• Title/Summary/Keyword: laser slit beam

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The Alignment of Measuring Data using the Pattern Matching Method (패턴매칭을 이용한 형상측정 데이터의 결합)

  • 조택동;이호영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.307-310
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    • 2000
  • The measuring method of large object using the pattern matching is discussed in the paper. It is hard and expensive to get the complete 3D data when the object is large or exceeds the limit of measuring devices. The large object is divided into several smaller areas and is scanned several times to get the data of all the pieces. These data are aligned to get the complete 3D data using the pattern matching method. The point pattern matching method and transform matrix algorithm are used for aligning. The laser slit beam and CCD camera is applied for experimental measurement. Visual C++ on Window98 is implemented in processing the algorithm.

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Automatic Recognition of In-Process mold Dies Based on Reverse Engineering Technology (형상 역공학을 통한 공정중 금형 가공물의 자동인식)

  • 김정권;윤길상;최진화;김동우;조명우;박균명
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.10a
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    • pp.420-425
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    • 2003
  • Generally, reverse engineering means getting CAD data from unidentified shape using vision or 3D laser scanner system. In this paper, we studied unidentified model by machine vision based reverse engineering system to get information about in-processing model. Recently, vision technology is widely used in current factories, because it could inspect the in-process object easily, quickly, accurately. The following tasks were mainly investigated and implemented. We obtained more precise data by corning camera's distortion, compensating slit-beam error and revising acquired image. Much more, we made similar curves or surface with B-spline approximation for precision. Until now, there have been many case study of shape recognition. But it was uncompatible to apply to the field, because it had taken too many processing time and has frequent recognition failure. This paper propose recognition algorithm that prevent such errors and give applications to the field.

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The Merging Method of Point Data with Point Pattern Matching in 3D Measurement (3차원 형상측정에서 점 패턴매칭을 이용한 점 데이터의 결합방법)

  • 조택동;이호영;양상민
    • Journal of Institute of Control, Robotics and Systems
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    • v.9 no.9
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    • pp.714-719
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    • 2003
  • We propose a measuring method of large object using the pattern matching. It is hard and expensive to get the complete 3D data when the object is large and exceeds the limit of measuring devices. The large object is divided into several smaller areas and is scanned several times to get the data of all the pieces. These data are aligned to get the complete 3D data using the pattern matching method such as point pattern matching method and transform matrix algorithm. The laser slit beam and CCD camera are applied for the experimental measurement. Visual C++ on Windows 98 is implemented in processing the algorithm.

Unoccluded Cylindrical Object Pose Measurement Using Least Square Method (최소자승법을 이용한 가려지지 않은 원통형 물체의 자세측정)

  • 주기세
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.7
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    • pp.167-174
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    • 1998
  • This paper presents an unoccluded cylindrical object pose measurement using a slit beam laser in which a robot recognizes all of the unoccluded objects from the top of jumbled objects, and picks them up one by one. The elliptical equation parameters of a projected curve edge on a slice are calculated using LSM. The coefficients of standard elliptical equation are compared with these parameters to estimate the object pose. The hamming distances between the estimated coordinates and the calculated ones are extracted as measures to evaluate a local constraint and a smoothing surface curvature. The edges between slices are linked using error function based on the edge types and the hamming distances. The linked edges on slices are compared with the model object's length to recognize the unoccluded object. This proposed method may provide a solution to the automation of part handling in manufacturing environments such as punch press operation or part assembly.

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Use of a grating and a plane parallel glass plate for determinimg the refractive index of a lens (회절격자와 층밀리기 간섭기술을 이용한 렌즈 굴절률 측정)

  • 이윤우;조현모;이인원
    • Korean Journal of Optics and Photonics
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    • v.3 no.1
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    • pp.16-19
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    • 1992
  • The Fourier transform spectra of a grating have been employed to determine the refractive index of a simple lens. The shearing interferometric technique is used for collimation testing of the expanded laser beam and for determining the exact focal plane. The slit attached to micro X-Y translator has been used to measure the distance between two sucessive diffraction orders in the back focal plane of the test lens. The experimental equipment is described and results are presented.

