• Title/Summary/Keyword: metal films

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Growth behavior on initial layer of ZnO:P layers grown by magnetron sputtering with controlled by $O_2$ partial pressure

  • Kim, Yeong-Lee;An, Cheol-Hyeon;Bae, Yeong-Suk;Kim, Dong-Chan;Jo, Hyeong-Gyun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.28.1-28.1
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    • 2009
  • The superior properties of ZnO such as high exciton binding energy, high thermal and chemical stability, low growth temperature and possibility of wet etching process in ZnO have great interest for applications ranging from optoelectronics to chemical sensor. Particularly, vertically well-aligned ZnO nanorods on large areas with good optical and structural properties are of special interest for the fabrication of electronic and optical nanodevices. Currently, low-dimensional ZnO is synthesized by metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), thermal evaporation, and sol.gel growth. Recently, our group has been reported about achievement the growth of Ga-doped ZnO nanorods using ZnO seed layer on p-type Si substrate by RF magnetron sputtering system at high rf power and high growth temperature. However, the crystallinity of nanorods deteriorates due to lattice mismatch between nanorods and Si substrate. Also, in the growth of oxide using sputtering, the oxygen flow ratio relative to argon gas flow is an important growth parameter and significantly affects the structural properties. In this study, Phosphorus (P) doped ZnO nanorods were grown on c-sapphire substrates without seed layer by radio frequency magnetron sputtering with various argon/oxygen gas ratios. The layer change films into nanorods with decreasing oxygen partial pressure. The diameter and length of vertically well-aligned on the c-sapphire substrate are in the range of 51-103 nm and about 725 nm, respectively. The photoluminescence spectra of the nanorods are dominated by intense near band-edge emission with weak deep-level emission.

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Progress in R&D of coated conductor in M-PACC project

  • Izumi, T.;Ibi, A.;Nakaoka, K.;Taneda, T.;Yoshida, T.;Takagi, Y.;Nakamura, T.;Machi, T.;Katayama, K.;Sakai, N.;Yoshizumi, M.;Koizumi, T.;Kimura, K.;Kato, T.;Kiss, T.;Shiohara, Y.
    • Progress in Superconductivity and Cryogenics
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    • v.16 no.2
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    • pp.1-6
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    • 2014
  • The five-year national project in Japan for R&D of coated conductors and applications, named as the Materials and Power Applications of Coated Conductors (M-PACC) project, was finished at the end of FY2013. The project consists of four sub-themes as cable, transformer, SMES and coated conductors. In the theme of coated conductors, the fabrication process had been developed to satisfy the requirements from the applications such as in-field $I_c$ performance, low AC loss in the long tapes etc. Through the project, the remarkable progress was achieved as follows; a high in-field minimum $I_c$ value over 54A/cm-width under 3T at 77K was realized in a 200m long EuBCO tape with artificial pinning centers of $BaHfO_3$ by the pulsed laser deposition (PLD) technique on the IBAD template. On the other hand, the AC loss reduction was confirmed in the tapes fabricated by both PLD and the metal organic deposition (MOD) techniques by scribing 100m tapes into 10-filamments. Additionally, the mechanism of the delamination phenomenon was systematically investigated and the strength was improved by eliminating the origins of the weak points in the films. Through the development, all targeted goals were accomplished and the several results were appreciated as a world champion data.

Influence of $Ar^+$ ion Bombardment on the Chemical States of ${SrBi_2}{Ta_2}{O_9}$ Thin Films Fabricated by Metal-Organic Decomposition ($Ar^+$이온 충격이 MOD 법에 의해 제조된 ${SrBi_2}{Ta_2}{O_9}$박막의 화학 상태에 미치는 영향)

