• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.459-459
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• 2012

Recently, the discharge of global warming gases in dry etching process of TFT-LCD display industry is a serious issue because perfluorocarbon compound (PFC) gas causes global warming effects. PFCs including CF4, C2F6, C3F8, CHF3, NF3 and SF6 are widely used as etching and cleaning gases. In particular, the SF6 gas is chemically stable compounds. However, these gases have large global warming potential (GWP100 = 24,900) and lifetime (3,200). In this work, we chose C3F6O gas which has a very low GWP (GWP100 = <100) and lifetime (< 1) as a replacement gas. This study investigated the effects of the gas flow ratio of C3F6O/O2 and process pressure in dual-frequency capacitively coupled plasma (CCP) etcher on global warming effects. Also, we compared global warming effects of C3F6O gas with those of SF6 gas during dry etching of a patterned positive type photo-resist/silicon nitride/glass substrate. The etch rate measurements and emission of by-products were analyzed by scanning electron Microscopy (SEM; HITACI, S-3500H) and Fourier transform infrared spectroscopy (FT-IR; MIDAC, I2000), respectively. Calculation of MMTCE (million metric ton carbon equivalents) based on the emitted by-products were performed during etching by controlling various process parameters. The evaluation procedure and results will be discussed in detail.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.659-659
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• 2013

Recently, graphene has been intensively studied due to the fascinating physical, chemical and electrical properties. It shows high carrier mobility, high current density, and high thermal conductivity compare with conventional semiconductor materials even it has single atomic thickness. Especially, since graphene has fantastic electrical properties many researchers are believed that graphene will be replacing Si based technology. In order to realize it, we need to prepare the large and uniform graphene. Chemical vapor deposition (CVD) method is the most promising technique for synthesizing large and uniform graphene. Unfortunately, CVD method requires transfer process from metal catalyst. In transfer process, supporting polymer film (Such as poly (methyl methacrylate)) is widely used for protecting graphene. After transfer process, polymer layer is removed by organic solvents. However, it is impossible to remove it completely. These organic residues on graphene surface induce quality degradation of graphene since it disturbs movement of electrons. Thus, in order to get an intrinsic property of graphene completely remove of the organic residues is the most important. Here, we introduce modified wet graphene transfer method without PMMA. First of all, we grow the graphene from Cu foil using CVD method. And then, we deposited several metal films on graphene for transfer layer instead of PMMA. Finally, we fabricate graphene FET devices. Our approaches show low defect density and non-organic residues in comparison with PMMA coated graphene through Raman spectroscopy, SEM and AFM. In addition, clean graphene FET shows intrinsic electrical characteristic and high carrier mobility.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.636-636
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• 2013

Since first discovery of strong Raman spectrum of molecules adsorbed on rough noble metal, surface enhanced Raman scattering (SERS) has been widely used for detection of molecules with low concentration. Surface plasmons at noble metal can enhance Raman spectrum and using Au nanostructures as substrates of SERS has advantages due to it has chemical stability and biocompatibility. However, the photoluminescence (PL) background from Au remains a problem because of obtaining molecular vibration information. Recently, graphene, two-dimensional atomic layer of carbon atoms, is also well known as PL quenchers for electronic and vibrational excitation. In this study, we observed SERS of single layer graphene on or under monolayer of Au nanoparticles (NPs). Single layer graphene is grown by chemical vapor deposition and transferred onto or under the monolayer of Au NPs by using PMMA transfer method. Monolayer of Au NPs prepared using Langmuir-Blodgett method on or under graphene surface provides closed and well-packed monolayer of Au NPs. Scanning electron microscopy (SEM) and Raman spectroscopy (WItec, 532 nm) were performed in order to confirm effects of Au NPs on enhanced Raman spectrum. Highly enhanced Raman signal of graphene by Au NPs were observed due to many hot-spots at gap of closed well-packed Au NPs. The results showed that single layer graphene provides larger SERS effects compared to multilayer graphene and the enhancement of the G band was larger than that of 2D band. Moreover, we confirm the appearance of D band in this study that is not clear in normal Raman spectrum. In our study, D band appearance is ascribed to the SERS effect resulted from defects induced graphene on Au NPs. Monolayer film of Au NPs under the graphene provided more highly enhanced graphene Raman signal compared to that on the graphene. The Au NPs-graphene SERS substrate can be possibly applied to biochemical sensing applications requiring highly sensitive and selective assays.

