• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.13 no.4
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• pp.283-293
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• 2015

The buffer is a key component of the engineered barrier system in a high-level radioactive waste (HLW) repository. The present study reviewed the requirements and functional criteria of the buffer reported in literature, and also based on the results, proposed an approach to establish a buffer concept which is applicable to an HLW repository in Korea. The hydraulic conductivity, radionuclide-retarding capacity (equilibrium distribution coefficient and diffusion coefficient), swelling pressure, thermal conductivity, mechanical properties, organic carbon content, and illitization rate were considered as major technical parameters for the functional criteria of the buffer. Domestic bentonite (Ca-bentonite) and, as an alternative, MX-80 (Na-bentonite) were proposed for the buffer of an HLW repository in Korea. The technical specifications for those proposed bentonites were set to parameter values that conservatively satisfy Korea's functional criteria for the Ca-bentonite and Swedish criteria for the Na-bentonite. The thickness of the buffer was determined by evaluating the means of shear behavior, radionuclide release, and heat conduction, which resulted in the proper buffer thickness of 0.25 to 0.5 m. However, the final thickness of the buffer should be determined by considering coupled thermal-hydraulic-mechanical evaluation and economics and engineering aspects as well.

• Elastomers and Composites
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• v.58 no.1
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• pp.44-56
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• 2023

Additive manufacturing (AM) or three-dimensional (3D) printing of metals has been drawing significant attention due to its reliability, usefulness, and low cost with rapid prototyping. Among the various AM technologies, fused deposition modeling (FDM) or fused filament fabrication is receiving much interest because of its simple manufacturing processing, low material waste, and cost-effective equipment. FDM technology uses metal-filled polymer filaments for 3D printing, followed by debinding and sintering to fabricate complex metal parts. An efficient binder is essential for producing polymer filaments and the thermal post-processing of printed objects. This study involved an in-depth investigation of and a fabrication route for a novel multi-component binder system with steel alloy powder (45 vol.%) ranging from filament fabrication and 3D printing to debinding and sintering. The binder system consisted of polyvinyl pyrrolidone (PVP) as a binder and thermoplastic polyurethane (TPU) and polylactic acid (PLA) as a carrier. The PVP binder held the metal components tightly by maintaining their stoichiometry, and the TPU and PLA in the ratio of 9:1 provided flexibility, stiffness, and strength to the filament for 3D printing. The efficacy of the binder system was examined by fabricating 3D-printed cubic structures. The results revealed that the thermal debinding and sintering processes effectively removed the binder/carrier from the cubic structures, resulting in isotropic shrinkage of approximately 15.8% in all directions. The scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) patterns displayed the microstructure behavior, phase transition, and elemental composition of the 3D cubic structure.

• Structural Engineering and Mechanics
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• v.86 no.1
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• pp.1-16
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• 2023

The free vibration of temperature-dependent functionally graded plates (FGPs) resting on a viscoelastic foundation is investigated in this paper using a newly developed simple first-order shear deformation theory (FSDT). Unlike other first order shear deformation (FSDT) theories, the proposed model contains only four variables' unknowns in which the transverse shear stress and strain follow a parabolic distribution along the plates' thickness, and they vanish at the top and bottom surfaces of the plate by considering a new shape function. For this reason, the present theory requires no shear correction factor. Linear steady-state thermal loads and power-law material properties are supposed to be graded across the plate's thickness. Uniform, linear, non-linear, and sinusoidal thermal rises are applied at the two surfaces for simply supported FGP. Hamilton's principle and Navier's approach are utilized to develop motion equations and analytical solutions. The developed theory shows progress in predicting the frequencies of temperature-dependent FGP. Numerical research is conducted to explain the effect of the power law index, temperature fields, and damping coefficient on the dynamic behavior of temperature-dependent FGPs. It can be concluded that the equation and transformation of the proposed model are as simple as the FSDT.

