• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.54-54
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• 2003

MgO layer는 POP 패빌 내 유전증을 이온의 스퍼터링으로부터 보호하여 주며, 또한 높은 이차 전자 밤출 계수의 특성을 가지고 있어 구동 및 유지 전압을 낮춰 주는 역할을 한다. 그러나. MgO layer는 $H_20,{\;}CO_2,{\;}N_2,{\;}0_2$ 그리고 $H_2$와 같은 불순물 들을 쉽게 를착하는 단점이 있어, PDP의 특성 및 수명 단축에 영향을 줄 수 있다. 따라서, 본 연구에서는 atmospheric pressure plasma cleaning 과 low pressure i inductively coupled plasma (ICP) cleaning 처리에 의하여, 보호층으로 사용이 되는 MgO layer의 outgassing 특성을 조사하고자 한다. plasma cleaning에 의한 MgO layer 표면의 roughness와 불순물의 변화를 알아보기 위 하여 atomic force microscopy(AFM)과 x-ray p photoelectron spectroscopy(XPS)를 이용하여 측정 하였다. 또한, outgassing의 특성을 분석하기 위하여 MgO layer를 $400^{\circ}C$ 까지 온도를 가하여 온도에 따른 outgassing의 특성을 quadrupole mass spectrometer(QMS)를 이용하여 알아보았다. atmospheric pressure plasma cleaning 에서는 $He/O_2/Ar/N_2$의 gas를 사용하였으며, low pressure ICP cleaning 에 서는 Ar의 gas를 사용하였다. atmospheric pressure plasma cleaning는 low pressure ICP C cleaning과 비교해 더 낮은 outgassing을 관잘 할 수 있었으나. MgO 표면의 roughness는 low pressure ICP cleaning 후 더 낮은 것을 알 수 있었다. 또한 $He/O_2/Ar/N_2$의 gas를 사용 한 atmospheric pressure plasma cleaning 과 $Ar/O_2$의 gas를 사용한 ICP cleaning에서 이 차전자방출계수(SEEC)가 약 1.5~2.5배 증가된 것을 알 수 있었다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.3
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• pp.73-84
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• 2002

Fast and accurate new capacitance determination methodology for non-uniform complicated multi-layer VLSI interconnects is presented. Since a capacitance determination of intricate multi-layer interconnects using 3-dimensional field-solver is not practical, quasi-3-dimensional methodology is presented. Interconnects with discontinuity (i.e., bend structure and different spacing between lines, etc.) are partitioned. Then, each partial capacitance of divided parts is extracted by using 2-dimensional extraction methodology. For a multi-layer interconnects with shielding layer, the system can be simplified by investigating a distribution of charge in it. Thereby, quasi-3-dimensional capacitance for multi-layer interconnects can be determined by combining solid-ground based 2-dimensional capacitance and shielding effect which is independently determined with layout dimensions. This methodology for complicated multi-layer interconnects is more accurate and cost-efficient than conventional 3-dimensional methodology It is shown that the quasi-3-dimensional capacitance methodology has excellent agreement with 3-dimensional field- solver-based results within 5% error.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.2
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• pp.177-184
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• 1996

We adopted the $Pt/SiO_{2}/Si$ and the $Ir/SiO_{2}/Si$ substrates of which buffer layer is $PbTiO_{3}$ to improve electrode and interfacial properties of PZT thin film deposited by reactive sputtering method using metal target in this study. We got PZT thin film to have highly oriented(100) structure and good crystallinity using buffer layer in Pt bottom-electrode, though randomly oriented PZT thin film was obtained without buffer layer. Although great improvement of PZT phase formation on Ir bottom-electrode with buffer layer was not observed, we observed the increase of remennant polarization and the decrease of coercive field compared with properties of PZT thin films on the Pt bottom-electrode. So we got the results of the increase of dielectric constant using buffer layer on fabrication of PZT thin film and the better dielectric properties in PZT thin film using Ir bottom-electrode compared with that using Pt bottom-electrode.

• Progress in Superconductivity
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• v.7 no.2
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• pp.120-129
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• 2006

We comparatively studied the epitaxial growth conditions of $CeO_2$ and $Y_2O_3$ thin buffers on textured Ni tapes using rf magnetron sputtering and investigated the feasibility of getting a single mixture layer or sequential layers of $CeO_2$ and $Y_2O_3$ for more simplified buffer architecture. All the buffer layers were first deposited using the reducing gas of $Ar/4%H_2$ and subsequently the reactive gas mixture of Ar and $O_2$, The crystalline quality and biaxial alignment of the films were investigated using X-ray diffraction techniques (${\Theta}-2{\Theta},\;{\phi}\;and\;{\omega}\;scans$, pole figures). The $CeO_2$ single layer exhibited well developed (200) epitaxial growth at the condition of $10%\;O_2$ below an $450^{\circ}C$, but the epitaxial property was decreased with increasing the layer thickness. $Y_2O_3$ seldom showed optimum condition for (400) epitaxial growth. The sequential architecture of $CeO_2/Y_2O_3/CeO_2$ having good epitaxial property was achieved by sputtering at a temperature of $700^{\circ}C$ on the initial $CeO_2$ bottom layer sputtered at $400^{\circ}C$. Cracking of the sputtered buffer layers was seldom observed except the double layer structure of $CeO_2/Y_2O_3$.

