• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.4
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• pp.528-536
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• 1999

This work studies the effects of transient reflectance on the thermal responses of a metal(gold) thin-film during ultrashort laser heating. The heating process is calculated using the conventional conduction model (parabolic one-step: POS), parabolic two-step model (PTS) with and without variable properties, hyperbolic two-step model (HTS). Results from the HTS model are very similar to those from the PTS model, since the laser heating time in this study is greater than the electron relaxation time. PTS model with variable properties, however, results in totally different temperature profiles compared to those from POS models or calculation with constant properties. Transient reflectances are estimated from electron temperature distributions and based on the linear relationship between the electron temperature and complex dielectric constants. Reflectance of the front surface can be changed with respect to dielectric constants, while those of the rear surface remain unchanged.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1061-1064
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• 2003

In this paper, we deposited A1$_2$O$_3$ thin film using atomic layer deposition(ALD) method on Ti and fabricated metal-insulator-metal(MIM) capacitor. In the result of this study, the typical deposition rate was about 1.12$\AA$/cycle. About 30 nm of Ti was consumed during deposition and TiO$_{x}$ was formed at the interface of A1$_2$O$_3$ and Ti. Its surface roughness was 1.54nm. The leakage current density was 1.5 nA/$\textrm{cm}^2$. The temperature coefficient of capacitance(TCC) of MIM capacitor was 41 ppm/$^{\circ}C$ at 1MHz and 100 ppm/$^{\circ}C$ at 100 kHz.z.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.287-288
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• 2015

최근 투명 산화물 전극 (TCO)은 LED, electronic display, solar cell, touch screen panel (TSP) 등 다양한 분야에 많이 사용되고 있다. TCO는 높은 광 투과도와 전도성으로 인해 여러 분야에 많이 사용되고 있으며, 특히 ITO (Sn-doped indium oxide)가 display 분야에 많이 적용되고 있다. 하지만, ITO는 투과도와 면저항의 반비례 관계를 가지므로 더 낮은 면저항이 요구되는 대면적 TSP 분야에 적용되기에는 많은 개선이 필요하다. 따라서, 본 연구에서는 metal mesh film의 연구를 통해 TSP 분야에 사용되는 ITO를 대체하고자 한다. 제작된 mesh film은 모두 면저항은 $15{\Omega}/{\square}$ 이하, 광 투과도 90% (@550nm) 이상을 나타내었다.

• Journal of the Optical Society of Korea
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• v.20 no.5
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• pp.563-566
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• 2016

We report a theoretical research for the condition of electromagnetic shield breaching when a narrow aperture is punctured in thin metal film. To calculate electromagnetic field transmission through a narrow slit, a Rayleigh wave expansion has been applied for free standing, thin metal film. We found that the DC electric field allows perfect transmission when the length of the slit is infinite, regardless of the other geometrical factors such as slitwidth and thickness. Slitwidth dependent transmission spectra as a function of frequency shows a cutoff frequency that decreases almost linearly to the slitwidth, giving that almost successful shielding is only possible when the slitwidth is smaller than 1 micron.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.163-168
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• 2010

We here describe the laser-direct patterning of nanostructured metal thin films. This method involves light-matter interaction in which a pulsed laser beam impinging on the film generates a thermoelastic force that plays a role to detach the film from the substrate or underlying layers. A moderate cohesion of the nanostructured film enables localized desorption of the material upon irradiation by a spatiallymodulated laser beam, giving good fidelity with the transfered pattern. This photoresist-free process provides a simple high-resolution scheme for patterning metal thin films.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.6
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• pp.283-287
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• 2002

We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.425-425
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• 2008

Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3mW is obtained at the temperature difference of 45K. We provide a promising approach for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which can employ nanostructures for high thermoelectric properties.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.30-34
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• 2023

Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.28-32
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• 2010

Technical demands for aspheric glass lens formed in market increases its application from simple camera lens module to fiber optics connection module in optical engineering. WC is often used as a metal core of the aspheric glass lens, but the long life time is issued because it fabricated in high temperature and high pressure environment. High hard thin film coating of lens core increases the core life time critically. Diamond Like Carbon(DLC) thin film coating shows very high hardness and low surface roughness, i.e. low friction between a glass lens and a metal core, and thus draw interests from an optical manufacturing industry. In addition, DLC thin film coating can removed by etching process and deposit the film again, which makes the core renewable. In this study, DLC films were deposited on the SiC ceramic core. The process variable in FVA(Filtered Vacuum Arc) method was the substrate bias-voltage. Deposited thin film was evaluated by raman spectroscopy, AFM and nano indenter and measured its crystal structure, surface roughness, and hardness. After applying optimum thin film condition, the life time and crystal structure transition of DLC thin film was monitored.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2022.04a
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• pp.59-60
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• 2022

When a metal sprayed film of several hundred ㎛ on the concrete surface is possible to 80 dB of shielding effect electromagnetic waves (ElectroMagnetic Pulse, EMP). Therefore, in this study, as a way to secure EMP shielding performance by applying a metal spray coating showing excellent EMP shielding performance to a concrete structure, the metal spray welding efficiency and thin film adhesion performance according to the concrete spray direction and surface treatment method were evaluated. Metal sprayed efficieny according to the metal spraying direction and method was confirmed that the difference was insignificant by applying the roughening agent. However, the method of strengthening the concrete surface and applying the sealing agent show maximum adhesion strength of 3.98 MPa compared to other methods, and it is judged that this method can be utilized for the metal spraying method for concrete EMP shielding.