• Title/Summary/Keyword: maximum thermal tolerances

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Effect of Climate Change on Fish Habitat in the Nakdong River Watershed (기후변화에 따른 낙동강 수계 어류 서식처 영향 분석)

  • Kang, Hyeongsik;Park, Min-Young;Jang, Jae-Ho
    • Journal of Korea Water Resources Association
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    • v.46 no.1
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    • pp.1-12
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    • 2013
  • In this study, the potential effects of increased water temperature on fish habitat were analysed in the streams of Nakdong River watershed. The changes in suitable habitats for each fish species and in species number at a habitat site were predicted, based on the maximum thermal tolerances of 22 fish species. The estimated maximum thermal tolerance ranged between $27.7^{\circ}C$ and $33.1^{\circ}C$. Then, the increase of water temperature in 78-sites of Nakdong River watershed by 2100 was predicted by using the estimated air temperature data by 2100 in the literature and the regression analysis between air-temperature and water-temperature at each sites. The water temperature was estimated to have increased by $0.69^{\circ}C$, $1.76^{\circ}C$, and $2.32^{\circ}C$ in 2011~2040 (period S1), 2041~2070 (S2), and 2071~2100 (S3), respectively. With such increases in water temperature, the averaged suitable habitats for all 22 fish species would be influenced by 21.9%, 36.3%, and 51.4% in periods S1, S2, and S3, respectively.

Potential Effect of Increased Water Temperature on Fish Habitats in Han River Watershed (수온 증가가 한강 수계의 어류 서식지에 미치는 영향)

  • Chung, Namil;Park, Baekyung;Kim, Kyunghyun
    • Journal of Korean Society on Water Environment
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    • v.27 no.3
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    • pp.314-321
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    • 2011
  • The potential effects of increased water temperature on fish assemblages and their habitats were studied in the streams of the Han River watershed when the water temperature was supposed to increase by $1^{\circ}C$, $2^{\circ}C$, and $3^{\circ}C$ in each sampling site. The percent changes in suitable habitats for each species and in species number within a site were determined, based on the estimated maximum thermal tolerances of 51 fish species whose habitats were classified into four reaches: upstream, up-/midstream, midstream, and mid-/downstream. The maximum thermal tolerance ranged between $25.0^{\circ}C$ and $31.0^{\circ}C$ and significantly increased as the habitat reaches move from upstream to mid-/downstream. With the increases in water temperature, the average suitable habitats for all 51 species were decreased by 31% ($+1^{\circ}C$), 46% ($+2^{\circ}C$), and 60% ($+3^{\circ}C$). The increased water temperature, however, did not induce significant differences in the changes in suitable habitats among four reaches within each level of temperature increase. The relative frequencies of the sampling sites classified into six levels according to the percent change in the number of species in each site were significantly different among three levels of water temperature increase, with relatively greater changes in the sites where 0~20% and 61~100% of species were affected.

Aging Characteristics of Solder bump Joint for High Reliability Optical module (광모듈 솔더 접합부의 시효 특성에 관한 연구)

  • Kim, Nam-Kyu;Kim, Kyung-Seob;Kim, Nam-Hoon;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.204-207
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    • 2003
  • The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

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