• Current Photovoltaic Research
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• v.11 no.1
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• pp.18-26
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• 2023

Tin perovskite solar cells have attracted a lot of attention due to their potential to address the toxicity of lead, which is the biggest barrier to commercialization of perovskite solar cells. Unlike other lead-free perovskite, tin perovskite have a direct bandgap, which is suitable for use as light harvesting, and relatively good stability, which has led to a lot of attention. Since the first tin perovskite solar cell was reported in 2014, it has achieved an impressive power conversion efficiency of 14.81%. However, this efficiency is still low compared to that of lead perovskite solar cells, and the stability of tin perovskite solar cells is also an issue that needs to be addressed. In this review, we will discuss the basic properties of the tin atom in comparison to the lead atom, and then discuss the crystal structure, phase transition, and basic properties of tin perovskite. We will then discuss the advantages, applications, challenges, and strategies of tin perovskite, In particular, we will focus on how to prevent the oxidation of tin, which is arguably the biggest challenge for using tin perovskite solar cells. At the end, we summarize the key factors that need to be addressed for higher efficiency and stability, emphasizing what is needed to commercialize tin perovskite solar cells.

• 보존과학연구
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• s.31
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• pp.131-140
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• 2010

This study shows the comparison of chemical compositions of main component with other bronze bells after the research on the component analysis by non-destructive XRF analysis. There are shrinkage cavities caused by the shrinkage defect and pores with pollutants on Bronze Bell of Heungguksa Temple with gamma radiation images and 77.3% of copper, 8.4% of tin and 10.9% of lead were determined as the main components of it with XRF analysis The tin content of Brozen Bell of Heungguksa Temple is less than those (11~18%) of other bronze bells but the lead content of that is higher. The lead content of it shows 10.91% which is quite high while generally the lead contents of other bells were controlled lower than 2.1%. Buddhist bells have the different lead content according to the period. The lead content was low until Silla Dynasty and Unified Silla period but it has been getting higher since some point of Koryo Dynasty. It is assumed that expensive copper and tin were replaced with lead.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.151-160
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• 2001

The composition and the microstructure of the lead-tin alloy electrodeposited in a gluconate bath were invesitigated according to electrolysis conditions. The tin content of the lead-tin alloy electrodeposits increased with increasing current density and EDTA addition, while it decreased with increasing temperature and sodium gluconate concentration. The preferred orientation of the alloy deposits changed from the (220) plane through (200) to (200) + (111) planes with increasing cathode overpotential. The surface morphology of the films was closely related to both the preferred orientation and the alloy composition.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.46-47
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• 2001

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.45-47
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• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• Economic and Environmental Geology
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• v.34 no.2
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• pp.157-166
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• 2001

Numerous base-metal bearing hydrothermal quartz vein deposits occur in the Hunan province of southern China. The Tangguanpu lead-zinc-tin-silver mine is the major producer among these deposits. Lead-zinc-tin-silver mineralization occurs in a single stage of massive quartz veins which filled fractures in fault zones within Paleozoic metasedimentary rocks. Sphalerite, chalcopyrite, galena, pyrite, arsenopyrite and pyrrhotite are the principal sulphide minerals in the Tangguanpu lead-zinc ores with minor amounts of tin- and antimony-bearing sulphides (stannite, teallite, boulangerite and tetrahedrite). Based on the iron and zinc partitioning between coexisting stannite and sphalerite, the formation temperature for this mineral assemblage range from 300$^{\circ}$ to 330$^{\circ}$C, which relatively agree with the upper part of homogenization temperature of fluid inclusion in quartz (20T-358$^{\circ}$C). Fluid inclusion data show that main lead-zine-tin-silver mineralization occurred from $H_{2}O$-NaCl fluids with relatively low salinities (11.2-7.3 wl.% eg. NaCI) at temperatures between 207$^{\circ}$ and 358$^{\circ}$C. The relationship between homogenization temperature and salinity suggests a history of cooling and dilution followed by initial boiling. Evidence of initial fluid boiling may indicate the fluid trapping pressures of 180 bars. The ${\delta}^{34}S{{\Sigma}S}$ values of -5.0 to 1.1 %, indicate an igneous source of sulfur in the Tangguanpu lead-zinc-tin-silver hydrothermal fluids.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.201-209
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• 2004

As the European Community's Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment banning lead (Pb) in electronics products will take effect on July 1, 2006, most electronics manufacturers will be commencing with volume production of Pb-free components by the middle of 2004. Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Commensurate with this shift will be a somewhat steep learning curve as manufacturers adapt a variety of equipment and processes to contend with the issues surrounding this critical, industry-wide material conversion. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions be made regarding component finish reliability. This paper investigates the properties of electrodeposited tin that may have an effect on component reliability, namely, grain structure (size and shape), oxide formation, tin whisker formation, and solderability. Data will be presented from laboratory and production settings, with the objective being to enable manufacturers to draw their own conclusions regarding previously established perceptions and misconceptions about electrodeposited tin properties.

• Journal of Powder Materials
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• v.10 no.3
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• pp.157-160
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• 2003

Phase contents and elemental composition of ultradispersed powders obtained by the electrical explosion of tin-leadalloy powders are investigated. It is demonstrated that during the explosion and subsequent cooling, surface layers of powder particles are enriched in lead compared to the initial alloy. The thermal stability of powders oxidizing in air is also investigated.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.