• 제목/요약/키워드: logdamp

검색결과 1건 처리시간 0.014초

아크릴계 하이솔리드 도료의 경화반응과 도막물성 (Curing Reaction and Physical Properties of Acrylic High-Solid Coatings)

  • 박형진;김성래;정충호;안종일;박홍수;김태옥
    • 한국응용과학기술학회지
    • /
    • 제18권4호
    • /
    • pp.261-272
    • /
    • 2001
  • An ACR/HMMM film was prepared by blending high-solid ACR with curing agent, hexamethoxymethyl melamine (HMMM). An active curing reaction was observed at $170^{\circ}C$. The dynamic viscoelastic $T_{g}$ of the final film increased with the static viscoelastic $T_{g}$ of the film. The log damp value, which means a viscoelastic ratio, decreased with the increase in the curing temperature of the film. Physical properties of the films were within a suitable range for films, and by an accelerated weathering resistance test the films were proved weather resistible ones.