• 제목/요약/키워드: metal plating

검색결과 335건 처리시간 0.026초

플라스틱 도금 기술에 대한 이해와 동향 (Understanding and trends in plastic plating technology)

  • 노지왕;배인경;김현우;김선규
    • 한국표면공학회지
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    • 제57권4호
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    • pp.225-233
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    • 2024
  • The plastic plating process refers to coating a thin metal film onto a plastic surface. This technique has become essential for replacing costly metal products while maintaining equivalent performance, making plastic plating a critical technology. This paper presents an overview of the methods and future prospects of plastic plating.

백금의 무 전해 도금에 의한 이온성 고분자-금속 복합물 액추에이터의 제작 공정 및 특성 측정 (Fabrication Process and Characterization of Sonic Polymer-Metal Composite Actuators by Electroless Plating of Platinum)

  • 차승은;박정호;이승기
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권9호
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    • pp.455-463
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    • 2002
  • Ionic Polymer metal composite(IPMC), one of new actuation materials of EAPs is fabricated by electroless plating of platinum on both sides of the perfluorosulfonic acid film or Nafion film and its electromechanical characteristics are investigated. The IPMC strip bends towards anode under electrical field. As the number of plating cycle increases, the distance between plated platinum electrodes on both sides of Nafion membrane decreases and also the displacement is almost inversely proportional to the number of plating. The displacement of IPMC strip depends on voltage magnitude and applied signal frequency and its maximum deformation is observed at a critical frequency, resonant frequency. Low pressure sandblasting is used for surface treatment of Nafion membrane and at 8 times of plating cycle produced actuator with high displacement performance. For more efficiency of fabricated IPMC, it is useful to add one or two surface developing step which is the second reduction process using hydrazine.

전기도금용 펄스 전원장치 (Pulse Rectifier For Electroplating)

  • 권순걸
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2000년도 전력전자학술대회 논문집
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    • pp.685-688
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    • 2000
  • Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.

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해양환경 중에서 Cr도금의 부식 특성에 관한 연구 (The Study on the Corrosion Characteristics of Cr Plating in Marine Environment)

  • 임우조;곽남인;윤병두
    • 수산해양기술연구
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    • 제39권3호
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    • pp.211-217
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    • 2003
  • 해양환경의 비저항 변화에 따른 모재, Ni도금 및 Cr도금의 분극저항, 부식전류밀도, 부식억제율 및 분극지배기구에 관하여 연구한 결과 다음과 같은 결론을 얻었다. 1) Cr도금 및 Ni도금의 분극저항은 모재의 분극저항보다 더 높게 나타나고, 이들 재료의 분극저항은 비저항이 감소함에 따라 낮아진다. 2) 비저항이 낮아질수록 Cr도금 및 Ni도금의 부식전류밀도는 모재의 부식전류보다 더 억제됨에 따라 Ni 및 Cr도금의 부식억제율은 더 높게 된다. 3) 해양환경의 비정항에 따른 모재, Ni도금 및 Cr 도금의 부식반응은 음극지배로 판단된다.(이 논문의 결론부분임)

Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP

  • Oh, Young-Joo;Jeung, Won-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.829-831
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    • 2003
  • In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

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무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화 (Electroless Ni-P layer Characteristics in accordance with the plating process conditions)

  • 이홍기;전준미;박해덕
    • 한국표면공학회지
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    • 제36권3호
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

도재소부전장관(陶材燒付前奬冠) 파절수리시(破折修理時) 표면처리(表面處理) 방법(方法)에 따른 수복(修復)레진의 유지력(維持力)에 관(關)한 연구(硏究) (COMPARISON OF RETENTIVE FORCE OF REPAIR RESIN BY VARIOUS SURFACE TREATMENT METHODS IN THE REPAIR OF FRACTURED PORCELAIN FUSED TO METAL CROWN)

