• 제목/요약/키워드: laser principles

검색결과 60건 처리시간 0.019초

Laser Cleaning : Introduction and Applications

  • Lee, Jong-Myoung;Ken Watkins
    • 한국레이저가공학회지
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    • 제3권1호
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    • pp.2-11
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    • 2000
  • Laser cleaning has begun to attract a considerable amount of interest recently as a new cleaning technique among scientists and engineers. The unique characteristics of laser cleaning are currently finding successful applications in industry, in medicine as well as in the world of art conservation. This paper takes an overview of the laser cleaning technique itself including basic principles and characteristics, and provides an account of current trends especially with regard to practical applications. Experience with its successful applications in various fields shows that laser cleaning may be about to emerge as a real alternative to conventional cleaning methods.

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레이저 유기 충격파를 이용한 웨이퍼 표면 미소입자 제거 (Removal of small particles from silicon wafers using laser-induced shock waves)

  • 이종명;조성호
    • 한국레이저가공학회지
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    • 제5권2호
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    • pp.9-15
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    • 2002
  • Basic principles and unique characteristics of laser-induced shock cleaning have been described compared to a conventional laser cleaning method and the removal of small tungsten particles from silicon wafer surfaces was attempted using both methods. It was found that the conventional laser cleaning was not feasible to remove the tungsten particles whereas a successful removal of the particles was carried out by the laser-induced shock waves. From the quantitative analysis using a surface scanner, the average removal efficiency of the particles was more than 98% where smaller particles were slightly more difficult to remove probably due to the increased adhesion force with a decrease of the particle size. It was also seen that the gap distance between the laser focus and the wafer surface is an important processing parameter since the removal efficiency is strongly dependent on the gap distance.

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레이저 마이크로 솔더링과 솔더링 인자 (Laser Micro Soldering and Soldering Factors)

  • 황승준;황성빈;정재필
    • 마이크로전자및패키징학회지
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    • 제27권3호
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    • pp.1-8
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    • 2020
  • In this paper, the principles, characteristics and recent studies of the laser micro soldering are reviewed. The factors which influence laser micro welding and soldering are also included. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled laser beam. In recent electronics industry, the demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro-joint. In laser soldering, there are several important factors like laser absorption, laser power, laser scanning speed, and etc, which affect laser solderability. The laser absorption ratio depends on materials, and each material has different absorption or reflectivity for the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance, and these are also reviewed.

레이저 마이크로 접합 및 솔더링 (Laser Micro-Joining and Soldering)

  • 황승준;강혜준;김정오;정재필
    • 마이크로전자및패키징학회지
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    • 제26권3호
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    • pp.7-13
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    • 2019
  • In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

반도체 레이저로 펌핑하는 Nd:YAG 레이저의 내부 발생형 제2차 고조파의 On-Off간헐성 (On-off intermittency in an intracavity frequency doubled Nd:YAG laser pumped by a laser diode)

  • 김규욱;추한태;김동익;박영재;김칠민
    • 한국광학회지
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    • 제13권1호
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    • pp.73-78
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    • 2002
  • 반도체 레이저로 펌핑하는 Nd:YAG 레이저의 내부 발생형 제2차 고조파 발진 문턱 근처에서의 출력 특성을 조사하였다. 라미나 상태에 대한 분석을 통하여 제2차 고조파가 on-off간헐성을 통하여 발진한다는 것을 확인할 수 있었다. 이러한 간헐적인 특성은 비율 방정식을 이용한 수치해석에서도 볼 수 있었다.

LASER에 관한 문헌 고찰 (A study on physiotherapy of a study on laser therapy)

  • 강홍순
    • The Journal of Korean Physical Therapy
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    • 제3권1호
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    • pp.211-220
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    • 1991
  • The relief of pain by laser therapy in useful in the treatment of ulcers burn, tenosynovitis, tendinitis, bursitis, neuritis, rheumatism, chilblains, herpes, zoster. The degenerative cells probiferate to replace by the active vigorous cells by laser rays and suppressed the growth of cell in pathological lesion or condition laser rays promote healing by stimulating growth of celt or tissue The purpose of this study was to introduce about the principles of therapeutic laser ray, characteristics, indication, contraindication, technique, therapeutic effect or clinical effect throughout refference books. The author believe that therapeutic laser rays will contribute grently toward over coming the difficulties of physical therapy.

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레이저 후두미세수술의 원칙 (Principles of Laser Laryngeal Microsurgery)

  • 문정환;이상준;정필상
    • 대한후두음성언어의학회지
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    • 제24권1호
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    • pp.13-17
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    • 2013
  • Laser laryngeal microsurgery is currently the primary method of treatment of various laryngeal diseases. The development of laryngeal microsurgery came from the introduction of a small spot $CO_2$ laser micromanipulator and more precise microlaryngeal instruments. $CO_2$ laser laryngeal microsurgery has enabled very precise surgery because it has small focus size and hemostatic effect. There are some limitations to the use of the $CO_2$ Laser such as adjacent tissue damage and vocal fold scarring. These problems can be minimized through understanding the mechanisms by which lasers function and correctly manipulating the parameters under a surgeon's control. We should also recognize the safety of $CO_2$ laser for the surgeon to precisely perform the procedure.

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An Overview of Laser-assisted Bioprinting (LAB) in Tissue Engineering Applications

  • Ventura, Reiza Dolendo
    • Medical Lasers
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    • 제10권2호
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    • pp.76-81
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    • 2021
  • Biological tissues and organs are composed of different arrays of cells, biochemical cues, and extracellular matrices arranged in a complex microarchitecture. Laser-Assisted Bioprinting (LAB) is an emerging and promising technology that is reproducible with high accuracy that can be used for fabricating complex bioengineered scaffolds that mimic tissues and organs. The LAB process allows researchers to print intricate structural scaffolds using cells and different biomaterials essential for facilitating cell-scaffold interaction and to induce tissue and organ regeneration which cannot be achieved in a traditional scaffold fabrication. This process can fabricate artificial cell niches or architecture without affecting cellular viability and material integrity. This review tackles the basic principles and key aspects of Laser-Assisted Bioprinting. Recent advances, limitations, and future perspectives are also discussed.