• 한국재료학회지
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• 제26권3호
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• pp.130-135
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• 2016

To alloy high melting point elements such as boron, ruthenium, and iridium with copper, heat treatment was performed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ at the temperature of $1200^{\circ}C$ in vacuum for 30 minutes. The microstructure analysis of the alloyed sample was confirmed using an optical microscope and FE-SEM. Hardness and trace element analyses were performed using Vickers hardness and WD-XRF, respectively. Diffusion profile analysis was performed using D-SIMS. From the microstructure analysis results, crystal grains were found to have formed with sizes of 2.97 mm. For the copper alloys formed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ the sizes of the crystal grains were 1.24, 1.77, and 2.23 mm, respectively, while these sizes were smaller than pure copper. From the Vickers hardness results, the hardness of the Ir-copper alloy was found to have increased by a maximum of 2.2 times compared to pure copper. From the trace element analysis, the copper alloy was fabricated with the expected composition. From the diffusion profile analysis results, it can be seen that 0.059 wt%, 0.030 wt%, and 0.114 wt% of B, Ru, and Ir, respectively, were alloyed in the copper, and it led to change the hardness. Therefore, we verified that alloying of high melting point elements is possible at the low temperature of $1200^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제23권7호
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.74-74
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• 2000

낮은 유전상수(k$\leq$3)와 높은 열적안정성(>4$25^{\circ}C$)은 초고집적회로(ULSI)기술에서 RC 지연을 해결하기 위한 금속배선의 중간 절연층으로서의 2개의 가장 중요한 특성이다. 본 연구에서는 cyclohezane을 precursor로 사용하여 plasma enhanced chemical vapor deposition(PECVD)방법으로 유기박막을 성장시켰으며 낮은 유전상수와 높은 열적안정성을 동시에 확보하기 위하여 열적안정성은 좋지 않지만 유전상수가 낮은 박막(soft layer)위에 유전상수는 다소 높지만 열적안정성이 좋은 박막(hard layer)을 얇게 증착하여 hard layer/soft layer의 2층 구조를 형성하여서 구조적, 전기적 특성을 조사하였다. 유기박막은 5$0^{\circ}C$로 유지된 reactor 내부에서 argon(Ar) plasma에 의해 증착되었으며 platinum(Pt)기판과 silicon 기판위에 동시에 증착하였다. Pt 기판위에 증착한 시편으로 유전상수, I-V 등 전기적 특성을 측정하였고, silicon 기판위에 증착한 시편으로 열적안정성과 구조적 특성등을 분석하였다. 증착압력 0.2Torr에서 plasma power를 5W에서90W로 증가할 때 유전상수는 2.36에서 3.39로 증가하였으며 열적안정성은 90W에서 180W로 증가하였을 때 유전상수는 2.42에서 2.79로 증가하엿고 열적안정성은 모두30$0^{\circ}C$이하였다. 단일층 구조에서는 유전상수가 낮은 박막은 열적으로 불안정하고 열적 안정성이 좋은 박막은 유전상수가 다소 높은 문제가 나타났다. 이런 문제를 해결하기 위하여 2 Torr, 120W에서 증착한 유전상수가 2.55이고 열적으로 불안정한 박막을 soft layer로 5150 증착하고 그 위에 0.2Torr, 90W에서 증착한 유전상수가 3.39이고 열적으로 45$0^{\circ}C$까지 안정한 박막을 hard layer로 360 , 720 , 1440 증착하였다. 증착된 2층구조 박막의 유전상수는 각각 2.62, 2.68, 2.79이었으며 열적안정성 측정에서는 40$0^{\circ}C$까지 두께 감소가 보이지 않았다. 그러나 SEM 측정에서 열처리 후 표면이 거칠어지는 현상이 발견되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.80-80
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• 2000

Surface acoustic wave (SAW) devices have become more important as mobile telecommunication systems need h호-frrequency, low-loss, and down-sized components. Higher-frequency SAW divices can be more sasily realized by developing new h호-SAW-velocity materials. The ZnO/diamond/Si multilasyer structure is one of the most promising material components for GHz-band SAW filters because of its SAW velocity above 10,000 m/sec. Silicon carbide is also a potential candidate material for high frequency, high power and radiation resistive electronic devices due to its superior mechanical, thermal and electronic properties. However, high price of commercialized 6- or 4H-SiC single crystalline wafer is an obstacle to apply SiC to high frequency SAW devices. In this study, single crystalline 3C-SiC thin films were grown on Si (100) by MOCVD using bis-trimethylsilymethane (BTMSM, C7H20Si7) organosilicon precursor. The 3C-SiC film properties were investigated using SEM, TEM, and high resolution XRD. The FWHM of 3C-SiC (200) peak was obtained 0.37 degree. To investigate the SAW propagation characteristics of the 3C-SiC films, SAW filters were fabricated using interdigital transducer electrodes on the top of ZnO/3C-SiC/Si(100), which were used to excite surface acoustic waves. SAW velocities were calculated from the frequency-response measurements of SAW filters. A generalized SAW mode. The hard 3C-SiC thin films stiffened Si substrate so that the velocities of fundamental and the 1st mode increased up to 5,100 m/s and 9,140 m/s, respectively.