  • Park, Yoon-Baek;Cho, Kwang-Jun;Lee, Moon-Keun;Heo, Sung;Lee, Tae-Kwon;Kim, Ho-Joung;Min, Kyung-Youl;Lee, Sun-Young;Kim, Yil-Wook
    • Journal of the Korean Ceramic Society
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    • v.37 no.11
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    • pp.1084-1090
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    • 2000
  • (Bi$_2$O$_2$)$^{2+}$층 사이에 두 개의 Ta-O 팔면체로 연결된 Bi 계의 층상 페로브스카이트 구조인 SrBi$_2$Ta$_2$O$_{9}$ (SBT) 박막을 XPS를 이용하여 깊이별 화학 상태 변화를 분석하였다. 아르곤 이온으로 SBT 박막을 식각하면, SBT 박막의 각 구성물들은 가속 Ar$^{+}$ 이온의 에너지에 따라 변화한다. SBT 각 구성물 중 Sr 3d의 화학 상태는 Ar$^{+}$ 이온의 에너지변화에 따라 근소하게 변화한다. 반면에, Ta 4f와 Bi 4f의 화학 상태 변화는 인가되는 Ar$^{+}$ 이온 에너지에 확실하게 의존한다. 특히, Bi 4f는 Sr과 Ta에 비해 낮은 Ar$^{+}$ 이온 에너지에서도 Bi-O의 화학 상태가 금속 Bi 화학 상태로 현저하게 변화한다. 이러한 SBT 박막의 화학 상태 변화는 산호 원자의 선택적인 식각 때문에 발생하며 선택적인 식각은 SBT 박막 내에서 각 구성물과 산소간의 질량 차이와 각 구성물의 열적 안정성에 의존함을 알 수 있다.

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Effects of ${Y_2}{O_3}$Buffer Layer on Ferroelectric Properties of $YMnO_3$Thin Films Fabricated on Pt/$TiO_2$/$SiO_2$/Si Substrate (Pt/$TiO_2$/$SiO_2$/Si 기판 위에 제조된 $YMnO_3$박막의 강유전 특성에 미치는 ${Y_2}{O_3}$버퍼층의 영향)

  • 김제헌;강승구;은희태
    • Journal of the Korean Ceramic Society
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    • v.37 no.11
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    • pp.1097-1104
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    • 2000
  • MOD(Metal-Organic-Decomposition)법에 의해 $Y_2$O$_3$버퍼층에 Pt/TiO$_2$/SiO$_2$/Si 기판 위에 제조한 후, 그 표면 위에 졸-겔 방법으로 YMnO$_3$박막을 형성하였다. 기판의 종류와 수화조건 변화가 YMnO$_3$박막의 결정화 거동에 미치는 영향을 고찰하였으며, 또한 $Y_2$O$_3$버퍼층 유.무에 따른 Mn의 산화상태를 확인하고 이에 따른 유전특성 변화를 연구하였다. $Y_2$O$_3$버퍼층을 삽입하지 않고 직접 기판 위에 형성한 YMnO$_3$박막의 결정상은 기판의 종류 및 Rw 변화에 관계없이 orthorhombic 구조임이 확인되었다. 반면, $Y_2$O$_3$버퍼층 위에 형성된 YMnO$_3$박막의 경우에는 Rw($H_2O$/alkoxide mole ratio)가 0~6 범위 내에서 낮아질술고 hexagonal 결정상 성장에 유리하였으며, 또한 Pt(111)/TiO$_2$/SiO$_2$/Si 기판이 Ptd(200)/TiO$_2$/SiO$_2$/Si에 비하여 결정상 형성에 용이하였다. $Y_2$O$_3$버퍼층은 YMnO$_3$결정상 내에서 $Mn^{4+}$ 이온형성을 억제함으로써 누설전류밀도가 크게 감소되는 효과를 주었으며, 동시에 강유전 특성을 지닌 hexagonal 결정상 형성에 유리하게 작용하였다. 결론적으로, $Y_2$O$_3$는 Pt가 코팅된 Si 기판 위에 YMnO$_3$박막 제조시 그 강유전 특성을 향상시켜주는 우수한 버퍼층 재료임을 확인하였다.

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Optimization of Printing Process for the Development of Metal-oxide Resistivity Sensor (전기저항형 금속산화물 센서의 인쇄공정 최적화에 관한 연구)

  • Lee, Seokhwan;Koo, Jieun;Lee, Moonjin;Jung, Jung-Yeul;Chang, Jiho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.6
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    • pp.353-358
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    • 2016
  • In this paper, we have studied about the optimum fabrication condition of the printed Indium Tin Oxide (ITO) layers for the electrical resistance-type sensor application. We have investigated on the substrates surface treatments, mixing ratio of organic binder/ITO powder, and viscosity of the printing paste to determine the optimum condition of the screen printed ITO layer. Also, we found that the printing condition is closely related with the sensor performance. To know the feasibility of printed ITO layer as an electrical resistance-type sensor, we have fabricated the ITO sensors with a printed and sputtered ITO layers. The printed ITO films revealed $10^2$ times higher sensitivity than the sputtered ITO layer. Also, the sputtered ITO layer exhibited an operating temperature of $127^{\circ}C$ at the operating voltage of 5 V. While, in case of the printed ITO layer showed the operating temperature of $27.6^{\circ}C$ in high operating voltage of 30 V. We found that the printed ITO layer is suitable for the various sensor applications.

