• Polymer(Korea)
• /
• v.34 no.1
• /
• pp.25-31
• /
• 2010

Polymer core and metal shell composite particles have been prepared by the electroless nickel plating on the surface of monodisperse polystyrene microspheres. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling the dispersion medium in dispersion polymerization. Electroless nickel plating was performed on the polystyrene particle with diameter of $3.4\;{\mu}m$. The morphology of polystyrene/nickel composite particles was investigated to see the effect of the plating conditions, such as the $PdCl_2$ and glycine concentrations and the dropping rate of nickel plating solution, on nickel deposition. With $PdCl_2$ and glycine concentrations at more than 0.4 g/L and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was introduced by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min showed rather uniform plating.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.2 s.31
• /
• pp.11-16
• /
• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Journal of Electrochemical Science and Technology
• /
• v.14 no.1
• /
• pp.85-95
• /
• 2023

In recent years, solid-state Li metal batteries (SSLBs) have attracted significant attention as the next-generation batteries with high energy and power densities. However, uncontrolled dendrite growth and the resulting pulverization of Li during repeated plating/stripping processes must be addressed for practical applications. Herein, we report a plastic-crystal-based polymer/ceramic composite solid electrolyte (PCCE) to resolve these issues. To fabricate the one-side ceramic-incorporated PCCE (CI-PCCE) film, a mixed precursor solution comprising plastic-crystal-based polymer (succinonitrile, SN) with garnet-structured ceramic (Li₇La₃Zr₂O₁₂, LLZO) particles was infused into a thin cellulose membrane, which was used as a mechanical framework, and subsequently solidified by using UV-irradiation. The CI-PCCE exhibited good flexibility and a high room-temperature ionic conductivity of over 10^-3 S cm^-1. The Li symmetric cell assembled with CI-PCCE provided enhanced durability against Li dendrite penetration through the solid electrolyte (SE) layer than those with LLZO-free PCCEs and exhibited long-term cycling stability (over 200 h) for Li plating/stripping. The enhanced Li⁺ transference number and lower interfacial resistance of CI-PCCE indicate that the ceramic-polymer composite layer in contact with the Li anode enabled the uniform distribution of Li⁺ flux at the interface between the Li metal and CI-PCCE, thereby promoting uniform Li plating/stripping. Consequently, the Li//LiFePO₄ (LFP) full cell constructed with CI-PCCE demonstrated superior rate capability (~120 mAh g^-1 at 2 C) and stable cycle performance (80% after 100 cycles) than those with ceramic-free PCCE.

• Korean Journal of Materials Research
• /
• v.23 no.11
• /
• pp.661-665
• /
• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Journal of environmental and Sanitary engineering
• /
• v.13 no.2
• /
• pp.121-127
• /
• 1998

This study was to understand leaching characteristics with pH controlling agents and Temp. control, and investigate leaching characteristics with pH control from opening a leaching test to an end for reassessing leaching test of heavy metals with environmental conditions in landfill. Because leaching of heavy metals was increased in low pH, pH must control for leaching in existing leaching test. Generally, regulation time(6hr) of leaching was confirmed reasonablely, except for Cu in plating sludge. In pH controlling solution, there was nearly not difference between Acetic acid and HCl and if considering Cu, the former was appropriate. In a part of heavy metal, leaching rate was increased in high Temp., and normal Temp. in existing leaching test would be revaluated.

• Korean Journal of Materials Research
• /
• v.21 no.6
• /
• pp.309-313
• /
• 2011

The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.10 no.4
• /
• pp.96-101
• /
• 2011

The thin films of TiN have been used extensively as wear-resistant materials, for instance, such as tools of high-speed cutting, metal mold forming etc. In these days, because the thin films capable of being used more severe conditions are needed, the technologies of arc ion plating are tried to improve its characteristics. The purpose of this study is to investigate the characteristics of thin films of (Ti,Cr)N compared with those of TiN. The method of arc ion plating, which is known as showing good tight-adherence and productivity, was used. After manufacturing thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) with change of Cr in (Ti,Cr) target, atomic concentration, structure, size of crystallite, residual stress and surface roughness of thin films on substrate were investigated. As the results, it was confirmed that Cr atomic concentrations of thin films were proportionally changed with Cr atomic concentrations of target, and thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) showed NaCl type and CrN existed as solid solution to TiN.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.192-193
• /
• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Membrane Journal
• /
• v.28 no.4
• /
• pp.252-259
• /
• 2018

An acidic, real metal-plating wastewater was treated by a fluidized bed membrane reactor introduced with granular activated carbon (GAC) as fluidized media. With GAC fluidization, there was no increase in suction pressure with time at each flux set-point applied. At neutral solution pH, much less fouling rate was observed than acidic pH under GAC fluidization. Higher solution pH resulted in the increase in particle size in metal-finishing wastewater, thus producing a less dense cake structure on membrane. More than 95% of chemical oxygen demand was observed from the fluidized bed membrane reactor under GAC fluidization. Total suspended solid concentration in membrane permeate was near zero. At the raw wastewater pH, no removal of copper and chromium by the fluidized bed membrane reactor was observed. As the pH was increased to 7.0, removal efficiency of copper and chromium was increased considerably to 99 and 94%, respectively. Regardless of solution pH tested, more than 95% of cyanide was removed possibly due to the strong adsorption of organic-cyanide complex on GAC in fluidized bed membrane reactor.

• Journal of Welding and Joining
• /
• v.21 no.4
• /
• pp.31-38
• /
• 2003

Line heating is an effective and economical process for forming flat metal plates into three-dimensional shapes for plating of ships. Because the nature of the line heating process is a transient thermal process, followed by a thermo elastic plastic stress field, predicting deformed shapes of plate is very difficult and complex problem. In this paper, neural network model o3r solving the inverse problem of metal forming is proposed. The backpropagation neural network systems for determining line-heating positions from object shape of plate are reported in this paper. Two cases of the network are constructed-the first case has 18 lines which have different positions and directions and the second case has 10 parallel heating lines. The input data are vertical displacements of plate and the output data are selected heating lines. The train sets of neural network are obtained by using an analytical solution that predicts plate deformations in line heating process. This method shows the feasibility that the neural network can be used to determine the heating-line positions in line heating process.