• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.452-455
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• 2003

[ $ZrO_2$ ] dielectric layers were grown on the p-type Si (100) substrate by metalorganic molecular beam epitaxy(MOMBE). Zrconium t-butoxide, $Zr(O{\cdot}t-C_4H_9)_4$ was used as a Zr precursor and Argon gas was used as a carrier gas. The thickness of the layers was measured by scanning electron microscopy (SEM) and the properties of the $ZrO_2$ layers were evaluated by X-ray diffraction, high frequency capacitance-voltage measurement. and HF C-V measurements have shown that $ZrO_2$ layer grown by MOMBE has a high dielectric constant (k=18-19). The growth rate is affected by various process variables such as substrate temperature, bubbler temperature, Ar, and $O_2$ gas flows.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.848-850
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• 1999

In this study, PZT etching was performed using planar inductively coupled Ar(20)/$Cl_2/BCl_3$ plasma, The etch rate of PZT film was 2450 $\AA/min$ at Ar(20)/$BCl_3$(80) gas mixing ratio and substrate temperature of $80^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis for film composition was utilized. The chemical bond of PbO is broken by ion bombardment, and the peak of metal Pb in a Pb 4f peak begins to appear upon etching, decreasing Pb content faster than Zr and Ti. As increase content of additive $BCl_3$, the relative content of oxygen decreases rapidly. We thought that abundant Band BCl radicals made volatile oxy-compound such as $B_{x}O_{y}$ and/or $BClO_x$ bond. To understand etching mechanism, Langmuir probe and optical emission spectroscopy (OES) analysis were utilized for plasma diagnostic.

• 한국표면공학회지
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• 제40권1호
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• pp.6-10
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• 2007

For low-emissivity application on window glass, coalescence of thin film silver islands is crucial for high transmittance in the visible and high reflectance in the infrared. It is well known that the underlayer affects the growth mode. In this work, the effect of the underlayer on the growth of silver films deposited by filtered cathodic vacuum arc is discussed. While a nominal 0.1 nm niobium underlayer has promoted the coalescence of silver islands, a 0.2 nm layer did not show these features. From a thermodynamic approach, Nb seeding less one monolayer is considered to reduce the surface energy between the silver atoms and $Nb/TiO_2$ surface, resulting the change of its growth from 3D islands to 2D-layer modes. If the seed layer exceeds one monolayer, however, a rougher surface is formed because the surface energy of Nb itself is superior to that of $Nb-TiO_2$. The onset of silver layer on the roughened Nb surface is required more silver.

• 공업화학
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• 제1권2호
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• pp.161-167
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• 1990

Methylphenyldichlorosilane을 중합시켜 poly(methylphenyl)silane(PMPS)을 합성하고 이를 photoresist로 이용하는데 있어서 화상형상특성을 설명하기 위하여 노광에 의한 광학계수 X, Y, Z를 측정하였다. 광학계수 X, Y, Z는 PMPS 필름에 광조사를 시킨 다음 투과도를 측정하여 구하였으며, 계수 Z는 광조사 시간에 따른 투과도의 초기 기울기로 부터 구하였다. 이들 계수로 부터 PMPS에 각종 증감제를 첨가하여 제조한 필름에 광조사를 시켜 광조사특성을 이론적으로 구하고 이를 잔막수득율을 측정한 결과 Z치와 잔막수득율은 parallel한 관계가 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.145-145
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• 2012

반도체 집적회로의 집적도가 증가함에 따라 RC delay가 증가하며, 금속 배선의 spiking, electromigration 등의 문제로 인해 기존의 알루미늄 금속을 대체하기 위하여 구리를 배선재료로 사용하게 되었다. 하지만 구리는 실리콘 및 산화물 내에서 매우 빠른 확산도를 가지고 있으므로, 구리의 확산을 막아 줄 확산방지막이 필요로 하다. 이러한 확산방지막의 증착은, 소자의 크기가 작아짐에 따라 via/contact과 같은 고단차 구조에도 적용이 가능하도록 기존의 sputtering 증착 방법에서 이를 개선한 collimated sputter, long-throw sputter, ion-metal plasma 등의 방법으로 물리적인 증착법이 지속되어 왔지만, 근본적인 증착방법을 바꾸지 않는 한 한계에 도달하게 될 것이다. 원자층 증착법(ALD)은 CVD 증착법의 하나로, 소스와 반응물질을 주입하는 시간을 분리함으로써 증착하고자 하는 표면에서의 반응을 유도하여 원자층 단위로 원하는 박막을 얻을 수 있는 증착방법이다. 이를 이용하여 물리적 증기 증착법(PVD)보다 우수한 단차피복성과 함께 정교하게 증착두께를 컨트롤을 할 수 있다. 본 연구에서는 이러한 원자층 증착법을 이용하여 구리 배선을 위한 확산방지막으로 텅스텐질화막을 형성하였다. 텅스텐 질화막을 형성하기 위하여 금속-유기물 전구체와 함께 할라이드 계열인 WF6를 텅스텐 소스로 이용하였으며, 이에 대한 원자층 증착방법으로 이루어진 박막의 물성을 비교 평가하여 분석하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.351-351
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• 2011

