• 제목/요약/키워드: lead-frame

검색결과 335건 처리시간 0.032초

스탬핑 순서가 미치는 미세요소 변형 수치해석 (A numerical deformation analysis of micro elements by stamping orders)

  • 이창희;김용연
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.156-162
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    • 2005
  • In this paper, we study the mechanism of lead deformation by numerically simulating the stamping process by means of a commercial finite element code. It is very important to analyze effects that the lead shape makes on the lead deformation, because the lead shape is often modified in order to minimize the deformation or to increase the buckling critical load of the punch. Therefore the stamping process, first, numerically simulated by considering as a quasi-static problem. Second, the effect on the lead deformation due to the lead shape variation, a linear lead geometry and a bent lead, was numerically analyzed and discussed. Finally, the punching order was optimized fur multi-lead generating stamping process. The results show that the bent lead is little bit more shifted than the linear lead after the punching process. But the bent lead is vertically less deformed than the linear lead. The punching order to successively generate the lead is good to keep the lead space uniform. The results will be very effectively applied for the design of the blanking or punching dies in industry.

상평통보 주조와 복원기술연구 (Study on the Casting Technology and Restoration of "Sangpyong Tongbo")

  • 윤용현;조남철;정영상;임인호
    • 헤리티지:역사와 과학
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    • 제47권4호
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    • pp.224-243
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    • 2014
  • "용재총화", "천공개물", "The Korean Review"등의 고문헌을 통하여 청동유물 제작에 사용된 소재, 거푸집, 합금 등의 주조기술을 확인하였다. 상평통보 복원 주조실험은 "The Korean Review"를 기초한 주물사주조법을 적용하여 황동, 청동 소재의 모전판(母錢版, 鑄錢版)을 제작하였다. 거푸집은 본기(本器)틀과 목틀, 주물사로 구성되는데 본기틀은 주물사를 담는 바깥 틀의 재질에 따라 목틀과 쇠틀로 나뉘며, 주물사는 옅은 황색의 전북 이리사를 사용했다. 주물사주조법으로 상평통보 복원에 사용된 모합금 성분비를 살펴보면, 황동은 "The Korean Review" 기록의 성분비인 Cu 60%, Zn 30%, Pb 10%를 근거로 삼았으며, 실제 복원에는 합금 시 아연과 납이 기화되어 성분비율이 감소될 것을 감안하여 Cu 60%, Zn 35%, Pb 15%로 설정하였다. 청동은 청주시 신봉동유적 출토 해동 통보의 성분비인 Cu 80%, Sn 6%, Pb 14%를 근거로 하였으며, 실제 복원에는 Cu 80%, Sn 11%, Pb 19%로 설정하였다. 주물사주조법에 의한 상평통보 복원은 목재로 부전(父錢)을 먼저 제작하고 목틀과 본기쇠틀을 이용한 거푸집 만들기, 합금, 주조하기, 모전 만들기 등의 과정으로 모전판(母錢版, 鑄錢版)을 복원하였다. 복원된 상평통보의 모합금과 1차 주조, 2차 주조물의 성분분석을 실시한 결과 청동 모합금은 구리는 약 5%가 증가하고 납은 약 4% 손실되었으며, 황동 모합금은 구리는 약 5%가 증가하고 납은 약 4%, 아연은 12%은 감소하여 아연의 손실률이 큰 것을 알 수 있다. 1차, 2차 모전판의 EDS 분석결과 청동 모전판은 1차에 비해 2차에서 납이, 황동 모전판은 아연이 낮게 나온 것은 1차 모전판의 용융과정에서 납과 아연이 기화된 결과로 보인다. 또한 청동과 황동의 모합금과 1차, 2차 주전판의 미세조직에서는 ${\alpha}$상과 크고 작은 납 편석물이 보이고, 황동 모전판에서만 불순물로 보이는 Al, Si 등이 확인되었다.

35 kWh급 초전도 플라이휠 에너지 저장 시스템 프레임 설계 및 제작 (Design and Construction of 35 kWh Class Superconductor Flywheel Energy Storage System Main Frame)

  • 정세용;한영희;박병준;한상철
    • Progress in Superconductivity
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    • 제13권1호
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    • pp.52-57
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    • 2011
  • A superconductor flywheel energy storage system (SFES) is an electro-mechanical battery which transforms electrical energy into mechanical energy for storage, and vice versa. The 35 kWh class SFES is composed of a main frame, superconductor bearings, electro-magnetic dampers, a motor/generator, and a composite flywheel. The energy storing capacity of the SFES can be limited by the operational speed range of the system. The operational speed range is limited by many factors, especially the resonant frequency of the main frame and flywheel. In this study, a steel frame has been designed and constructed for a 35 kWh class SFES. All the main parts, their housings, and the flywheel are aligned and assembled on to the main frame. While in operation, the flywheel excites the main frame, as well as all the parts assembled to it, causing the system to vibrate at the rotating speed. If the main frame is excited at its resonant frequency, the system will resonate, which may lead to unstable levitation at the superconductor bearings and electro-magnetic dampers. The main frame for the 35 kWh class SFES has been designed and constructed to improve stiffness for the stable operation of the system within the operational speed range.

