• 한국수자원학회논문집
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• 제46권1호
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• pp.1-12
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• 2013

본 연구에서는 기후변화에 따른 수온상승이 낙동강 유역 어류 서식지에 미치는 영향을 분석하였다. 이를 위해 낙동강유역에 서식하는 어종 중 22개 어종에 대한 최대내성한계온도를 산출하였으며, 이를 토대로 수온 상승에 따른 어류 서식지 및 서식지 지점별 어종 영향 정도를 분석하였다. 산정된 최대내성한계온도의 범위는 $27.7\sim33.1^{\circ}C$의 범위를 나타났다. 또한 기존에 예측된 기온 상승 데이터를 이용하여, 낙동강 78개 지점에서의 2100년도까지의 수온 상승을 예측하였으며, 수온 상승 예측을 위하여 낙동강 유역 78개 각 지점에서의 기온-수온의 회귀식을 산정하였다. 그 결과 S1 기간(2011~2040년)에 평균 $0.69^{\circ}C$, S2기간(2041~2070년)에는 평균 $1.76^{\circ}C$, S3기간(2071~2100년)에는 평균 $2.32^{\circ}C$의 수온이 상승되는 것으로 나타났다. 이상의 수온상승에 따라 낙동강 22개 어종에 대해 S1-S3 각 기간별로 평균 21.9%, 36.3%, 51.4%의 서식처가 영향을 받는 것으로 나타났다.

• 한국물환경학회지
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• 제27권3호
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• pp.314-321
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• 2011

The potential effects of increased water temperature on fish assemblages and their habitats were studied in the streams of the Han River watershed when the water temperature was supposed to increase by $1^{\circ}C$, $2^{\circ}C$, and $3^{\circ}C$ in each sampling site. The percent changes in suitable habitats for each species and in species number within a site were determined, based on the estimated maximum thermal tolerances of 51 fish species whose habitats were classified into four reaches: upstream, up-/midstream, midstream, and mid-/downstream. The maximum thermal tolerance ranged between $25.0^{\circ}C$ and $31.0^{\circ}C$ and significantly increased as the habitat reaches move from upstream to mid-/downstream. With the increases in water temperature, the average suitable habitats for all 51 species were decreased by 31% ($+1^{\circ}C$), 46% ($+2^{\circ}C$), and 60% ($+3^{\circ}C$). The increased water temperature, however, did not induce significant differences in the changes in suitable habitats among four reaches within each level of temperature increase. The relative frequencies of the sampling sites classified into six levels according to the percent change in the number of species in each site were significantly different among three levels of water temperature increase, with relatively greater changes in the sites where 0~20% and 61~100% of species were affected.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.