• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Journal of Marine Bioscience and Biotechnology
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• v.2 no.2
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• pp.113-119
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• 2007

In this study, we investigated antimicrobial and cytotoxicity effects of Gelidium amansii L., which using methanol, dichloromethane and ethanol were extracted and fractionated into four different types : methanol (GAMM), hexane (GAMH), butanol (GAME) and aqueous (GAMA). The antimicrobial activity was increased in proportion to its concentration by the paper disc method. Among the solvent fractions, The methanol partition layer (GAMM) showed the strongest antimicrobial activities and cytotoxic effects on all cancer cell lines. We also observed quinone reductase (QR) induced effects in all fraction layers of GA on HepG2 cells. The QR induced effects of GAMM on HepG2 cells at $40{\mu}g/mL$ concentration indicated 2.5 with a control value of 1.0.

• Journal of Life Science
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• v.20 no.6
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• pp.877-884
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• 2010

We investigated the growth inhibitory effect of internal organs of Aplysia kurodai (AK) on proliferation in cancer cell lines in vitro. The internal organs of AK were extracted with methanol (AKM), which were then further fractionated into four subfractions by using solvent partition method, resulting in hexane (AKMH), methanol (AKMM), butanol (AKMB), and aqueous (AKMA) soluble fractions. We determined the cytotoxic effect of these four fractions in four kinds of cancer cell lines - HepG2, MCF-7, HT29 and B16-F10 - by MTT assay. Among the four subfractions of AKM, AKMM showed the strongest cytotoxic effects on all cancer cell lines which were used. Morphological changes such as membrane shrinking and blebbing of cells were also observed in AKMM treatment in HepG2 cells. In addition, we also observed quinone reductase (QR) induced effect in the methanol layer (AKMM) of HepG2 cells. AKMM showed the highest induction activity of quinone reductase on HepG2 cells among the partition layers. The QR induced effect of AKMM was determined to be 2.4 at $100\;{\mu}g/ml$ level with a control value of 1.0. Although further studies are needed, the present work suggests that internal organs of Aplysia kurodai (AK) may be a chemopreventive agent for the treatment of human cells.

• Korean Journal of Food Science and Technology
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• v.32 no.3
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• pp.531-537
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• 2000

The simple microgel electrophoresis of single cells, a 'comet assay', on fruit seeds enabled the rapid identification of irradiated fruits by comparing the intact non-irradiated cells and the damaged cells of irradiated fruits. Grapes and plums were irradiated with 0.1, 0.5, 0.7, 1.0 kGy and strawberries, peaches, apples, and nectarines were irradiated with only 1.0 kGy. Seeds were isolated, crushed, and the suspended cells were embedded in an agarose layer. After lysis of the cells, they were subjected to microgel electrophoresis for 2 minutes, and then stained. The DNA radiation-induced fragmentation of all the fruits stretched and migrated out of the cells forming a tail toward the anode giving the appearance of a comet, while the undamaged cells appeared as intact nuclei without tails. Grape and plum seeds irradiated at 0.5 kGy and higher showed significant increases in tail length. With increasing the irradiation doses, longer extention of the DNA from the nucleus toward the anode was observed. Strawberry, peach, apple, and nectarine seeds irradiated with 1.0 kGy also showed the longer tails than non-irradiated ones. DNA comet assay as a rapid and inexpensive screening technique could be an officially validated method for the detection of irradiated fruits.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• Journal of the Korean GEO-environmental Society
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• v.17 no.12
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• pp.55-64
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• 2016

In this paper bearing capacity and safety margin of shallow foundation on weathered soil ground against shear failure by using current design method of allowable stress design (ASD), load resistance factor design (LRFD) based on reliability analysis and partial safety factor design (PSFD) in Eurocode were estimated and compared to each other. Results of the plate loading test used in construction and design were collected and analysis of probability statistics on soil parameters affecting the bearing capacity of shallow foundation was performed to quantify the uncertainty of them and to investigate the resistance bias factor and covalence of ultimate bearing capacity. For the typical sections of shallow foundation in domestic field as examples, reliability index was obtained by reliability analysis (FORM) and the sensitivity analysis on soil parameters of probability variables was performed to investigate the effect of probability variable on shear failure. From stability analysis for these sections by ASD, LRFD with the target reiability index corresponding to the safety factor used in ASD and PSDF, safety margins were estimated respectively and compared.