• Korean Journal of Materials Research
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• v.11 no.11
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• pp.1001-1005
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• 2001

In this study, the surface of 40Cr steel was hardened by $CO_2$Laser, and then the microstructural transformations and the hardness distributions of the laser surface hardened layer were observed. The experimental results showed the surface hardening layer was consisted of three parts, which is outmost surface layer of needle martensite, middle layer of martensite and remained pearlite, and transitory boundary layer. In hardness distributions, the surface hardeness of the surface hardening layer had Hv 800~1000, that was 2 to 4 times of matrix's hardness. The hardeness distribution of laser hardening layer that of surface layer hardened by general heat treatment.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.163-163
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• 2012

차세대 모바일용 전자디스플레이로 각광받고 있는 FOLED (flexible organic light emitting display)의 연구에서 display의 신뢰성과 수명은 매우 중요한 연구 테마이다. OLED의 수명단축에 영향을 미치는 요소는 수분에 의한 열화가 가장 치명적이다. Barrier layer를 통한 수분의 주요 침투경로는 pin-hole과 void 등과 같은 defect에 의한 것으로 보인다. 수분의 침투 경로를 제어하는 OLED용 barrier layer의 요구조건은 WVTR (water vapor transmission rate)이 $10^{-6}g/m^2{\cdot}day$ 이하로 낮아야 한다. Barrier layer가 가져야 할 핵심적인 조건은 유연성을 가지면서 동시에 WVTR 값이 매우 낮아야 하는데, 아직까지 이를 만족하는 barrier layer의 개발은 아직 덜된 실정이다. 본 연구에서는 PET (polyethylene terephthalate) 기판에 sputtering법으로 barrier layer를 제조하였다. 증착에 이용한 타겟은 두가지 종류인 Al과 $Al_2O_3$를 사용하였으며, 다층박막으로 제조하였다. 제조된 barrier layer의 수분침투 특성은 WVTR의 측정으로, 유연성의 평가는 in-situ fatigue test를 수행하여 측정하였다. 종합적인 특성 평가를 위하여 SEM과 AFM (atomic force microscope) 관찰도 하였다.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.269-271
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• 2003

A typical HTS power transmission cable has multi-layer conductor structure to increase the current capacity. The tapes of the innermost layer are wound on a round former, and adjacent tapes of another layer are separated by a thin insulating film. In steady state, the total current flows in the conductor layer, and consequently there is magnetic field between the inner and outer layer. This paper describes a magnetic field amplitude around the conductor layer and the HTS tape by a transport current. Also, this paper will help for future cable conductor prototypes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.77-80
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• 1999

Bi$_2$Sr$_2$CuO$\sub$x/ thin films have been fabricated by atomic layer-by-layer deposition using ion beam sputtering(IBS) method. XRD and RHEED investigations reveal that a buffer layer with compositions different from Bi-2201 is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.212-217
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• 2000

Bi$_2$Sr$_2$CuO$_{x}$(Bi-2201) thin films have been fabricated by atomic layer-by-layer deposition using ion beam sputtering(IBS) process. During the deposition, 14 wt%-ozone/oxygen mixture gas of typical pressure of 5.0$\times$10$^{-5}$ Torr is supplied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal that a buffer layer with compositions different from Bi-2201 is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.n.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1356-1361
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• 2004

High temperature superconducting coated conductor has a structure of ///. The buffer layer consists of multi-layer, this study reports the deposition method and optimal deposition conditions of YSZ(Yttria-stabilized zirconia) layer which plays a important part in preventing the elements of substrate from diffusing into the superconducting layer. YSZ layer was deposited by DC reactive sputtering technique using water vapor for oxidizing deposited elements on substrate. To investigate optimal thickness of YSZ film, four YSZ/CeO$_2$/Ni samples with different YSZ thickness(130 nm, 260 nm, 390 nm, and 650 nm) were prepared. The SEM image showed that the surface of YSZ layer was getting to be rougher as YSZ layer was getting thicker and the growth mode of YSZ layer was columnar grain growth. After CeO$_2$ layer was deposited with the same thickness of 18.3 nm on each four samples, YBCO layer was deposited by PLD method with the thickness of 300 nm. The critical currents of four samples were 0, 6 A, 7.5 A, and 5 A respectively. This shows that as YSZ layer is getting thicker, YSZ layer plays a good role as a diffusion barrier but the surface of YSZ layer is getting rougher.