  • 임헌송;허성주;조인호
    • 대한치과보철학회지
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    • 제30권1호
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    • pp.73-83
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    • 1992
  • Now composite resin restoration is clinically accepted in the repair of fractured PFM case, many mechanical surface treatment methods are performed to increase retentive force. The main purpose of this study was to compare the retentive force among the possible surface treatments and to insure the best method for the clinical application to the fractures porecelain and the exposed metal surface. To compare and to analyze the retentive force of repair resin, porcelain specimen were divided into 2 groups, etching group and non-etching group, and etching group were treated with 37% $H_3PO_4$, 1.23% APF, 10% HF and non-etching groups were treated with diamond bur, micro-sandblasasting. Also, metal specimens were divided by 2 groups : one was non-precious metal group which was treated with diamond bur, micro-sandblasting and tin plating and electrolytic etching, the other was precious metal group which was composed of micro-sandblasting treatment only and tin plating treatment with micro-sandblasting. Each specimen had been restored for 48 hours and the bond strength of each specimen was calculated with Universal testing machine. The results were as follows : 1. Porcelain specimen had higher bonding strength than metal specimen for the repair resin(P<0.01). 2. In porcelain specimen, 10% HF etching group had the highest bonding strength among etching and non-etching group. 3. Metal specimen treated with micro-sandblasting had highest bonding strength among the non-sandblasting had hightest bonding strength among the non-precious group, tin plating group had higher bonding strength than micro-sandblasting group between the precious metal groups. 4. Bonding strength of tin plating was increased in precious metal group only.

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굴껍질을 이용한 도금폐수의 중화 및 중금속 이온 제거 (Neutralization and removal of heavy metal ions in Plating wastewater utilizing Oyster Shells)

  • 성낙창;김은호;김정권;김형석
    • 한국환경보건학회지
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    • 제22권3호
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    • pp.81-87
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    • 1996
  • The purpose of this research is to examine the utilization of oyster shells for neutralization and removal of heavy metal ions in plating wastewater, because oyster shells have been known to be very porous, to have high specific surface area and to have alkaline minerals such as calcium and magnesium. The results obtianed from this research showed that oyster shells had a buffer capacity to neutralize an acidic.alkali system in plating wastewater. Generally, it could be showed that the removal efficiencies of heavy metal ions were very influenced by reaction times and oyster shell dosages. In point of ocean waste, if oyster shells substituted for a valuable adsorbent such as actviated carbon, they could look forward to an expected economical effect.

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비산회를 이용한 도금폐수의 응집처리 (Coagulation of the Metal-Plating Wastewater using Coal Fly Ash)

  • 연익준;김광렬
    • 환경위생공학
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    • 제17권3호
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    • pp.37-45
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    • 2002
  • The Purpose of this study is to reduce environmental problems caused by landfill of bituminous coal fly ash emitted from the power plant and to reuse it. First of all, we experimented that Al and Si elements were extracted from fly ash and investigated that extracted Al and Si elements night use a coagulant. The extraction was carried out under various conditions ; concentration of the extraction solution, calcination temperature and calcination time. As the results, it was found that the optimum conditions of the extraction of Al and Si elements from fly ash were as follows, concentration of NaOH was 5N for both of them, calcination temperature was $700^{\circ}C$ and $600^{\circ}C$ and calcination time was 1hr and 1.5hr, respectively The extracted solution was used as a coagulant to treat the diluted metal-plating solutions which contained Pb and Cu, respectively. As the result of treatment on the diluted Pb-plating solution with 315NTU, the removal efficiency of turbidity was more than 90%, and the removal efficiency of Pb was about 80%. As for treatment of the non-turbid diluted Cu-plating solution, the removal efficiency of Cu was about 98%.

Metal Deposit Distribution in Barrel Plating of Partially Conductive Load

  • 이완구
    • 기술사
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    • 제16권3호
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    • pp.68-73
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    • 1983
  • IC전자부품 중 DIP계 종류를 바렐을 사용하여 주석도금 할 때에 그 전착현상을 조사하여 부분전류의 동태를 설명할 수 있는 변화인자를 알아보려 하였다. DIP와 같은 모양인 IC부품은 부분전도체로 구분되어지며 그 전착상태를 one-dimensional model로 분석하였을때, 가입전류밀도, 바렐의 회전속도, 용액중 금속이온 농도와 깊은 관계가 있음을 보인다. 다공질과 같은 것으로 간주한 one-dimensional model로서 의 이론식은 J=$\delta$'/$\beta$-{-c$^3$/${\gamma}$-exp-(1-$\alpha$)n$\Phi$}로 표현된다.

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