• Proceedings of the Korea Information Processing Society Conference
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• 2012.11a
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• pp.1531-1534
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• 2012

모델기반 아키텍처 MDA (Model Driven Architecture)는 소프트웨어 개발의 추상화 수준을 높이기 위한 최근의 개발 아키텍처이며 완벽한 이해성을 확보하기 위해서 구체적인 구현기술은 반드시 개발자에게 추상적으로 (encapsulation) 숨겨져야 한다. 즉, 개발자는 자동적으로 실행 가능한 시스템으로 변환하는 플랫폼에 구애 받지 않는 모델들 PIM(Platform Independent Model)만을 고려하게된다. 본 논문에서는 MDA 를 캠퍼스 안내 앱에 적용하여 개발함으로써 모바일 디바이스 및 OS 에 독립된 어플리케이션을 개발 방법론을 제시한다.

• Proceedings of the Korea Information Processing Society Conference
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• 2007.05a
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• pp.279-282
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• 2007

본 논문에서는 Model Driven Architecture를 다양한 모바일 플랫폼에서 적용하는 방안에 대해 설명한다. 모바일 플랫폼은 Symbian OS, Microsoft Windows CE 등 다양한 종류가 있으며, 이들의 어플리케이션을 재사용하기 위해서는 각 플랫폼에 맞는 언어로 다시 개발해야 한다. MDA는 이러한 이기종의 플랫폼에 적용할 수 있는 가장 효율적인 아키텍처이다. PIM 모델을 작성하고 변환규칙을 적용한 자동화도구로써 PSM 모델과 소스코드까지 자동으로 생성이 가능하기 때문에 높은 개발 생산성과 이식성, 상호운용성을 제공할 수 있다.

• Journal of Powder Materials
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• v.21 no.6
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• pp.407-414
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• 2014

The powder injection molding process having advantages in manufacturing three-dimensional precision parts essentially requires a debinding process before sintering to remove the binders used for preparing feedstock. In this study, powder injection molding of translucent alumina was performed, and carbon dioxide ($CO_2$) is used as a supercritical fluid that makes it possible to remove a large amount of binder, which is paraffin wax. The relationship between the optical property of translucent alumina and the debinding condition (temperature and pressure) of supercritical $CO_2$ was investigated. As temperature and pressure increased, extraction rate of the binder showed rising tendency and average grain size after sintering process was relatively fine. On the other hand, optical transmittance was reduced. As a result, the debinding condition at $50^{\circ}C$ and 20 MPa that represents the lowest extraction rate, $8.19{\times}10^{-3}m^2/sec$, corresponds to the largest grain size of $14.7{\mu}m$ and the highest optical transmittance of 45.2%.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.182-182
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• 2012

Plasma etching is used in various semiconductor processing steps. In plasma etcher, optical- emission spectroscopy (OES) is widely used for in-situ endpoint detection. However, the sensitivity of OES is decreased if polymer is deposited on viewport or the proportion of exposed area on the wafer is too small. Because of these problems, the object is to investigate the suitability of using plasma impedance monitoring (PIM) and self plasma optical emission spectrocopy (SPOES) with statistical approach for in-situ endpoint detection. The endpoint was determined by impedance signal variation from I-V monitor (VI probe) and optical emission signal from SPOES. However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ and SiNx layers are etched by fluorocarbon on inductive coupled plasma (ICP) etcher, if the proportion of $SiO_2$ and SiNx area on Si wafer are small. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance monitoring is compared with optical emission spectroscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.32-32
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• 2011

Plasma etching is used in microelectronic processing for patterning of micro- and nano-scale devices. Commonly, optical emission spectroscopy (OES) is widely used for real-time endpoint detection for plasma etching. However, if the viewport for optical-emission monitoring becomes blurred by polymer film due to prolonged use of the etching system, optical-emission monitoring becomes impossible. In addition, when the exposed area ratio on the wafer is small, changes in the optical emission are so slight that it is almost impossible to detect the endpoint of etching. For this reason, as a simple method of detecting variations in plasma without contamination of the reaction chamber at low cost, a method of measuring plasma impedance is being examined. The object in this research is to investigate the suitability of using plasma impedance monitoring (PIM) with statistical approach for real-time endpoint detection of $SiO_2$ etching. The endpoint was determined by impedance signal variation from I-V monitor (VI probe). However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ film on Si wafer is etched by fluorocarbon plasma on inductive coupled plasma (ICP) etcher. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance analysis is compared with optical emission spectroscopy (OES). From impedance data, we tried to analyze physical properties of plasma, and real-time endpoint detection can be achieved.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.589-590
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• 2006

