• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.6
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• pp.51-58
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• 2002

In this paper, a 155/311 Mb/s MUX/DEMUX chip using ECL macrocell away has been developed with a single device. This device for a 2.5 Gb/s SDH based transmission system is to interleave the parallel data of 51 Mb/s into 155 Mb/s(or 311 Mb/s) serial data output, and is to interleave a serial input bit stream of 155 Mb/s(or 311 Mb/s) into the parallel output of 51 Mb/s. The input and output of the device ate TTL compatible at the low-speed end, but 100k ECL compatible at the high-speed end. The device has been fabricated with Motorola ETL3200 macrocell away The fabricated chip shows the typical phase margin of 180 degrees and output data skew less than 220ps at the high-speed end.