• 한국진공학회지
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• 제9권3호
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• pp.233-236
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• 2000

TFT-LCD(thin film transistor-liquid crystal display) 패널의 데이터 배선 재료로 사용하기 위하여 AlW(3 wt%)의 Al합금 박막을 dc 마그네트론 스퍼터링 방법으로 유리 기판에 증착하여 열처리전과 열처리 후의 박막 특성을 조사하였다. 또한 TFT-LCD의 식각 공정상에서 발생할 수 있는 chemical attack에 대한 저항성을 확인하기 위하여 순환전압전류법(cyclic voltammetry)을 사용하여 Ag/AgCl 전극에 대한 ITO와 AlW alloy의 전극 전위를 측정하였다. 증착된 박막을 $350^{\circ}C$에서 20분간 열처리하였을 때 AlW 박막은 비저항이 감소하였고 약 $11\;{\mu\Omega}cm$의 다소 높은 비저항 특성을 보였다. 주사전자현미경(SEM)과 원자힘현미경(AFM)으로 표면을 분석한 결과 좋은 힐록방지 특성을 보임을 알 수 있었다. 순환전압전류법을 사용하여 측정한 Ag/AgCl 에 대한 ITO의 전극 전위은 약 -1.8V이었고, AlW alloy의 전위 전극은 W의 wt.%가 3% 이상이었을 때, ITO의 전극 전위보다 작게 나타났다. 따라서 측정된 특성 값을 볼 때 AlW(over 3 wt.%) 박막은 data bus line으로 사용할 수 있는 것으로 나타났다.

• 한국진공학회지
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• 제9권3호
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• pp.237-241
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• 2000

TFT-LCD(thin film transistor-liquid crystal display) 패널의 데이터 배선 재료로 사용하기 위하여 AlNd(2 wt%)의 Al합금 박막을 dc 마그네트론 스퍼터링 방법으로 유리 기판에 증착하여 열처리전과 열처리후의 구조적, 전기적, 식각 박막 특성을 조사하였다. 또한 증착한 박막을 식각하여 그 특성을 조사하였고, ITO를 증착하여 AlNd과의 접촉 저항을 Kelvin resistor를 사용하여 측정하였다. 증착된 박막을 $350^{\circ}C$에서 20분간 열처리 하였을때 AlW박막은 비저항이 감소하였고 약 $4\;{\mu\Omega}cm$의 아주 좋은 비저항 특성을 보였다. 주사전자 현미경(SEM)과 원자힘현미경(AFM)으로 표면을 분석한 결과 좋은 힐록방지 특성을 보임을 알 수 있었다. AlNd의 식각 특성은 아주 좋게 나타났고, ITO와 AlNd의 최저 접촉저항값은 약 $110\;{\mu\Omega}cm$이었다. 측정된 특성들을 바탕으로 AlNd(2 wt.%) 박막의 적용 가능성을 해상도와 화면 크기 측면에서 살펴보았을 때, 25인치 SXGA급 패널에 적용 가능함을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.101-101
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• 2010

ZnO shows a direct band gap of 3.37eV, large exciton binding energy (~60 meV), high oxidation ability, high sensitivity to many gases, and low cost, and it has been used in various applications such as transparent electrodes, light emitting diodes (LEDs), gas sensors and photocatalysts. Among these applications ZnO as photocatalyst has considerably attracted attention over the past few years because of its high activities in removing organic contaminants generated from industrial activities. In this research, ZnO nanoparticles were synthesized by spray-pyrolysis method using the zinc acetate dihydrate as starting material at synthesis temperature of $900^{\circ}C$ with concentration varied from 0.01 to 1.0M. The physical and chemical properties of the synthesized ZnO nanoparticles were examined by X-ray Diffraction (XRD), Scanning Electron Microscopy (SEM), Fourier Transformation Infrared (FT-IR), and UV-vis spectroscopy. The Miller indices of XRD patterns indicate that the synthesized ZnO nanoparticles showed a hexagonal wurtzite structure. With increased precursor concentration, a primary, secondary particle sizes of ZnO nanoparticles increased by 0.8 to $1.5{\mu}m$ and 15 to 35nm, and their crystallinity was improved. Methyleneblue (MB) solution ($1{\mu}M$) as a test comtaminant was prepared for evaluating the photocatalytic activities of ZnO nanoparticles synthesized in different precursor concentration. The results show that the photocatalytic efficiency of ZnO nanoparticles was gradually enhanced by increased precursor concentration.