Based on the comparison of structures and properties of the HS6-5-2 high speed steels made with the powder injection moulding method, pressureless forming, compacting and sintering, and commercial steels made with the ASEA-STORA method, fine carbides spread evenly in the steel matrix were found in the structure of all tested high-speed steels in the sintered state. The steels made with the pressureless forming method are characteristic of the lowest sintering temperature and the highest density, resulting from the high carbon concentration coming from the binding agent degradation.

• Proceedings of the Korea Information Processing Society Conference
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• 2020.11a
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• pp.8-11
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• 2020

4 차 산업혁명 시대의 도래와 함께 AI, ICT 기술의 융합이 진행됨에 따라, 유저 레벨의 디바이스에서도 AI 서비스의 요청이 실현되었다. 이미지 처리와 관련된 AI 서비스는 피사체 판별, 불량품 검사, 자율주행 등에 이용되고 있으며, 특히 Deep Convolutional Neural Network (DCNN)은 이미지의 특색을 파악하는 데 뛰어난 성능을 보여준다. 하지만, 이미지의 크기가 커지고, 신경망이 깊어짐에 따라 연산 처리에 있어 낮은 데이터 지역성과 빈번한 메모리 참조를 야기했다. 이에 따라, 기존의 계층적 시스템 구조는 DCNN 을 scalable 하고 빠르게 처리하는 데 한계를 보인다. 본 연구에서는 DCNN 의 scalable 하고 빠른 처리를 위해 3 차원 메모리 구조의 Processing-In-Memory (PIM) 가속기를 제안한다. 이를 위해 기존 3 차원 메모리인 Hybrid Memory Cube (HMC)에 하드웨어 및 소프트웨어 모듈을 추가로 구성하였다. 구체적으로, Processing Element (PE)간 데이터를 공유할 수 있는 공유 캐시 및 소프트웨어 스택, 파이프라인화된 곱셈기 및 듀얼 프리페치 버퍼를 구성하였다. 이를 유명 DCNN 알고리즘 LeNet, AlexNet, ZFNet, VGGNet, GoogleNet, RestNet 에 대해 성능 평가를 진행한 결과 기존 HMC 대비 40.3%의 속도 향상을 29.4%의 대역폭 향상을 보였다.

• Proceedings of the Korea Information Processing Society Conference
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• 2008.05a
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• pp.913-916
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• 2008

TPS(Triple Play Service)를 통한 IP-TV,인터넷, 전화 등이 통합되는 추세에서, IPv6 상용네트워크가 수 년 안에 구축될 필연성을 공감하고 있다. 그러나 [1] 현재 IP-TV 서비스에서 Delay, Jitter,전송장애등 QoS에 대한 사용자 불만이 계속 발생하고 있다. 또한 현재 서비스중지 (DoS : Denial of Service)를 유발하는 [2] 인터넷 침해 사고가 월 평균 2157건 이상 발생하는 등, Security Issue의 증가 문제가 지속 되고 있다. IPv4/IPv6 듀얼 스택 멀티 캐스트 네트워크를 구현하여, 라우팅, 멀티캐스트(PIM-SM), QoS, Security 이슈에 대한, 최적의 방안을 도출하여, 라우팅 구현시 IPv6 라우팅 프로토클 간에 재분배(Redistribution) 장애 해결책, IPv6 특성에 따른 멀티캐스트 그룹주소 지정시의 장애대책을 제시하였고, QoS 에서는 기존의 QoS 정책의 문제점과 IPv6의 고유한 패킷 구조의 장점을 활용한 Adaptive QoS 방법을 제시하고, IPv6 멀티캐스트 서비스 중지 공격 유형을 정의하여, 최적화된 IPv6 멀티캐스트 구성 모델을 제시 하였다. 결론적으로 구현된 시스템에서 IPv6 패킷 분석을 통해서 최적화된 경로 통신 및 차별화된 IPv6 패킷의 QoS 방안을 제시하였으며, 서비스 중지공격을 대응하는 Security 보장성을 갖고 있음을 검증하여, 향후 상용화된 IPv4/IPv6 네트워크 구현을 위한 최적화 방안을 제시 하였다.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.7-7
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• 2001

