• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.8
• /
• pp.725-732
• /
• 2013

This study examined the convective heat transfer characteristics of nanofluids flowing over a heated fine wire. Convective heat transfer coefficients were measured for four different nano-engine-oil samples under three different temperature boundary conditions, i.e., both or either variation of wire and fluid temperature and constant film temperature. Experimental investigations that the increase in the convective heat transfer coefficients of nanofluids in the internal pipe flow often exceeded the increase in thermal conductivity were recently published; however, the current study did not confirm these results. Analyzing the behavior of the convective heat transfer coefficient under various temperature conditions was a useful tool to explain the relation between the thermal conductivity and the boundary layer thickness of nanofluids.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.28 no.4
• /
• pp.371-381
• /
• 2004

Numerical simulation of $CO_2$ addition effects to fuel and oxidizer streams on flame structure has been conducted with detailed chemistry in H$_2$-O$_2$ diffusion flames of a counterflow configuration. An artificial species, which displaces added $CO_2$ in the fuel- and oxidizer-sides and has the same thermochemical, transport, and radiation properties to that of added $CO_2$, is introduced to extract pure chemical effects in flame structure. Chemical effects due to thermal dissociation of added $CO_2$ causes the reduction flame temperature in addition to some thermal effects. The reason why flame temperature due to chemical effects is larger in cases of $CO_2$ addition to oxidizer stream is well explained though a defined characteristic strain rate. The produced CO is responsible for the reaction, $CO_2$＋H=CO＋OH and takes its origin from chemical effects due to thermal dissociation. It is also found that the behavior of produced CO mole fraction is closely related to added $CO_2$ mole fraction, maximum H mole fraction and its position, and maximum flame temperature and its position.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.8
• /
• pp.653-658
• /
• 2014

Roll-to-Roll printing process has become a great issue as a breakthrough for low cost and mass production of electronic devices such as organic thin film transistor, and etc. To print the electronic devices, multi-layer printing is essential, and high precision register control is required for this process. Unlike stop-and-repeat printing process, it is impossible to control the register in a static state since the roll-to-roll process is a continuous system. Therefore, the behavior of web such as polyethylene terephthalate (PET) and polyimide (PI) by the tensile and thermal stress generated in the roll-to-roll process as well as motor control of driven rolls has to be considered for a high precision register control. In this study, the correlation between curing temperature and thermal deformation of PET web is analyzed. Finally, it is verified experimentally that the temperature disturbance generates the more serious register error under the higher curing temperature.

• Journal of Ocean Engineering and Technology
• /
• v.31 no.6
• /
• pp.413-418
• /
• 2017

In the present study, silica-aerogel-polyurethane foams were synthesized to improve the mechanical characteristics and insulation performance of the polyurethane foam applied to a liquefied natural gas carrier at a cryogenic temperature of $-163^{\circ}C$. A silica-aerogel-polyurethane foam bulk was prepared using a homogenizer by varying the weight ratio of the silica aerogel (0, 1, 3, and 5 wt%), while maintaining the contents of the polyol, isocyanate, and blowing agent constant. Compression tests were performed at room and cryogenic temperatures to compare the mechanical properties of the silica-aerogel polyurethane foams. The internal temperature of the universal testing machine was maintained through the cryogenic chamber. The thermal conductivity of the silica-aerogel-polyurethane foam was measured using a heat flow meter to confirm the insulation performance. In addition, the effect of the silica aerogels on the cells of the polyurethane foam was investigated using FE-SEM and FTIR. From the experimental results, the 1 wt% silica aerogel polyurethane foam showed outstanding mechanical and thermal performances.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.2
• /
• pp.153-161
• /
• 2009

Three-dimensional finite-element methods(FEM) have been used to analyze the thermal stress of an exhaust gas recirculation(EGR) cooler due to thermal and pressure load. Since efficiency and capability of the heat exchanger are mainly dependent on net heat transferring area of the EGR cooler system, the tube inside the system has a numerous dimples on the surface. Thus for finite element analysis, firstly the dimple-typed tube is modeled as a plain element without the dimple, and then the equivalent thermal conductivities and elastic modulus are calculated. This work describes the numerical homogenization procedure of the dimple-typed tube and verifies the equivalent material properties by comparison of a single unit and the actual full model. Finally, the homogenization scheme presented in this study can be efficiently applied to finite element analyses for the thermal stress and deformation behavior of the EGR cooler system with the dimple-typed tube.

• International Journal of Precision Engineering and Manufacturing
• /
• v.4 no.2
• /
• pp.71-76
• /
• 2003

A virtual machine tool (VMT) is presented in this two-part paper. In Part 1, the analytical foundation for a virtual machining system is developed, which is envisioned as the foundation for a comprehensive simulation environment capable of predicting the outcome of cutting processes. The VHT system undergoes "pseudo-real machining", before actual cutting with a CNC machine tool takes place, to provide the proper cutting conditions for process planners and to compensate or control the machining process in terms of the productivity and attributes of the products. The attributes can be characterized by the machined surface error, dimensional accuracy, roughness, integrity, and so forth. The main components of the VMT are the cutting process, application, thermal behavior, and feed drive modules. In Part 1, the cutting process module is presented. When verified experimentally, the proposed models gave significantly better prediction results than any other methods. In Part 2 of this paper, the thermal behavior and feed drive modules are developed, and the models are integrated into a comprehensive software environment.vironment.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.33-38
• /
• 2013

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of $22.5{\times}22.5$ mm, $37.5{\times}37.5$ mm and $42.5{\times}42.5$ mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

• Advances in materials Research
• /
• v.1 no.1
• /
• pp.93-107
• /
• 2012

Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.4
• /
• pp.61-68
• /
• 2002

Thermal shock testing was used to evaluate reliability that appeared in the solder joints of electronic devices when they were subjected to thermal cycling. Recently, mobile devices have come smaller and multi-functional, with the increasing need for high-density packaging, BGA or CSP has become the main trend for surface mounting technology, and therefore mechanical stress life for solder joints in BGA/CSP type packages has required. Reliability of BGA/CSP solder joints was evaluated with electric resistivity change of daisy chain pattern and stress-strain curve measured using strain gage attached on the surface of PCB under mechanical impact loading. In this report, applications of PCB Universal Testing Machine we have developed and experimental datum of SONY estimating dynamic behavior of mechanical stress in BGA/CSP solder joints are introduced.

• Advances in concrete construction
• /
• v.15 no.2
• /
• pp.115-126
• /
• 2023

This paper investigates creep analysis of a plate made of Al-SiC functionally graded material using Mendelson's method of successive elastic solution. All mechanical and thermal material properties, except Poisson's ratio, are assumed to be variable along the thickness direction based on the volume fraction of reinforcement and thickness. First, the basic relations of the plate are derived using the Love-Kirchhoff plate theory. The solution of governing equations yields an elastic solution to start creep analysis. The creep behavior is demonstrated through Norton's equation based on Pandey's experimental results extracted for Al-SiC functionally graded material. A linear variation is assumed for temperature distribution along the thickness direction. The creep strain, as well as the thermal strain, are included in the governing equations derived from classical plate theory for mechanical strain. A successive elastic solution based on Mendelson's method is employed to derive the history of stresses, strains, and displacements over a long time. History of stresses and deformations are obtained over a long time to predict damage to the plate because of various loadings, and material composition along the thickness and planar directions.