• Design & Manufacturing
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• 제16권1호
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• pp.50-54
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• 2022

Coverglass of electronic equipments is thinner and slimmer, so the glass must have good bending strength. In these days, the polishing edge of glass is used by solid tool like grinding wheel. But solid tool leave micro crack or edge chipping in edge of glass. MR polishing is an optimal method by polishing edge of glass. MR polishing is used MR fluid that is a liquid tool. MR polishing doesn't leave tool path or residual stress, micro crack and edge chipping unlike grinding wheel polishing. In this paper, the results of grinding and MR polishing were compared and analyzed to improve bending strength by minimizing edge chipping of cover glass. It was derived that the depth and size of cracks have a significant influence on the bending strength of the glass edge. The edges of the glass using MR grinding were analyzed to have a better surface and higher bending strength than the glass using abrasive wheel grinding. It was confirmed that MR polishing had an effect on strength improvement by effectively removing cracks in the specimen.

• 한국전기전자재료학회논문지
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• 제18권5호
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• pp.414-422
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• 2005

This paper shows the results of atomistic modeling for the Interaction between spherical nano abrasive and substrate In chemical mechanical polishing processes. Atomistic modeling was achieved from 2-dimensional molecular dynamics simulations using the Lennard-jones 12-6 potentials. We proposed and investigated three mechanical models: (1) Constant Force Model; (2) Constant Depth Model, (3) Variable Force Model, and three chemical models, such as (1) Chemically Reactive Surface Model, (2) Chemically Passivating Surface Model, and (3) Chemically Passivating-reactive Surface Model. From the results obtained from classical molecular dynamics simulations for these models, we concluded that atomistic chemical mechanical polishing model based on both Variable Force Model and Chemically Passivating-reactive Surface Model were the most suitable for realistic simulation of chemical mechanical polishing in the atomic scale. The proposed model can be extended to investigate the 3-dimensional chemical mechanical polishing processes in the atomic scale.

• 대한금속재료학회지
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• 제48권8호
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• pp.730-740
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• 2010

Aluminum, magnesium, titanium and high Mn steel are difficult to use in electron backscatter diffraction (EBSD) sample preparation due to the formation of an oxidation layer under conventional polishing. Alcohol-based polishing with colloidal silica suspension was introduced for these delicate samples. A hard particle-embedded sample was analyzed successfully using mechanical polishing. Ion-milling was effective in removing oxidized, deformed and transformed layers after mechanical polishing and was able to reduce artifacts significantly. The microstructure of a cross-section of a thin copper film was evaluated by attachment of a dummy to the film for mechanical polishing.

• Tribology and Lubricants
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• 제34권3호
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Tribology and Lubricants
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• 제33권3호
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• 한국정밀공학회지
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• 제26권8호
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• pp.55-61
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• 2009

Recently, many studies are being conducted to realize high quality polishing technology, but because of high dependence on field experience and insufficient research for ultra-precision polishing technology, it is difficult to establish standardization of polishing conditions. The purpose of this study is to determine high-efficiency superfinishing conditions which are applicable in the field of machining. To achieve this, we have a developed a superfinishing device and conducted a series of polishing experiments for mechanical materials such as SM45C, Brass, Al7075, and Ti, from the perspective of oscillation speed, the rotational speed of the workpiece, contact roller hardness, contact pressure, and feed rate. From the experimental results, it was confirmed that the polishable superfinishing conditions range and efficient feed rate of polishing film can be determined.

• Design & Manufacturing
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• 제11권2호
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• pp.20-24
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• 2017

Recent industrial developments are constantly advancing, and rapid technological development is demanding high technology level in related fields. The need for polishing is increasing even more to improve quality. In order to improve the surface quality, the final finishing process or polishing process is a very important part. Research on super precise polishing method using MR fluid is actively being carried out in domestic and foreign countries. Fine magnetic abrasive grains are aligned in the direction of a magnetic force line formed by a magnetic field and serve as a brush to polish a metal surface. This method has the advantage that the shape of the tool is not fixed and is not affected by the shape of the workpiece or the machining area. We will design the electromagnets for the MR polish polishing system and apply the magnetic field analysis using the magnetic field analysis program (ANSYS). The data obtained through this process suggests an efficient method to increase the magnetic flux density important for polishing. We will investigate the influence of the Al6061-T6 specimen on the surface of the MR polishing machine based on the optimized design.

• Design & Manufacturing
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• 제11권3호
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• pp.8-12
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• 2017

In general, metallic bio-materials is more widely used in solid tissue like bone or tooth than flexible tissue such as skin or muscle. Especially, Cobalt Chrome Molybdenum(Co-Cr-Mo), which is used in tooth surgery, has a great corrosion resistance. Because this bio-material is non-toxic in human body, and has a bio-compatibility that the vital reaction is not occurred with tissue in body. However the chemical reaction is occurred by fatal matter that deteriorate the property of material surface in conventional polishing, and it can affect to fatal disease in human body or decrease the material properties such as hardness, yield strength or bio-compatibility. This surface in poor condition can cause development of corrosion or bacteria. In this study, MR fluid polishing is used to minimize the scratch, pit or surface flaws generated in conventional polishing. Surface roughness is measured according to the polishing condition to obtain fine surface condition.

• 한국기계가공학회지
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• 제14권6호
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• pp.136-141
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• 2015

Laser surface polishing is a polishing method for improving surface roughness using an integrated laser beam. Using a laser for surface polishing can improve the surface condition without physical contact or chemical action. Laser polishing has mainly been used to polish the surface of diamond or optical articles, such as lenses and glasses. Recently, diverse studies on laser polishing for metals have been conducted. The analytic study of laser surface polishing has been conducted with experimental trials for comparison, so that the proper conditions for laser polishing can be recommended. In this study, laser surface polishing was simulated in order to predict the heat-affected zone on the die steel depending on the power of the pulsed laser. The simulated results were verified by comparing them to those of the experimental trials. Through this study, therefore, the application of FEM to the selection of appropriate laser conditions could be possible.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1998년도 제13차 학술회의논문집
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• pp.346-351
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• 1998

Cutting process has been automated due to progress of CNC and CAD/CAM, but polishing process has been only depended on experiential knowledge of expert. Polishing work for a curved surface die demands simple and repetitive operations but requires much time for its high precision. Therefore it is operated in the handiwork by skilled worker. However the workers intend to avoid gradually polishing work because of the poor environments such as dust and noise. In order to reduce the polishing time and solve the problem of shortage of skilled workers, it has been done some research for an automation of polishing. To automate the polishing process, a 2 axes polishing robot which is attached to a 3 axes machining center has been developed by our previous research. This automatic polishing robot is able to keep the polishing tool normal on the curved surface of die. Therefore its performance of polishing is improved because of always keeping the tool normal on the surface. In this paper, the smaller sized polishing robot is developed to improve polishing performance. And the controller for 2 axes polishing robot is developed. The controller is composed of TMS320C31 with high speed which is 40-ns instruction cycle time, RAM memory with 64K words, digital input with 64 bits, digital output with 32 bits, and D/A converter with 4 channels, which is 12 bits resolution. To evaluate polishing performance of this developed robot, polishing experiment for shadow mask was carried out.