• Korea-Australia Rheology Journal
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• v.19 no.4
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• pp.183-190
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• 2007

Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.273-278
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• 2012

$ZrB_2$ has a melting temperature of $3245^{\circ}C$ and a low density of $6.1\;g/cm^3$, which makes this a candidate for application to ultra-high temperature over $2000^{\circ}C$. Beside these properties, $ZrB_2$ has excellent resistance to thermal shock and oxidation compared with other non-oxide engineering ceramics. This paper reviewed briefly 2 research examples, which are related to densification and properties of $ZrB_2$-based ceramics for ultra-high temperature applications. In the first section, the effect of $B_4C$ addition on the densification and properties of $ZrB_2$-based ceramics is shown. $ZrB_2$-20 vol.% SiC system was selected as a basic composition and $B_4C$ or C was added to this system in some extents. With sintered bodies, densification behavior and hightemperature (up to $1400^{\circ}C$) properties such as bending strength and hardness are examined. In the second section, the effect of the SiC size on the microstructures and physical properties is shown. $ZrB_2$-SiC ceramics are fabricated by using various SiC sources in order to investigate the grain-growth inhibition and the mechanical/thermal properties of $ZrB_2$-SiC.

• Tribology and Lubricants
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• v.33 no.3
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• pp.98-105
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• 2017

A pin-on-disk test is performed to measure the wear volume of a ductile cast iron (DCI) roll when it wears down using a high carbon steel and two alloy steels at different sliding velocities between the roll and the material (steel). Normal pressure is set as constant and test temperatures are 400, 500 and $600^{\circ}C$. In addition, thermal softening behavior of the DCI roll is examined using a high-temperature micro-hardness tester and the surface hardness variation of the DCI roll is expressed in terms of temperature and heating time. Based on experimental data, a wear coefficient used in Archard's wear model for each material is obtained. The wear volume is clearly observed when the test temperature is $400^{\circ}C$ and sliding velocity varies. However, it is not measured at temperatures of $500^{\circ}C$ and $600^{\circ}C$ even with variations in sliding velocity. From the optical photographs of the pin and disk, the abrasive wear is observed at $400^{\circ}C$ clearly, but no at $500^{\circ}C$ and $600^{\circ}C$. At higher temperatures, the pin surface is not smooth and has many tiny caves distributed on it. It is found that wear volume is dependent on the carbon contents rather than alloy contents. Results also reveal that the variations of wear coefficients are almost linearly proportional to the carbon contents of the material.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• The Journal of Advanced Prosthodontics
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• v.8 no.1
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• pp.30-36
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• 2016

PURPOSE. The aim of this study was to evaluate the fracture resistance and fracture behavior of monolithic zirconia crowns in accordance with the preparation design and aging simulation method. MATERIALS AND METHODS. An upper first molar was prepared sequentially with three different preparation designs: shoulderless preparation, 0.4 mm chamfer and 0.8 mm chamfer preparation. For each preparation design, 30 monolithic zirconia crowns were fabricated. After cementation on Cr-Co alloy dies, the following artificial aging procedures were performed: (1) thermal cycling and mechanical loading (TCML): 5000 cycles of thermal cycling $5^{\circ}C-55^{\circ}C$ and chewing simulation (1,200,000 cycles, 50 N); (2) Low Temperature Degradation simulation (LTD): autoclave treatment at $137^{\circ}C$, 2 bar for 3 hours and chewing simulation; and (3) no pre-treatment (control group). After artificial aging, the crowns were loaded until fracture. RESULTS. The mean values of fracture resistance varied between 3414 N (LTD; 0.8 mm chamfer preparation) and 5712 N (control group; shoulderless preparation). Two-way ANOVA analysis showed a significantly higher fracture loads for the shoulderless preparation, whereas no difference was found between the chamfer preparations. In contrast to TCML, after LTD simulation the fracture strength of monolithic zirconia crowns decreased significantly. CONCLUSION. The monolithic crowns tested in this study showed generally high fracture load values. Preparation design and LTD simulation had a significant influence on the fracture strength of monolithic zirconia crowns.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.1 s.94
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• pp.227-237
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• 1999

As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.