Epitaxial growth of high-temperature ZnO thin films on sapphire substrate by sputtering (마그네트론 스퍼터링에 의한 사파이어 기판위에 고온에서의 ZnO박막의 에피성장)

  • Kim, Young-Yi;Ahn, Cheol-Hyoun;Kang, Si-Woo;Kong, Bo-Hyun;Cho, Hyung-Koun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.151-151
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    • 2007
  • 최근에 에피 성장된 ZnO는 UV-LED, 화학적-바이오센서와 투명전도 전극에 많은 관심을 받고 있다. 고 품질의 ZnO는 Metal-organic chemical vapor deposition(MOCVD), Pulsed laser deposition(PLD), molecular beam epitaxy(MBE), 그리고 마그네트론 스퍼터링법에 의해 성장이 이루어지고 있다. 대부분의 ZnO는 사파이어, 싫리콘과 같은 이종 기판 위에 성장되고 있으며, Heteroepitaxy로 성장된 ZnO 박막은 기판과 박막사이의 격자상수, 열팽창계수 차이로 인해 높은 결함 밀도를 보이고 있다. 이러한 문제점은 광전자 소자 응용에 있어 여러 가지 문제점을 야기 시킨다. 이와 같은 문제점을 해결하기 위해 박막과 기판사이에 저온 버퍼층을 사용하거나 같은 물질의 버퍼층을 사용하여 결할 밀도를 감소시키고, 높은 결정성을 가진 ZnO 박막을 성장시킨 결과들이 많이 보고되어지고 있다. 본 연구에서는 마그네트론 스퍼터링 법으로 저온 버퍼층 성장 없이 성장온도 만을 달리 하여 고품질의 ZnO 박막을 성장시켰다. ZnO 박막은 c-sapphire 기판위에 ZnO(99.9999%)의 타겟을 사용하여 $600{\sim}800^{\circ}C$ 온도에서 성장시켰고, 스퍼터링 가스로는 아르곤과 산소를 2:1 비율로 혼합하여 15mtorr의 압력에서 성장하였다. 이렇게 성장시킨 ZnO 박막은 Transmission Electron Microscopy (TEM), High-Resolution X-ray Diffraction (HRXRD), Low-temperature PL, 그리고 Atomic Force Microscopy (AFM)로 특성을 분석 하였다. ZnO 박막은 HRXRD (002) 면의 $\omega$-rocking curve운석 결과, $0.083^{\circ}$의 작은 FEHM을 얻었고, (102) 면의 $\varphi$-sacn을 통해 온도가 증가함에 따라 향상된 6-fold을 확인함으로새 에피성장됨을 알 수 있었다. 또한 TEM분석을 통해 $800^{\circ}C$에서 성장된 박막은 $6.7{\times}10^9/cm^2$의 전위밀도를 얻을 수 있었다.

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Memory Effect of $In_2O_3$ Quantum Dots and Graphene in $SiO_2$ thin Film

  • Lee, Dong Uk;Sim, Seong Min;So, Joon Sub;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.240.2-240.2
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    • 2013
  • The device scale of flash memory was confronted with quantum mechanical limitation. The next generation memory device will be required a break-through for the device scaling problem. Especially, graphene is one of important materials to overcome scaling and operation problem for the memory device, because ofthe high carrier mobility, the mechanicalflexibility, the one atomic layer thick and versatile chemistry. We demonstrate the hybrid memory consisted with the metal-oxide quantum dots and the mono-layered graphene which was transferred to $SiO_2$ (5 nm)/Si substrate. The 5-nm thick secondary $SiO_2$ layer was deposited on the mono-layered graphene by using ultra-high vacuum sputtering system which base pressure is about $1{\times}10^{-10}$ Torr. The $In_2O_3$ quantum dots were distributed on the secondary $SiO_2$2 layer after chemical reaction between deposited In layer and polyamic acid layer through soft baking at $125^{\circ}C$ for 30 min and curing process at $400^{\circ}C$ for 1 hr by using the furnace in $N_2$ ambient. The memory devices with the $In_2O_3$ quantum dots on graphene monolayer between $SiO_2$ thin films have demonstrated and evaluated for the application of next generation nonvolatile memory device. We will discuss the electrical properties to understating memory effect related with quantum mechanical transport between the $In_2O_3$ quantum dots and the Fermi level of graphene layer.