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Laser-induced chemical vapor deposition of micro patterns for TFT-LCD circuit repair (레이저 국소증착을 이용한 TFT-LCD 회로수정 패턴제조)

  • Park Jong-Bok;Jeong Sungho;Kim Chang-Jae;Park Sang-Hyuck;Shin Pyung-Eun;Kang Hyoung-Shik
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.657-662
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    • 2005
  • In this study, the deposition of micrometer-scale metallic interconnects on LCD glass for the repair of open-circuit type defects is investigated. Although there had been a few studies Since 1980 s for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and $W(CO)_6$ was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled between $3\~50{\mu}$ using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below 1 $O\cdot{\mu}m$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

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Laser-induced chemical vapor deposition of tungsten micro patterns for TFT-LCD circuit repair (레이저 국소증착을 이용한 TFT-LCD회로 수정5 미세 텅스텐 패턴 제조)

  • Park Jong-Bok;Kim Chang-Jae;Park Sang-Hyuck;Shin Pyung-Eun;Kang Hyoung-Shik;Jeong Sung-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.8 s.173
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    • pp.165-173
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    • 2005
  • This paper presents the results for deposition of micrometer-scale metal lines on glass for the development of TFT-LCD circuit repair-system. Although there had been a few studies in the late 1980's for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and W(CO)s was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 m depending on laser power and scan speed while the width was controlled between 50um using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below $1{\Omega}{\cdotu}um$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

High power tunable Ti:sapphire laser with sub-40fs pulsewidth (40펨토초 미만 펄스폭의 고출력 파장가변 티타늄사파이어 레이저)

  • 임용식;노영철;이기주;김대식;장준성
    • Korean Journal of Optics and Photonics
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    • v.10 no.5
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    • pp.430-438
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    • 1999
  • We have utilized soft-aperturing by gain media to develop a high-power tunable Ti:Sapphire laser with sub-40-fs and broad tuning range. The tunable spectral range was only limited by the bandwidth of mirrors. We made use of knife-edge slits near an intra-cavity prism controlled by micro-stepping-motors to tune the center wavelength continuously. The tunability of the center wavelength was ranged from 770 nm to 870 nm, and the measured pulsewidth was sub-40 fs throughout the above spectral range. The shortest pulsewidth was about 17 fs at the center wavelength of 820 nm and the spectral bandwidth was 72 nm. At 5 W pumping power of the Ar-ion laser we obtained average output power of 440 mW~580 mW. For the cw and Kerr-lens mode-lodking conditions, we have evaluated the value of an amplitude modulation to be ${\gamma}=2.5{\times}10^{-8}/W$ from the calculated waists of a Gaussian beam on the Ti:sapphire crystal surface. Using this result we demonstrate that the generation of sub-40-fs Kerr-lens mode-locked pulse can be described by the Ginzberg-Landau model which is a weak pulse shaping model.

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Breakage Detection of Small-Diameter Tap Using Vision System in High-Speed Tapping Machine with Open Architecture Controller

  • Lee, Don-Jin;Kim, Sun-Ho;Ahn, Jung-Hwan
    • Journal of Mechanical Science and Technology
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    • v.18 no.7
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    • pp.1055-1061
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    • 2004
  • In this research, a vision system for detecting breakages of small-diameter taps, which are rarely detected by the indirect in-process monitoring methods such as acoustic emission, cutting torque and motor current, was developed. Two HMI (Human Machine Interface) programs to embed the developed vision system into a Siemens open architecture controller, 840D, were developed. They are placed in sub-windows of the main window of the 840D and can be activated or deactivated either by a softkey on the operating panel or the M code in the NC part program. In the event that any type of tool breakage is detected, the HMI program issues a command for an automatic tool change or sends an alarm signal to the NC kernel. An evaluation test in a high-speed tapping machine showed that the developed vision system was successful in detecting breakages of small-diameter taps up to M1.

An implementation of 2D/3D Complex Optical System and its Algorithm for High Speed, Precision Solder Paste Vision Inspection (솔더 페이스트의 고속, 고정밀 검사를 위한 이차원/삼차원 복합 광학계 및 알고리즘 구현)

  • 조상현;최흥문
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.41 no.3
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    • pp.139-146
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    • 2004
  • A 2D/3D complex optical system and its vision inspection algerian is proposed and implemented as a single probe system for high speed, precise vision inspection of the solder pastes. One pass un length labeling algorithm is proposed instead of the conventional two pass labeling algorithm for fast extraction of the 2D shape of the solder paste image from the recent line-scan camera as well as the conventional area-scan camera, and the optical probe path generation is also proposed for the efficient 2D/3D inspection. The Moire interferometry-based phase shift algerian and its optical system implementation is introduced, instead of the conventional laser slit-beam method, for the high precision 3D vision inspection. All of the time-critical algorithms are MMX SIMD parallel-coded for further speedup. The proposed system is implemented for simultaneous 2D/3D inspection of 10mm${\times}$10mm FOV with resolutions of 10 ${\mu}{\textrm}{m}$ for both x, y axis and 1 ${\mu}{\textrm}{m}$ for z axis. Experiments conducted on several nBs show that the 2D/3D inspection of an FOV, excluding an image capturing, results in high speed of about 0.011sec/0.01sec, respectively, after image capturing, with $\pm$1${\mu}{\textrm}{m}$ height accuracy.