• 한국전기전자재료학회논문지
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• 제35권3호
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• pp.215-222
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• 2022

Artificial neuromorphic devices are considered the key component in realizing energy-efficient and brain-inspired computing systems. For the artificial neuromorphic devices, various material candidates and device architectures have been reported, including two-dimensional materials, metal-oxide semiconductors, organic semiconductors, and halide perovskite materials. In addition to conventional electrical neuromorphic devices, optoelectronic neuromorphic devices, which operate under a light stimulus, have received significant interest due to their potential advantages such as low power consumption, parallel processing, and high bandwidth. This article reviews the recent progress in optoelectronic neuromorphic devices using various active materials such as two-dimensional materials, metal-oxide semiconductors, organic semiconductors, and halide perovskites

• 한국레이저가공학회지
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• 제16권4호
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2160-2163
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• 2005

Solid freeform fabrication (SFF) technology plays a major role in industry and represents a reasonable percentage of industrial rapid prototyping/tooling/manufacturing (RP/RT/RM) development applications. However, SFF technology still has long way to progress to achieve satisfactory process speed, surface finish and overall quality improvement of its application. Today, three dimensional printing (3DP) technique that is one of SFF technology is receiving many interests, and is applied by various fields. It can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. However, need long curing time after manufacture completion. And it must do post-processing process necessarily to heighten strength of objects because strength of fabricated objects is very weak. Therefore, in this study, we proposed an improved 3DP process that can solve problems of conventional 3DP process. The general 3DP process is method to spout binder simply through printer head on powder, but proposed process is method to cure jetted UV resin by UV lamp after jet UV resin using printhead on powder. The hardening of resin is achieved strongly at early time by UV lamp in proposed method. So, the proposed process can fabricate three dimensional objects with high speed without any post-processing.

• Fibers and Polymers
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• 제2권1호
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• pp.152-156
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• 2001

Three different silicone polymer systems, such as aminofunctional, epoxyfunctional, and hydrophilic epoxyfunctional silicone polymers, were applied onto plasma pretreated wool fabric to improve the dimensional properties. The results showed that the plasma pretreatment modified the cuticle surface of the wool fiber and increased the reactivity of wool fabric toward silicone polymers. Felting shrinkage of plasma and silicone treated wool fabric was decreased with different level depending on the applied polymer system. Fabric tear strength and hand were adversely affected by plasma treatment, but these properties were favorably restored on polymer application. Therefore, it has been concluded that the combination of plasma and silicone treatments can achieve the improved dimensional stability, and better performance properties of wool fabric. The surface smoothness appearances of treated fabrics were measured using a new evaluation system, which showed good correspondence with the results of KES-FB4 surface tester.

• 한국재료학회지
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• 제32권11호
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• pp.449-457
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• 2022

Halide perovskites are emerging materials for next-generation display applications, thanks to their narrow emission linewidth and band gap tunability, capable of covering the entire range of visible light. Despite their short period of research, perovskite light emitting diodes (PeLEDs) have shown rapid progress in device external quantum efficiency (EQE) in the near-infrared (NIR), red, and green emission wavelengths, and the record EQE has exceeded over 20 %. However there has been limited progress with blue emission compared to the red and green counterparts. In this review, the current status and challenges of blue PeLEDs are introduced, and strategies to produce spectrally stable blue PeLEDs are discussed. The strategies include 1) a mixed halide system in the form of 3-dimensional (3D) perovskites, 2) colloidal perovskite nanocrystals and 3) low dimensional perovskites, known as quasi-2D perovskites. In the mixed halide system, previous reports based on the compositional engineering of 3D perovskites to reduce spectral instability (i.e., halide segregation) will be discussed. Since spectral instability issue originate from the mixed halide composition in perovskites, the two other strategies are based on enlarging the band gap with a single halide composition. Finally, the prospects for each strategy are discussed, for further improvement in spectrally stable blue PeLEDs.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권3호
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• pp.114-121
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• 2003

Through comparing stress state of TEOS and SiLK-embedded structures, the effect of low-k materials on stress and stress distribution in via-line structures were investigated using three-dimensional finite element analyses. In the case of TEOS-embedded via-line structures, hydrostatic stress was concentrated at the via and the top of the lines, where the void was suspected to nucleate. On the other hand, in the via-line structures integrated with SiLK, large von-Mises stress is maintained at the via, thus deformation of via is expected as the main failure mode. A good correlation between the calculated results and experimentally observed failure modes according to dielectric materials was obtained.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.3-20
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• 1995

Advanced ceramics have excellent thermal resistance, wear resistance, corrosion resistance, and other properties, and are promising materials as structural materials. Over the past decade, they have been applied to some machine parts, for example, glow plugs and turbochargers of automotive engines. In the case where the advanced ceramics are used as these structural parts, te low-dimensional accuracy of sintered bodies requires secondary machining.

• 한국정밀공학회지
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• 제22권9호
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• pp.188-193
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• 2005

To provide the various machining materials with excellent quality and dimensional accuracy, high -speed machining is very useful tool as one of the most effective rapid manufacturing processes. However, high-speed machining is not suitable for microscale thin-walled structures because of the lack of the structure stiffness to resist the cutting force. A new method which is able to make a very thin-walled structure rapidly will be proposed in this paper. This method is composed two processes, high-speed machining and filling process. Strong workholding force comes out of the solidification of filling materials. Low-melting point metal alloys are used in order to minimize the thermal effect during phase change and to hold arbitrary shape thin-walled structures quickly during high-speed machining. To verify the usefulness of this method, we will show some applications, for examples thin -wall cylinders and hemispherical shells, and compare the experimental results to analyze the dimensional accuracy of typical parts of the structures.

• International Journal of Precision Engineering and Manufacturing
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• 제7권3호
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• pp.47-50
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• 2006

High-speed machining is a very useful tool and one of the most effective rapid manufacturing processes. This study sought to produce various high-speed machining materials with excellent quality and dimensional accuracy. However, high-speed machining is not suitable for microscale thin-walled structures because the structure stiffness lacks the ability to resist the cutting force. This paper proposes a new method that is able to rapidly produce very thin-walled structures. This method consists of high-speed machining followed by filling. A strong work-holding force results from the solidification of the filling materials. Low-melting point metal alloys are used to minimize the thermal effects during phase changes and to hold the arbitrarily shaped thin-walled structures quickly during the high-speed machining. We demonstrate some applications, such as thin-walled cylinders and hemispherical shells, to verify the usefulness of this method and compare the analyzed dimensional accuracy of typical parts of the structures.

• 한국초전도ㆍ저온공학회논문지
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• 제25권1호
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• pp.1-5
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• 2023

The study of two-dimensional electron systems with extraordinarily low levels of disorder was, for a long time, the exclusive privilege of the epitaxial thin film research community. However, the successful isolation of graphene by mechanical exfoliation has truly disrupted this field. Furthermore, the assembly of heterostructures consisting of several layers of different 2D materials in arbitrary order by exploiting van der Waals forces has been a game-changer in the field of low-dimensional physics. This technique can be generalized to the large class of strictly 2D materials and offers unprecedented parameters to play with in order to tune electronic and other properties. It has led to a paradigm shift in the field of 2D condensed matter physics with bright prospects. In this review article, we discuss three device fabrication techniques towards high mobility devices: suspended structures, dry transfer, and pick-up transfer methods. We also address state-of-the-art device structures, which are fabricated by the van der Waals pick-up transfer method. Finally, we briefly introduce correlated ground states in the fractional quantum Hall regime.