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In-situ Synchrotron Radiation Photoemission Spectroscopy Study of Properties Variation of Ta2O5 Film during the Atomic Layer Deposition

  • Lee, Seung Youb;Jeon, Cheolho;Jung, Woosung;Kim, Yooseok;Kim, Seok Hwan;An, Ki-Seok;Park, Chong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.283.2-283.2
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    • 2013
  • The variation of chemical and interfacial state during the growth of Ta2O5 films on the Si substrate by atomic layer deposition (ALD) was investigated using in-situ synchrotron radiation photoemission spectroscopy. A newly synthesized liquid precursor Ta(NtBu)(dmamp)2Me was used as the metal precursor, with Ar as a purging gas and H2O as the oxidant source. The core-level spectra of Si 2p, Ta 4f, and O 1s revealed that Ta suboxide and Si dioxide were formed at the initial stages of Ta2O5 growth. However, the Ta suboxide states almost disappeared as the ALD cycles progressed. Consequently, the Ta5+ state, which corresponds with the stoichiometric Ta2O5, only appeared after 4.0 cycles. Additionally, tantalum silicate was not detected at the interfacial states between Ta2O5 and Si. The measured valence band offset value between Ta2O5 and the Si substrate was 3.08 eV after 2.5 cycles.

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Fabrication of Hot Embossing Plastic Stamps for Microstructures (마이크로 구조물 형성을 위한 핫 엠보싱용 플라스틱 스탬프 제작)

  • Cha Nam-Goo;Park Chang-Hwa;Lim Hyun-Woo;Park Jin-Goo;Jeong Jun-Ho;Lee Eung-Sug
    • Korean Journal of Materials Research
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    • v.15 no.9
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    • pp.589-593
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    • 2005
  • Nanoimprinting lithography (NIL) is known as a suitable technique for fabricating nano and micro structures of high definition. Hot embossing is one of NIL techniques and can imprint on thin films and bulk polymers. Key issues of hot embossing are time and expense needed to produce a stamp withstanding a high temperature and pressure. Fabrication of a metal stamp such as an electroplated nickel is cost intensive and time consuming. A ceramic stamp made by silicon is easy to break when the pressure is applied. In this paper, a plastic stamp using a high temperature epoxy was fabricated and tested. The plastic stamp was relatively inexpensive, rapid to produce and durable enough to withstanding multiple hot embossing cycles. The merits of low viscosity epoxy solutions were a fast degassing and a rapid filling the microstructures. The hot embossing process with plastic stamp was performed on PMMA substrates. The hot embossing was conducted at 12.6 bar, $120^{\circ}C$ and 10 minutes. An imprinted PMMA wafer was almost same value of the plastic stamp after 10 times embossing. Entire fabrication process from silicon master to plastic stamp was completed within 12 hours.

NiOx-based hole injection layer for organic light-emitting diodes (유기발광소자에 적용 가능한 NiOx 기반의 정공주입층 연구)

  • Kim, Junmo;Gim, Yejin;Lee, Wonho;Lee, Donggu
    • Journal of Sensor Science and Technology
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    • v.30 no.5
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    • pp.309-313
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    • 2021
  • Organic semiconductors have received tremendous attention for their research because of their tunable electrical and optical properties that can be achieved by changing their molecular structure. However, organic materials are inherently unstable in the presence of oxygen and moisture. Therefore, it is necessary to develop moisture and air stable semiconducting materials that can replace conventional organic semiconductors. In this study, we developed a NiOx thin film through a solution process. The electrical characteristics of the NiOx thin film, depending on the thermal annealing temperature and UV-ozone treatment, were determined by applying them to the hole injection layer of an organic light-emitting diode. A high annealing temperature of 500 ℃ and UV-ozone treatment enhanced the conductivity of the NiOx thin films. The optimized NiOx exhibited beneficial hole injection properties comparable those of 1,4,5,8,9,11-hexaazatriphenylene hexacarbonitrile (HAT-CN), a conventional organic hole injection layer. As a result, both devices exhibited similar power efficiencies and the comparable electroluminescent spectra. We believe that NiOx could be a potential solution which can provide robustness to conventional organic semiconductors.