TDR 및 NA를 이용한 Chip Pin Parasitic 추출 (Chip Pin Parasitic Extraction by Using TDR and NA)

  • 이현배;박홍준
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.899-902
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    • 2003
  • Chip Pin Parasitic은 실제 Chip Pad에서부터 Bonding Wire를 통한 Package Lead Frame까지를 의미한다. 여기서, Lead Frame 및 Bonding Wire에서 Inductance 및 작은 저항이 보이고, Chip Pad에서의 Capacitance, 그리고 Pad 부터 Ground까지의 Return Path에서 발생하는 저항이 보인다. 이들을 모두 합하면 L, R, C의 Series로 나타낼 수 있다. 본 논문에서는 이런 Chip Pin Parasitic을 추출 하기 위해서 TDR(Time Domain Reflectometer)과 NA(Network Analyzer)를 사용하였는데, TDR의 경우 PCB를 제작하여 Chip을 Board위에 붙인 후 Time Domain에서 측정 하였고 NA의 경우 Pico Probe를 이용하여 Chip pin에 직접 Probing해서 Smith Chart를 통하여 Extraction 값을 추출했다. 이 경우, NA를 이용한 측정이 좀 더 정확한 Parasitic 값을 추출할 수 있으리라 예상되겠지만, 실제로 Chip이 구동하기 위해서는 Board위에 있을 때의 상황도 고려해야 하기 때문에 TDR 추출 값과 NA 추출 값을 모두 비교하였다.

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반도체 산업의 정밀리드프레임에 대한 프레스 및 금형 변형 예측 (Press and Die Deformation for a Precise Semiconductor Lead Frame)

  • 홍석무;윤여환;엄성욱;황지훈;이동욱
    • 소성∙가공
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    • 제23권4호
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    • pp.206-210
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    • 2014
  • The metal lead frame, a semiconductor component, has product tolerances in micro units as compared to products made with a larger size mold. Therefore, small deflections of the mold and of the press as well as the press molding process itself have a strong influence on accuracy of the product. Hence, it is necessary for the process design to consider the structural response of the mold and the press during deformation. In the current study, the mold deflection and pressure on the punch is examined using the finite element modeling (FEM) program ABAQUS. The results from the simulation were verified with the dynamic deformation measurement equipment using digital image correlation (DIC).

Plating 및 Base metal의 Grain size에 따른 Whisker 성장 영향 분석 (Analysis of the effect on the whisker growth as grain size of plating and base metal)

  • 김수진;장미순;곽계달
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1337-1342
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    • 2008
  • The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

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LED 리드프레임을 위한 Sn-3.5Ag 솔더의 반사율 (Reflectivity of Sn-3.5Ag Solder for LED lead frame)

  • 기세호;;최정범;김원중;정재필
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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    • pp.192-192
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    • 2011
  • 본 연구에서는 LED lead frame을 위한 Sn-3.5Ag 솔더의 젖음 특성과 반사율에 관하여 조사하였다. 금속기판과 액체금속간의 젖음성은 wetting balance tester를 이용하여 평가하였으며, 최대인출력, 최대인출시간 등을 측정하고 표면장력을 계산하였다. Sn-3.5Ag 솔더를 $250{\sim}290^{\circ}C$의 온도에서 젖음성을 측정하였는데 온도가 증가함에 따라 젖음성이 향상되는 것을 확인할 수 있었다. 또한 솔더가 도금된 Cu-coupon의 반사율을 측정하였는데 $270^{\circ}C$에서 가장 높은 반사율을 나타냈다.

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Seismic performance of secondary systems housed in isolated and non-isolated building

  • Kumar, Pardeep;Petwal, Sandeep
    • Earthquakes and Structures
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    • 제16권4호
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    • pp.401-413
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    • 2019
  • The concept of base isolation for equipment is well known. Its application in buildings and structures is rather challenging. Introduction of horizontal flexibility at the base helps in proper energy dissipation at the base level thus reducing the seismic demand of the super structure to be considered during design. The present study shows the results of a series of numerical simulation studies on seismic responses of secondary system (SS) housed in non-isolated and base-isolated primary structures (PS) including equipment-structure interactions. For this study the primary structure consists of two similar single bay three-store reinforced cement concrete (RCC) Frame building, one non-isolated with conventional foundation and another base isolated with Lead plug bearings (LPB) constructed at IIT Guwahati, while the secondary system is modeled as a steel frame. Time period of the base isolated building is higher than the fixed building. Due to the presence of isolator, Acceleration response is significantly reduced in both (X and Y) direction of Building. It have been found that when compared to fixed base building, the base isolated building gives better performance in high seismic prone areas.

Synergetics based damage detection of frame structures using piezoceramic patches

  • Hong, Xiaobin;Ruan, Jiaobiao;Liu, Guixiong;Wang, Tao;Li, Youyong;Song, Gangbing
    • Smart Structures and Systems
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    • 제17권2호
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    • pp.167-194
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    • 2016
  • This paper investigates the Synergetics based Damage Detection Method (SDDM) for frame structures by using surface-bonded PZT (Lead Zirconate Titanate) patches. After analyzing the mechanism of pattern recognition from Synergetics, the operating framework with cooperation-competition-update process of SDDM was proposed. First, the dynamic identification equation of structural conditions was established and the adjoint vector (AV) set of original vector (OV) set was obtained by Generalized Inverse Matrix (GIM).Then, the order parameter equation and its evolution process were deduced through the strict mathematics ratiocination. Moreover, in order to complete online structural condition update feature, the iterative update algorithm was presented. Subsequently, the pathway in which SDDM was realized through the modified Synergetic Neural Network (SNN) was introduced and its assessment indices were confirmed. Finally, the experimental platform with a two-story frame structure was set up. The performances of the proposed methodology were tested for damage identifications by loosening various screw nuts group scenarios. The experiments were conducted in different damage degrees, the disturbance environment and the noisy environment, respectively. The results show the feasibility of SDDM using piezoceramic sensors and actuators, and demonstrate a strong ability of anti-disturbance and anti-noise in frame structure applications. This proposed approach can be extended to the similar structures for damage identification.