• Journal of Periodontal and Implant Science
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• v.38 no.sup2
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• pp.373-384
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• 2008

Purpose: The aim of this study is to compare the healing response of various Hydroxyapatite(HA) coated dental implants by Ion-Beam Assisted Deposition(IBAD) placed in the surgically created circumferential gap in dogs. Materials and methods: In four mongrel dogs, all mandibular premolars and the first molar were extracted. After an 8 weeks healing period, six submerged type implants were placed and the circumferential cylindrical 2mm coronal defects around the implants were made surgically with customized step drills. Groups were divided into six groups : anodized surface, anodized surface with 150nm HA and heat treatment, anodized surface with 300nm HA and heat treatment, anodized surface with 150nm HA and no heat treatment, and anodized surface with 150nm HA, heat treatment and bone graft, anodized surface with bone graft. The dogs were sacrificed following 12 weeks healing period. Specimens were analyzed histologically and histomorphometrically. Results: During the healing period, healing was uneventful and implants were well maintained. Anodized surface with HA coating and $430^{\circ}C$ heat treatment showed an improved regenerative characteristics. Most of the gaps were filled with newly regenerated bone. The implant surface was covered with bone layer as base for intensive bone formation and remodeling. In case that graft the alloplastic material to the gaps, most of the coronal gaps were filled with newly formed bone and remaining graft particles. The bone-implant contact and bone density parameters showed similar results with the histological findings. The bone graft group presented the best bone-implant contact value which had statistical significance. Conclusion: Within the scope of this study, nano-scale HA coated dental implants appeared to have significant effect on the development of new bone formation. And additional bone graft is an effective method in overcoming the gaps around the implants.

• Korean Chemical Engineering Research
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• v.40 no.6
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• pp.659-663
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• 2002

The crystallization of NaF driven by adding ethanol was monitored using quartz crystal analyzer (QCA). Adding ethanol to NaF solution reduced the solubility of NaF and consequently led to nucleation and growth of NaF crystals. To investigate the crystallization behavior of NaF, a gold electrode of QCA was modified by anchoring with 2-mercaptoethylamine hydrochloride based on a self-assembly method. Frequency of QCA varied with the amount of NaF adsorbed on the self-assembled layer of 2-mercaptoethylamine hydrochloride, and thereby the process of NaF crystallization could be analyzed indirectly by monitoring the frequency change of QCA. To change the extent of supersaruration of NaF, the amount of ethanol added to the solution was varied from 1 to 5 ml. Then, the effect of the extent of the supersaturation on the crystallization was examined by analyzing the frequency changes of QCA coated with 2-mercaptoethylamine hydrochloride. It was shown that the QCA technique could be well applied for the characterization and analysis of the crystallization behavior of NaF.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.11A
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• pp.1027-1034
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• 2005

IEEE802.15.4a, which is started to realize the PHY layer including high precision ranging/positioning and low data rate communication functions, requires a simple and low power consumable transceiver architecture. To satisfy this requirements, the simple noncoherent on-off keying (OOK) UWB transceiver with the parallel energy window banks (PEWB) giving high precision signal processing interface is proposed. The flexibility of the proposed system in multipath fading channel environments is acquired with the pulse and bit repetition method. To analyze the bit error rate (BER) performance of this proposed system, a noise model in receiver is derived with commonly used random variable distribution, chi-square. BER of $10^{-5}$ under the line-of-sight (LOS) residential channel is achieved with the integration time of 32 ns and signal to noise ratio (SNR) of 15.3 dB. For the non-line-of-sight (NLOS) outdoor channel, the integration time of 72 ns and SNR of 16.2 dB are needed. The integrated energy to total received energy (IRR) for the best BER performance is about $86\%$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.