• Progress in Superconductivity and Cryogenics
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• v.18 no.1
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• pp.28-32
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• 2016

There are a few thousand abandoned metal mines in South Korea. The abandoned mines cause several environmental problems including releasing acid mine drainage (AMD), which contain a very high acidity and heavy metal ions such as Fe, Cu, Cd, Pb, and As. Iron oxides can be formed from the AMD by increasing the solution pH and inducing precipitation. Current study focused on the formation of iron oxide in an AMD and used the oxide for adsorption of heavy metals. The heavy metal adsorbed iron oxide was separated with a superconducting magnet. The duration of iron oxide formation affected on the type of mineral and the degree of magnetization. The removal rate of heavy metal by the adsorption process with the formed iron oxide was highly dependent on the type of iron oxide and the solution pH. A high gradient magnetic separation (HGMS) system successfully separated the iron oxide and harmful heavy metals.

• Journal of Environmental Health Sciences
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• v.21 no.1
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• pp.47-55
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• 1995

Minari(Oenanthe stolonifera DC.) lived in serious polluted water is able to remove chemical elements from batch system. This study attempted to compare the incorporation of cadmium and lead in batch system. Different concentrations of Cd(0.02 0.1 0.5 1.00 5.00 mg/l) and Pb(0.1 0.5 1.0 5.0 10.0 mg/l) were used. Toxic effects were obvious at Cd 1.00 mg/l and Pb 5.00 mg/l. The detrimental effects on minari were chlorosis of leaves and stunted roots and reduction in the number of lateral roots. There was reduction in growth rates exposed above Cd 1.00 mg/l and lead 5.0 mg/l. The minari capacities to remove Cd were 34.1-74.2% and Pb were 53.0~91.5%. The removal rates by minari in Cd and Pb solution were decreased with increased exposure concentration(in Cd r=0.97, in Pb r=0.88). The removal rates by minari in Cd and Pb solution were increased with increased growth rate(in Cd r=0.93 in Pb r=0.92). Recovery rates on minari are 67.3~95.2% in Cd water and 72.6~88.3% in Pb water. The rates are increased with increased growth rates and decreased initial concentrations.

• Membrane and Water Treatment
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• v.10 no.3
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• pp.239-244
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• 2019

Plating wastewater containing various heavy metals can be produced by several industries. Specifically, we focused on the removal of copper (Cu2+) and nickel (Ni+) ions from the plating wastewater because all these ions are strictly regulated when discharged into watershed in Korea. The application of both nanofiltration (NF) and reverse osmosis (RO) technologies for the treatment of wastewater containing copper and nickel ions to reduce fresh water consumption and environmental degradation was investigated. In this work, the removal of copper (Cu2+) and nickel (Ni+) ions from synthetic water was studied on pilot scale remove by before using two commercial nanofiltration (NF) and reverse osmosis(RO) spiral-wound membrane modules (NE2521-90 and RE2521-FEN by Toray Chemical). The influence of main operating parameters such as feed concentration on the heavy metals rejection and permeate flux of both membranes, was investigated. Synthetic plating wastewater samples containing copper ($Cu^{2+}$) and nickel ($Ni^{2+}$) ions at various concentrations(1, 20, 100, 400 mg/L) were prepared and subjected to treatment by NF and RO in the pilot plant. The results showed that NF, RO process, with 98% and 99% removal for copper and nickel, respectively, could achieve high removal efficiency of the heavy metals.

• Korean Journal of Chemical Engineering
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• v.35 no.11
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• pp.2198-2206
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• 2018

We addressed the development of a novel, low-cost, and high-efficient material from hybrid materials, known as microcapsules. Microcapsules are a composite adsorbent made of a mixture of tannin, sericite and chitosan. The FT-IR analysis showed that the microcapsules contain hydroxyl, carboxyl, carbonyl, and amino groups, which play an important role in the adsorption of heavy metals. The microcapsules were able to remove 99% of Pb(II) in 30 min, and obtained a removal efficiency of more than (13-50)%, compared with the single adsorbents of tannin, chitosan, and sericite. In adsorption kinetic analysis, pseudo-second-order adsorption was more suitable than pseudo-first-order adsorption, and chemical adsorption did not limit the adsorption rate of Pb(II) ion. In isothermal adsorption, Langmuir adsorption was more suitable than Freundlich adsorption, and the maximum Langmuir adsorption capacity was 167.82 (mg/g). Furthermore, desorption and reusability studies, as well as the applicability of the material for wastewater treatment, demonstrated that microcapsules offer a promising hybrid material for the efficient removal of significant water pollutants, i.e., Pb(II) from aqueous solutions.

• Bulletin of the Korean Chemical Society
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• v.25 no.7
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• pp.969-976
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• 2004

Cassava peelings waste, which is both a waste and pollutant, was chemically modified using mercaptoacetic acid (MAA) and used to adsorb $Cu^{2+}\;and\;Cd^{2+}$ from aqueous solution over a wide range of reaction conditions at $30^{\circ}C$. Acid modification produced a larger surface area, which significantly enhanced the metal ion binding capacity of the biomass. An adsorption model based on the $Cu^{2+}/Cd^{2+}$ adsorption differences was developed to predict the competition of the two metal ions towards binding sites for a mixed metal ion system. The phytosorption process was examined in terms of Langmuir, Freundlich and Dubinin-Radushkevich models. The models indicate that the cassava waste biomass had a greater phytosorption capacity, higher affinity and greater sorption intensity for $Cu^{2+}\;than\;Cd^{2+}$. According to the evaluation using Langmuir equation, the monolayer binding capacity obtained was 127.3 mg/g $Cu^{2+}$ and 119.6 mg/g $Cd^{2+}$. The kinetic studies showed that the phytosorption rates could be described better by a pseudo-second order process and the rate coefficients was determined to be $2.04{\times}10^{-3}\;min^{-1}\;and\;1.98{\times}10^{-3}\;min^{-1}\;for\;Cu^{2+}\;and\;Cd^{2+}$ respectively. The results from these studies indicated that acid treated cassava waste biomass could be an efficient sorbent for the removal of toxic and valuable metals from industrial effluents.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.80-87
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• 2002

Tungsten carbide microshaft is used as micro-punch, electrode of MEDM (micro-electro-discharge machining), and micro-tool because it has high hardness and high rigidity. In this study, the tungsten carbide microshaft was fabricated using electrochemical machining. Concentration of material removal at the sharp edge and metal corrosion layer affect the shape of the microshaft. Control of microshaft shape was possib1e through conditioning the machining voltage and electrolyte concentration. By applying periodic voltage, material removal rate increased and surface roughness improved. The fabricated microshaft in $H_2 SO_4$ electrolyte maintained sharper end edge and better surface finish than those fabricated by other electrolytes.

• Journal of the Korean Society of Marine Environment & Safety
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• v.3 no.2
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• pp.77-84
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• 1997

For the effective treatment of shipboard sewage continuously, a non-diaphragm electrolytic treatment device using DSA type insoluble electrode, Ti/IrO2, anode and H-C metal cathode, was studied. The most effective electrolytic conditions were obtained when cell clearance, 6mm, pH 5-6 and the concentration of seawater, more than 20% as batch test results. The COD removal rate was varied in logarithmic function, showed as C=Coe-KE and the required current was E = A/QCo [A.min/mgCOD]. When the COD removal effeciency was more than 90%, the electrolytic reaction constant was 0.02.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• Korean Journal of Materials Research
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• v.16 no.12
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• pp.731-738
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• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.