The increasing interest in light weight materials coupled to the need for cost -effective processing have combined to create a significant opportunity for aluminum P/M. particularly in the automotive industry in order to reduce fuel emissions and improve fuel economy at affordable prices. Additional potential markets for Al PIM parts include hand tools. Where moving parts against gravity represents a challenge; and office machinery, where reciprocating forces are important. Aluminum PIM adds light weight, high compressibility. low sintering temperatures. easy machinability and good corrosion resistance to all advantages of conventional iron bm;ed P/rv1. Current commercial alloys are pre-mixed of either the AI-Si-Mg or AL-Cu-Mg-Si type and contain 1.5% ethylene bis-stearamide as an internal lubricant. The powder is compacted in closed dies at pressure of 200-500Mpa and sintered in nitrogen at temperatures between $580~630^{\circ}C$ in continuous muffle furnace. For some applications no further processing is required. although most applications require one or more secondary operations such as sizing and finishing. These sccondary operations improve the dimension. properties or appearance of the finished part. Aluminum is often considered difficult to sinter because of the presence of a stable surface oxide film. Removal of the oxide in iron and copper based is usually achieved through the use of reducing atmospheres. such as hydrogen or dissociated ammonia. In aluminum. this occurs in the solid st,lte through the partial reduction of the aluminum by magncsium to form spinel. This exposcs the underlying metal and facilitates sintering. It has recently been shown that < 0.2% Mg is all that is required. It is noteworthy that most aluminum pre-mixes contain at least 0.5% Mg. The sintering of aluminum alloys can be further enhanced by selective microalloying. Just 100ppm pf tin chnnges the liquid phase sintering kinetics of the 2xxx alloys to produce a tensile strength of 375Mpa. an increilse of nearly 20% over the unmodified alloy. The ductility is unnffected. A similar but different effect occurs by the addition of 100 ppm of Pb to 7xxx alloys. The lend changes the wetting characteristics of the sintering liquid which serves to increase the tensile strength to 440 Mpa. a 40% increase over unmodified aIloys. Current research is predominantly aimed at the development of metal matrix composites. which have a high specific modulus. good wear resistance and a tailorable coefficient of thermal expnnsion. By controlling particle clustering and by engineering the ceramic/matrix interface in order to enhance sintering. very attractive properties can be achicved in the ns-sintered state. I\t an ils-sintered density ilpproaching 99%. these new experimental alloys hnve a modulus of 130 Gpa and an ultimate tensile strength of 212 Mpa in the T4 temper. In contest. unreinforcecl aluminum has a modulus of just 70 Gpa.

• Journal of Powder Materials
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• v.17 no.4
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• pp.312-318
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• 2010

High speed steels (HSS) were used as cutting tools and wear parts, because of high strength, wear resistance, and hardness together with an appreciable toughness and fatigue resistance. Conventional manufacturing process for production of components with HSS was used by casting. The powder metallurgy techniques were currently developed due to second phase segregation of conventional process. The powder injection molding method (PIM) was received attention owing to shape without additional processes. The experimental specimens were manufactured with T42 HSS powders (59 vol%) and polymer (41 vol%). The metal powders were prealloyed water-atomised T42 HSS. The green parts were solvent debinded in normal n-Hexane at $60^{\circ}C$ for 24 hours and thermal debinded at $N_2-H_2$ mixed gas atmosphere for 14 hours. Specimens were sintered in $N_2$, $H_2$ gas atmosphere and vacuum condition between 1200 and $1320^{\circ}C$. In result, polymer degradation temperatures about optimum conditions were found at $250^{\circ}C$ and $480^{\circ}C$. After sintering at $N_2$ gas atmosphere, maximum hardness of 310Hv was observed at $1280^{\circ}C$. Fine and well dispersed carbide were observed at this condition. But relative density was under 90%. When sintering at $H_2$ gas atmosphere, relative density was observed to 94.5% at $1200^{\circ}C$. However, the low hardness was obtained due to decarbonization by hydrogen. In case of sintering at the vacuum of $10^{-5}$ torr at temperature of $1240^{\circ}C$, full density and 550Hv hardness were obtained without precipitation of MC and $M_6C$ in grain boundary.