• Journal of the Korean Geotechnical Society
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• v.38 no.9
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• pp.45-52
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• 2022

Because discontinuity in the rock mass and contact of soil-structure interaction exhibits coupled thermal-hydromechanical (THM) behavior, it is necessary to develop an interface element based on the full governing equations. In this study, we derive force equilibrium, fluid continuity, and energy equilibrium equations for the interface element. Additionally, we present a stiffness matrix of the elastoplastic mechanical model for the interface element. The developed interface element uses six nodes for displacement and four nodes for water pressure and temperature in a two-dimensional analysis. The fully coupled THM analysis for fluid injection into a fault can model the complicated evolution of injection pressure due to decreasing effective stress in the fault and thermal contraction of the surrounding rock mass. However, the result of hydromechanical analysis ignoring thermal phenomena overestimates hydromechanical variables.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.5 s.248
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• pp.405-412
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• 2006

In order to realize a stably propagating flame in a narrow channel, flame instabilities resulting from flame-wall interaction should be avoided. In particular flame quenching is a significant issue in micro combustion devices; quenching is caused either by excessive heat loss or by active radical adsorptions at the wall. In this paper, the relative significance of thermal and chemical effects on flame quenching is examined by means of quenching distance measurement. Emphasis is placed on the effects of surface defect density on flame quenching. To investigate chemical quenching phenomenon, thermally grown silicon oxide plates with well-defined defect distribution were prepared. ion implantation technique was used to control defect density, i.e. the number of oxygen vacancies. It has been found that when the surface temperature is under $300^{\circ}C$, the quenching distance is decreased on account of reduced heat loss; as the surface temperature is increased over $300^{\circ}C$, however, quenching distance is increased despite reduced heat loss effect. Such abberant behavior is caused by heterogeneous surface reactions between active radicals and surface defects. The higher defect density, the larger quenching distance. This result means that chemical quenching is governed by radical adsorption that can be parameterized by oxygen vacancy density on the surface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of Power System Engineering
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• v.18 no.5
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• pp.156-163
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• 2014

Diesel engine is most suitable one for biodiesel fuel because the compression-ignition diesel engine has desirable fuel consumption due to higher thermal efficiency and in addition, the improvement of the fuel consumption also leads to a reduction of $CO_2$ emission and then it does not need to have spark-ignition system, which means that there is less charge on the technic and complexity. In this study, the spray behavior characteristics of the vegetable palm oil were analyzed by using a common-rail injection system of commercial diesel engine and the results were compared with those obtained for the diesel fuel. The injection pressures and blend ratios of palm oil and diesel(BD3, BD5, BD20, BD30, BD50, and BD100) were the main parameters. The experiments were conducted for different injection pressures: 500bar, 1000bar, 1500bar, and 1600bar by setting injection duration to $500{\mu}s$. Consequently, it was found that there is no significant difference in the macro characteristics of the spray behavior(spray penetration and spray angle) in response to change in the blend ratio of palm oil and diesel at a fixed injection pressure. In particular, all experiments showed the spray angle about $12^{\circ}{\sim}13^{\circ}$.

• Advances in aircraft and spacecraft science
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• v.4 no.4
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• pp.449-465
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• 2017

The aim of the present work is to present a computational study of the non-linear aero-elastic behavior of a multi-layered Thermal Protection System (TPS). The severity of atmospheric re-entry conditions is due to the combination of high temperatures, high pressures and high velocities, and thus the aero-elastic behavior of flexible structures can be difficult to assess. In order to validate the specific computational model and the overall strategy for structural and aerodynamics analyses of flexible structures, the simplified TPS sample tested in the 8' High Temperature Tunnel (HTT) at NASA LaRC has been selected as a baseline for the validation of the present work. The von $K{\acute{a}}rm{\acute{a}}n^{\prime}s$ three dimensional large deflection theory for the structure and a hybrid Raleigh-Ritz-Galerkin approach, combined with the first order Piston Theory to describe the aerodynamic flow, have been used to derive the equations of motion. The paper shows that a good description of the physical behavior of the fabric is possible with the proposed approach. The model is further applied to investigate structural and aero-elastic influence of the number of the layers and the stitching pattern.

• Nuclear Engineering and Technology
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• v.51 no.6
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• pp.1596-1609
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• 2019

The fuel rod performance has great importance for the safety and economy of an operating reactor. The fuel rod performance analysis code, which considers the thermal-mechanical response and irradiation effects of fuel rod, is usually developed in order to predict fuel rod performance accurately. The FRIPAC (${\underline{F}}uel$ ${\underline{R}}od$ ${\underline{I}}ntegral$ ${\underline{P}}erformance$ ${\underline{A}}nalysis$ ${\underline{C}}ode$) is such a fuel rod performance analysis code that has been developed recently by China Nuclear Power Technology Research Institute Co. Ltd. The code aims at the computational simulation of the Pressurized Water Reactor fuel rod behavior for both steady-state and power ramp condition. A brief overview of FRIPAC is presented including the computational framework and the main behavioral models. Validation of the code is also presented and it focuses on the fuel rod behavior including fuel center temperature, fission gas release, rod internal pressure/internal void volume, cladding outer diameter and cladding corrosion thickness. The validation is based on experimental data from several international projects. The validation results indicate that FRIPAC is an accurate and reliable fuel rod performance analysis code because of the satisfactory comparison results between the experimental measurements and the code predictions.

• Progress in Superconductivity and Cryogenics
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• v.19 no.2
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• pp.25-28
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• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• Tunnel and Underground Space
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• v.30 no.6
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• pp.573-590
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• 2020

This study presents the current status of DECOVALEX-2023 project Task G and our research results so far. Task G, named 'Safety ImplicAtions of Fluid Flow, Shear, Thermal and Reaction Processes within Crystalline Rock Fracture NETworks (SAFENET)' aims at developing a numerical method to simulate the fracture creation and propagation, and the coupled thermohydro-mechanical processes in fracture in crystalline rocks. The first research step of Task G is a benchmark simulation, which is designed for research teams to make their modelling codes more robust and verify whether the models can represent an analytical solution for displacements of a single rock fracture. We reproduced the mechanical behavior of rock and embedded single fracture using a three-dimensional grain-based distinct element model for the simulations. In this method, the structure of the rock was represented by an assembly of rigid tetrahedral grains moving independently of each other, and the mechanical interactions at the grains and their contacts were calculated using 3DEC. The simulation results revealed that the stresses induced along the embedded fracture in the model were relatively low compared to those calculated by stress analysis due to stress redistribution and constrained fracture displacements. The fracture normal and shear displacements of the numerical model showed good agreement with the analytical solutions. The numerical model will be enhanced by continuing collaboration and interaction with other research teams of DECOVALEX-2023 Task G and validated using various experiments in a further study.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.191-194
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• 2007

In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.