Graphene has drawn great interests because of its distinctive band structure and physical properties[1]. A few of the practical applications envisioned for graphene include semiconductor applications, optoelectronics (sola cell, touch screens, liquid crystal displays), and graphene based batteries/super-capacitors [2-3]. Recent work has shown that excellent electronic properties are exhibited by large-scale ultrathin graphite films, grown by chemical vapor deposition on a polycrystalline metal and transferred to a device-compatible surface[4]. In this paper, we focussed our scope for the understanding the graphene growth at different conditions, which enables to control the growth towards the application aimed. The graphene was grown using chemical vapor deposition (CVD) with methane and hydrogen gas in vacuum furnace system. The grown graphene was characterized using a scanning electron microscope(SEM) and Raman spectroscopy. We changed the growth temperature from 900 to $1050^{\circ}C$ with various gas flow rate and composition rate. The growth condition for larger domain will be discussed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.24-25
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• 2011

Molecular self-assembly has several advantages over other nanofabrication methods. Molecular building blocks ensure ultrafine pattern precision, parallel structure formation allows for mass production and a variety of three-dimensional structures are available for fabricating complex structures. Nevertheless, the molecular interaction for self-assembly generally relies on weak forces such as van der Waals force, hydrogen bonding, or hydrophobic interaction. Due to the weak interaction, the structure formation is usually slow and the degree of ordering is low in a self-assembled structure. To promote self-assembly, directed assembly methods employing prepatterned substrates or external fields have been developed and gathered a great deal of technological attention as a next generation nanofabrication process. In this presentation a variety of directed assembly methods for soft nanomaterials including block copolymers, peptides and carbon nanomaterials will be introduced. Block copolymers are representative self-assembling materials extensively utilized in nanofabrication. In contrast to colloid assembly or anodized metal oxides, various shapes of nanostructures, including lines or interconnected networks, can be generated with a precise tunability over their shape and size. Applying prepatterned substrates$^{1,2}$ or introducing thickness modulation$^3$ to block copolymer thin films allowed for the control over the orientational and positional orderings of self-assembled structures. The nanofabrication processes for metals, semiconductors$^4$, carbon nanotubes$^{5,6}$, and graphene$^{6,7}$ templating block copolymer self-assembly will be presented.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.376-376
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• 2011

I-III-VI2 chalcopyrite compounds, particularly copper, indium, gallium selenide(Cu(InxGa1-x)Se2, CIGS), are effective light-absorbing materials in thin-film solar application. They are direct band-gap semiconductors with correspondingly high optical absorption coefficients. Also they are stable under long-term excitation. CIS (CIGS) solar cell reached conversion efficiencies as high as 19.5%. Several methods to prepare CIS (CIGS) absorber films have been reported, such as co-evaporation, sputtering, selenization, and electrodeposition. Until now, co-evaporation is the most successful technique for the preparation of CIS (CIGS) in terms of solar efficiency, but it seems difficult to scale up. CIS solar cells have been hindered by high costs associated with a fabrication process. Therefore, inorganic colloidal ink suitable for a scalable coating process could be a key step in the development of low-cost solar cells. Here, we will present the preparation of CIS photo absorption layer by a solution process using novel metal precursors. Chalcopyrite copper indium diselenide (CuInSe2) nanocrystals ranging from 5 to 20nm in diameter were synthesized by arrested precipitation in solution. For the fabrication of CIS photo absorption layer, the CuInSe2 colloidal ink was prepared by dispersing in organic solvent and used to drop-casting on molybdenum substrate. We have characterized the nanoparticless and CIS layer by XRD, SEM, TEM, and ICP.

• 한국표면공학회지
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• 제51권1호
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• pp.34-39
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• 2018

Steel crucible used for molten Al has a problem of very limited lifetime because of the interaction between Fe and molten Al. This study was performed to improve the lifetime of steel crucible for molten Al by coating metallic Al and by further anodizing treatment to form thick and uniform anodic oxide films. The lifetime of the steel crucible was improved slightly by Al coating from 30 to 40 hours by metallic Al coating and largely to 120 hours by coating the surface with anodic oxide film. The improved lifetime was attributed to blocking of the reaction between Fe and molten Al with the help of anodic oxide layer with more than 20 um thickness on the crucible surface. The failure of the steel crucible arises from the formation of intermetallic compounds and pores at the steel/Al interface.

• 한국초전도ㆍ저온공학회논문지
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• 제4권2호
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• pp.5-10
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• 2002

Deposition condition of NiO that is one of Possible buffer layers for YBCO coated conductors was studied. NiO was deposited on textured Ni substrates by a MOCVD (metal-organic chemical vapor deposition) method. The degree of texture, and the surface roughness were analyzed by X-ray Pole figure, atomic force microscope and scanning electron microscope. The (111) and (200) textures were competitively developed , depending on an oxygen partial Pressure(PO2) and deposition temperature (Tp). The (200) textured NiO layer was deposited at Tp=450~47$0^{\circ}C$ and PO2= 1.67 Torr Out-of-Plane ($\omega$-scan) and in-plane ($\Phi$-scan) textures of the (200) NiO films were as good as 10.34$^{\circ}$ and 10.00$^{\circ}$ respectively The AFM surface roughness of NiO was in the range of 3~4.5 nm at PO2=0.91~3.34 Torr and at Tp=47$0^{\circ}C$ , and in the range of 3~13 nm at TP=450~53$0^{\circ}C$ and at PO2=1.67 Torr.