimens had similar processing window. So grain size effect is not important to the austempered high carbon high silicon cast steel. When the austempering temperature was $260^{\circ}C$, the microstructure consisted of the lower ausferrite while the upper ausferrite structure was formed at $380^{\circ}C$. As the austempering temperature increases from 260 to $380^{\circ}C$, the strength and hardness decreased, elongaton and volume fraction of austenite increased. In addition, there was no change of mechanical properties between cast and hot-rolled specimens.

• Journal of Korea Foundry Society
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• v.29 no.6
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• pp.277-283
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• 2009

Recently an increase in production cost of 300 series stainless steel with a sudden increase in nickel cost has caused a decrease in demand for 300 series stainless steel so that 400 series stainless steel has begun to make a mark. Although 400 series stainless steel has good properties, it has a problem of lack of corrosion resistance. There is Ti in 400 series stainless steel alloys to solve the problem above and it has lower density than the others. For that reason, wire feeding process has been applied for adding Ti alloy in 400 series stainless steel. This paper presents consideration of variation on the depth of wire dissolution by conditions of wire feeding which are wire injection speed, the temperature of molten steel, wire diameter and bubble generation rate. The computer program for solution of conducting wire feeding has been developed in Flow3D.